Patents by Inventor William Michael SPITZIG

William Michael SPITZIG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Chemical mechanical planarization pads via vat-based production
    Patent number: 11845157
    Abstract: A chemical mechanical polishing (CMP) pad includes a polishing portion formed using a vat-based additive manufacturing process. The polishing portion includes a polymer material with a first elastic modulus. In some embodiments the polishing portion is disposed on the backing portion. The backing portion may have a second elastic modulus. The second elastic modulus may be less than the first elastic modulus.
    Type: Grant
    Filed: May 7, 2020
    Date of Patent: December 19, 2023
    Assignee: CMC MATERIALS, INC.
    Inventors: Eric S. Moyer, Lin Fu, William Michael Spitzig, Chen-Chih Tsai, Ping Huang, Justin Stewart, Carlos Barros
  • CHEMICAL MECHANICAL PLANARIZATION PADS VIA VAT-BASED PRODUCTION
    Publication number: 20200353586
    Abstract: A chemical mechanical polishing (CMP) pad includes a polishing portion formed using a vat-based additive manufacturing process. The polishing portion includes a polymer material with a first elastic modulus. In some embodiments the polishing portion is disposed on the backing portion. The backing portion may have a second elastic modulus. The second elastic modulus may be less than the first elastic modulus.
    Type: Application
    Filed: May 7, 2020
    Publication date: November 12, 2020
    Inventors: Eric S. MOYER, Lin FU, William Michael SPITZIG, Chen-Chih TSAI, Ping HUANG, Justin STEWART, Carlos BARROS