Patents by Inventor William Oberlin

William Oberlin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11201752
    Abstract: Disclosed herein is a technique for a connection from an Ethernet physical transceiver (PHY) to an integrated connector module (ICM) where the connection and the ICM lack a common mode choke. The ICM can include a magnetic coupler that directly couples an Ethernet jack and the PHY.
    Type: Grant
    Filed: December 19, 2016
    Date of Patent: December 14, 2021
    Assignee: CISCO TECHNOLOGY, INC.
    Inventors: George Edward Curtis, William Oberlin, Chris Desiniotis, Amrik Singh Bains
  • Publication number: 20180175675
    Abstract: Disclosed herein is a technique for a connection from an Ethernet physical transceiver (PHY) to an integrated connector module (ICM) where the connection and the ICM lack a common mode choke. The ICM can include a magnetic coupler that directly couples an Ethernet jack and the PHY.
    Type: Application
    Filed: December 19, 2016
    Publication date: June 21, 2018
    Inventors: George Edward Curtis, William Oberlin, Chris Desiniotis, Amrik Singh Bains
  • Patent number: 8398424
    Abstract: A device includes an elongated strap, a latch structure connected to the strap and configured to receive and secure a portion of the strap within the latch structure when an end of the strap is inserted through an opening of the latch, and a clamping structure secured to the strap. The clamping structure includes a flexible ring member with two free ends that are separable from each other to define a gap between the two free ends and are further configured to be drawn toward each other such that one free end overlaps the other free end, and a locking mechanism that is operable by a user to selectively compress the ring member so as to secure a portion of at least one power cord within the ring member.
    Type: Grant
    Filed: September 2, 2011
    Date of Patent: March 19, 2013
    Assignee: Cisco Technology, Inc.
    Inventors: Samir Vasavda, Edward Kliewer, George Curtis, Kenneth R. Martin, William Oberlin
  • Publication number: 20050097249
    Abstract: Memory systems and methods are described. In one embodiment, a circuit board has front and back surfaces. At least one memory device having a plurality of pins is mounted on the front surface of the circuit board. At least one other memory device having a plurality of pins is mounted on the back surface of the circuit board. The memory devices are mounted on the circuit board such that at least some pins from the one memory device align with at least some pins of the other memory device to provide aligned pin pairs. A via is disposed in the circuit board and extends between and connects individual pins of an aligned pin pair.
    Type: Application
    Filed: November 4, 2003
    Publication date: May 5, 2005
    Inventors: William Oberlin, Mark Simpson, Srinivas Venkataraman