Patents by Inventor William P. Kostenko

William P. Kostenko has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and apparatus for providing positive contact force in an electrical assembly
    Patent number: 6921272
    Abstract: An electrical contact assembly includes a first module having a first set of electrical contacts, a second module having a second set of electrical contacts, a shape-generating module, and a clamping arrangement. The second set of electrical contacts is aligned with the first set of electrical contacts and the shape-generating module is arranged to impart a shape to the second module such that the second set of electrical contacts is driven toward the first set of electrical contacts. The clamping arrangement is arranged to clamp the first, the second, and the shape-generating modules together, thereby resulting in a positive contact force between the first and second sets of electrical contacts. The positive contact force is equal to or greater than a predefined value.
    Type: Grant
    Filed: May 12, 2003
    Date of Patent: July 26, 2005
    Assignee: International Business Machines Corporation
    Inventors: John S. Corbin, Jr., William P. Kostenko, John J. Loparco, Budy D. Notohardjono, John G. Torok
  • Separable hybrid cold plate and heat sink device and method
    Patent number: 6829145
    Abstract: An apparatus and method of cooling of an electronic module. The apparatus and method include a heat sink thermally coupled to the module, and a fastener configured to alter a clamping force therebetween as a result of the heat sink and the module formed of materials having a higher coefficient of thermal expansion (CTE) than the fastener.
    Type: Grant
    Filed: September 25, 2003
    Date of Patent: December 7, 2004
    Assignee: International Business Machines Corporation
    Inventors: Joseph P. Corrado, Gary F. Goth, Randall G. Kemink, William P. Kostenko, Budy D. Notohardjono
  • Method and apparatus for providing positive contact force in an electrical assembly
    Publication number: 20040229481
    Abstract: An electrical contact assembly includes a first module having a first set of electrical contacts, a second module having a second set of electrical contacts, a shape-generating module, and a clamping arrangement. The second set of electrical contacts is aligned with the first set of electrical contacts and the shape-generating module is arranged to impart a shape to the second module such that the second set of electrical contacts is driven toward the first set of electrical contacts. The clamping arrangement is arranged to clamp the first, the second, and the shape-generating modules together, thereby resulting in a positive contact force between the first and second sets of electrical contacts. The positive contact force is equal to or greater than a predefined value.
    Type: Application
    Filed: May 12, 2003
    Publication date: November 18, 2004
    Applicant: International Business Machines Corporation
    Inventors: John S. Corbin, William P. Kostenko, John J. Loparco, Budy D. Notohardjono, John G Torok
  • High density modular input/output package in a data processing system
    Patent number: 6785133
    Abstract: An I/O subsystem for providing a high density modular input/output package in a data processing system. The I/O subsystem includes an enclosure having a midplane assembly in the center portion. The enclosure includes electrical components including redundant power supplies, air moving units and DASD carriers having DASD drives assemblies therein in the front portion of the enclosure, and planar boards having PCI card assemblies slidably mounted thereon in the rear portion of the enclosure. The mid plane includes multiconductor power buses for distribution of power from the power supplies to the electrical components of the I/O subsystem.
    Type: Grant
    Filed: September 27, 2002
    Date of Patent: August 31, 2004
    Assignee: International Business Machines Corporation
    Inventors: Dennis R. Barringer, Philip M. Corcoran, William P. Kostenko, Edward J. Seminaro
  • High density modular input/output package in a data processing system
    Publication number: 20040062002
    Abstract: An I/O subsystem for providing a high density modular input/output package in a data processing system. The I/O subsystem includes an enclosure having a midplane assembly in the center portion. The enclosure includes electrical components including redundant power supplies, air moving units and DASD carriers having DASD drives assemblies therein in the front portion of the enclosure, and planar boards having PCI card assemblies slidably mounted thereon in the rear portion of the enclosure. The mid plane includes multiconductor power buses for distribution of power from the power supplies to the electrical components of the I/O subsystem.
    Type: Application
    Filed: September 27, 2002
    Publication date: April 1, 2004
    Applicant: International Business Machines Corporation
    Inventors: Dennis R. Barringer, Philip M. Corcoran, William P. Kostenko, Edward J. Seminaro