Abstract: A micro-electromechanical systems (MEMS) device is described which includes a substrate having at least one anchor, a proof mass having either of at least one deceleration extension extending from the proof mass or at least one deceleration indentation formed in the proof mass, a motor drive comb, and a motor sense comb. The MEMS device further includes a plurality of suspensions configured to suspend the proof mass over the substrate and between the motor drive comb and the motor sense comb, and the suspensions are anchored to the substrate. The MEMS device also includes a body attached to the substrate and at least one deceleration beam extending from the body. The deceleration extensions are configured to engage either deceleration beams or deceleration indentations and slow or stop the proof mass before it contacts either of the motor drive comb or the motor sense comb.

Abstract: A method for reduces the sticking of proof masses in micro-electromechanical systems (MEMS) devices to sense plates in the MEMS device due to acceleration forces to which the MEMS device is subjected. The method includes determining a beginning of acceleration events which would cause proof masses to contact sense plates, reducing sense bias voltages to the sense plates, determining an end of the acceleration event, and increasing sense bias voltages to their former levels.

Abstract: A MEMS gyroscope may be coupled to drive electronics that provide a pulse width modulation drive signal to the MEMS gyroscope. The pulse width modulation drive signal may be generated by comparing a pickoff signal and/or input signal to a direct current threshold level.

Abstract: A MEMS gyroscope system and method for increasing a dynamic range of the MEMS gyroscope is provided. By adjusting a scale factor of the MEMS gyroscope, the highest sensed rate will be increased, which increases the dynamic range. The scale factor may be adjusted by using a variable sense bias and/or an automatic gain control loop in sense electronics.

Abstract: By applying a first value of voltage to a first side of a MEMS gyroscope and applying a second value of voltage to a second side of the MEMS gyroscope, the start time of the MEMS gyroscope may be improved. The first and second value of voltage may be provided by a bias power source, such as a battery or a super capacitor. The first value of voltage may be substantially equal in magnitude to and opposite in polarity to the second value of voltage. The bias power source may also be applied to drive electronics connected to the MEMS gyroscope. The bias power source may prevent amplifiers within the drive electronics from saturating during the start time.

Abstract: By injecting noise into drive electronics, the start time of the MEMS gyroscope may be improved. A noise source is used to provide bandwidth limited white noise with a bandwidth centered substantially at the tuning fork frequency of at least one proof mass.

Abstract: A method of bonding and packaging components of Micro-Electro-Mechanical Systems (MEMS) and MEMS based devices using a Solid-Liquid InterDiffusion (SLID) process is provided. A micro-machine is bonded to a micro-machine chip using bonding materials. A layer of chromium is first deposited onto surfaces of the micro-machine and the micro-machine chip followed by a layer of gold. Subsequently, a layer of indium is deposited between the layers of gold, and the surface of the micro-machine is pressed against the surface of the micro-machine chip forming a gold-indium alloy to serve as a bond between the micro-machine and the micro-machine chip. In addition, a cover is bonded to the micro-machine chip in the same manner providing a hermetic seal for the MEMS based device.

Abstract: A cryogenic inertial Micro-Electro-Mechanical System (MEMS) device is provided. The device may include a vibratory gyroscope operable to sense a rotational acceleration. The device may also include a pre-amplifier co-located in a close proximity to the vibratory gyroscope. The device may be operated at substantially low temperatures, such as cryogenic temperatures, to reduce electrical noise and improve stability of outputs of the system.

Abstract: A method for bonding a gyroscope component to a gyroscope body using the solid liquid Inter Diffusion (SLID) process. The resulting bond structure has a larger operating range than the bonding-materials used to create to bond. Mating material layers may be added to the bond to improve bonding between the bonding materials and the component and between the bonding materials and the gyroscope body.

Abstract: A sensor mount for mounting a sensor to a substrate having a support member, a substrate attachment surface, and a sensor attachment surface. The support member can be attached to the substrate at the substrate attachment surface and the sensor can be attached to the support member at the sensor attachment surface. The sensor mount is shaped so an oblique angle is formed between the plane that includes the substrate attachment surface and the plane that includes the sensor attachment surfaces. Preferably, the support member has a wedge shape.

Abstract: A method for attaching dither motors to a ring laser gyro block such that the dither motors do not induce a large amount of stress into the laser gyro block. Attachment is achieved by the use of a center post having a diameter substantially smaller than the size of the laser gyro block.