Patents by Inventor William Padraic Henry
William Padraic Henry has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20200083399Abstract: Disclosed herein are techniques for wafer-to-wafer bonding for manufacturing light emitting diodes (LEDs). In some embodiments, a method of manufacturing LEDs includes modifying a p-type layer of a semiconductor material to form a plurality of alternating high resistivity areas and low resistivity areas, wherein the low resistivity areas correspond to light emitters; bonding a base wafer to a first surface of the p-type layer; removing a substrate from a second surface of the semiconductor material, wherein the second surface of the semiconductor material is opposite to the first surface of the p-type layer; and patterning a trench between each adjacent pair of the light emitters.Type: ApplicationFiled: June 10, 2019Publication date: March 12, 2020Inventors: William Padraic Henry, James Ronald Bonar, Gareth Valentine
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Patent number: 10566220Abstract: A light emitting diode (LED) includes an elastomeric material that facilitates adhesive attachment with a pick-up head for pick and place manufacturing operations. The LED includes an epitaxial layer defining a mesa structure and a light emitting surface. The mesa structure includes an active layer to emit light, and the emitted light is reflected at the mesa structure toward a light emitting region of the light emitting surface and transmitted at the light emitting region. An elastomeric material is on a portion of the light emitting surface, such as the light emitting region or a passive region. At the light emitting region, the elastomeric material may be shaped as a lens that collimates light transmitted from the light emitting region, and also facilitates adhesion to the pick-up head. At the passive region, the elastomeric material facilitates adhesion to the pick-up head without interfering with light emitted from the light emitting region.Type: GrantFiled: May 2, 2019Date of Patent: February 18, 2020Assignee: Facebook Technologies, LLCInventors: Pooya Saketi, Patrick Joseph Hughes, William Padraic Henry, Joseph O'Keeffe
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Publication number: 20190347974Abstract: A method and system for calibrating brightness variation in a display involve measuring brightness levels of light emitters in the display. The light emitters are divided into different groups based on the measured brightness levels. Each group is assigned a sub-frame duration. Groups with higher brightness are assigned shorter sub-frame durations than groups with lower brightness. Calibration information is stored for driving the light emitters such that during a frame period of the display, the light emitters are activated for durations corresponding to the sub-frame duration of their corresponding group.Type: ApplicationFiled: August 8, 2018Publication date: November 14, 2019Inventors: William Padraic HENRY, Ilias PAPPAS
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Patent number: 10403537Abstract: Embodiments relate to transferring dies or other electronic components from a carrier substrate to a target substrate of a device as part of chip assembly for the device. Bonding material is applied to selected dies on a carrier substrate by direct boning, or to corresponding die transfer locations on a target substrate. The carrier substrate is then brought into contact with the target substrate to transfer each of the selected dies to the carrier substrate. Dies can also be directly bonded to the target substrate even in the presence of other die in situ (e.g., from a previous bonding cycle), hence, enables more than one direct bond cycle to be carried out for a target substrate. As such, multi-color (RGB) display elements can be assembled in stages (e.g., separate bonding cycles) in a flexible manner to provide redundancy or to replace inoperative LED dies.Type: GrantFiled: March 10, 2017Date of Patent: September 3, 2019Assignee: Facebook Technologies, LLCInventors: William Padraic Henry, Patrick Joseph Hughes, Vincent Brennan
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Publication number: 20190259643Abstract: A light emitting diode (LED) includes an elastomeric material that facilitates adhesive attachment with a pick-up head for pick and place manufacturing operations. The LED includes an epitaxial layer defining a mesa structure and a light emitting surface. The mesa structure includes an active layer to emit light, and the emitted light is reflected at the mesa structure toward a light emitting region of the light emitting surface and transmitted at the light emitting region. An elastomeric material is on a portion of the light emitting surface, such as the light emitting region or a passive region. At the light emitting region, the elastomeric material may be shaped as a lens that collimates light transmitted from the light emitting region, and also facilitates adhesion to the pick-up head. At the passive region, the elastomeric material facilitates adhesion to the pick-up head without interfering with light emitted from the light emitting region.Type: ApplicationFiled: May 2, 2019Publication date: August 22, 2019Inventors: Pooya Saketi, Patrick Joseph Hughes, William Padraic Henry, Joseph O'Keeffe
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Patent number: 10325791Abstract: A light emitting diode (LED) includes an elastomeric material that facilitates adhesive attachment with a pick-up head for pick and place manufacturing operations. The LED includes an epitaxial layer defining a mesa structure and a light emitting surface. The mesa structure includes an active layer to emit light, and the emitted light is reflected at the mesa structure toward a light emitting region of the light emitting surface and transmitted at the light emitting region. An elastomeric material is on a portion of the light emitting surface, such as the light emitting region or a passive region. At the light emitting region, the elastomeric material may be shaped as a lens that collimates light transmitted from the light emitting region, and also facilitates adhesion to the pick-up head. At the passive region, the elastomeric material facilitates adhesion to the pick-up head without interfering with light emitted from the light emitting region.Type: GrantFiled: December 13, 2017Date of Patent: June 18, 2019Assignee: Facebook Technologies, LLCInventors: Pooya Saketi, Patrick Joseph Hughes, William Padraic Henry, Joseph O'Keeffe
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Publication number: 20190181023Abstract: A light emitting diode (LED) includes an elastomeric material that facilitates adhesive attachment with a pick-up head for pick and place manufacturing operations. The LED includes an epitaxial layer defining a mesa structure and a light emitting surface. The mesa structure includes an active layer to emit light, and the emitted light is reflected at the mesa structure toward a light emitting region of the light emitting surface and transmitted at the light emitting region. An elastomeric material is on a portion of the light emitting surface, such as the light emitting region or a passive region. At the light emitting region, the elastomeric material may be shaped as a lens that collimates light transmitted from the light emitting region, and also facilitates adhesion to the pick-up head. At the passive region, the elastomeric material facilitates adhesion to the pick-up head without interfering with light emitted from the light emitting region.Type: ApplicationFiled: December 13, 2017Publication date: June 13, 2019Inventors: Pooya Saketi, Patrick Joseph Hughes, William Padraic Henry, Joseph O'Keeffe
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Publication number: 20190139794Abstract: To manufacture a device by picking and placing semiconductor devices from a carrier substrate to a target substrate using suction force, a subset of pick-up heads of an array of pick-up heads is selectively operated to attach a subset of the semiconductor devices to the subset of pick-up heads by a suction force. The subset of semiconductor devices attached with the pick-up heads are placed over or on a target substrate, and releasing onto the target substrate. The semiconductor devices may be detached from the pick-up heads by releasing or reversing the suction force. The suction force may be created by controllable membranes in the pick-up heads, such as piezoelectric benders.Type: ApplicationFiled: November 8, 2017Publication date: May 9, 2019Inventors: Pooya Saketi, William Padraic Henry
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Publication number: 20190043917Abstract: Methods and apparatus for use in the manufacture of a display device including pixels. Each pixel includes a plurality of sub-pixels, each sub-pixel configured to provide light of a given wavelength. The method may include: performing, using a pick up tool (PUT), a first placement cycle comprising picking up first light emitting diode (LED) dies, and placing a first LED die on a substrate of the display device at a location corresponding to a sub-pixel the display device. The method further includes performing one or more subsequent placement cycles comprising picking up a second LED die, and placing the second LED die on the substrate of the display device at a second location corresponding to the sub-pixel of the display device. Multiple first and second LED dies may be picked and placed during each placement cycle to populate each pixel of the display device to provide redundancy of LED dies at each sub-pixel.Type: ApplicationFiled: October 11, 2018Publication date: February 7, 2019Inventors: Patrick Joseph Hughes, Vincent Brennan, Joseph O'Keeffe, Christopher Percival, William Padraic Henry, Tilman Zehender
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Patent number: 10177196Abstract: Methods and apparatus for use in the manufacture of a display device including pixels. Each pixel includes a plurality of sub-pixels, each sub-pixel configured to provide light of a given wavelength. The method may include: performing, using a pick up tool (PUT), a first placement cycle comprising picking up first light emitting diode (LED) dies, and placing a first LED die on a substrate of the display device at a location corresponding to a sub-pixel the display device. The method further includes performing one or more subsequent placement cycles comprising picking up a second LED die, and placing the second LED die on the substrate of the display device at a second location corresponding to the sub-pixel of the display device. Multiple first and second LED dies may be picked and placed during each placement cycle to populate each pixel of the display device to provide redundancy of LED dies at each sub-pixel.Type: GrantFiled: November 14, 2016Date of Patent: January 8, 2019Assignee: Facebook Technologies, LLCInventors: Patrick Joseph Hughes, Vincent Brennan, Joseph O'Keeffe, Christopher Percival, William Padraic Henry, Tilman Zehender
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Publication number: 20180332744Abstract: Methods and apparatus for use in the manufacture of a display element. Some embodiments include a method for selective pick up of a subset of a plurality of electronic devices adhered to a handle layer. The method comprises modifying a level of adhesion between one or more electronic devices of the plurality of electronic devices adhered to the handle layer, such that the subset of the plurality of electronic devices has a level of adhesion to the handle layer that is less than a force applied by a pick up tool, PUT. This enables selective pick up of the subset of the plurality of electronic devices from the handle layer by the PUT.Type: ApplicationFiled: July 3, 2018Publication date: November 15, 2018Inventors: Allan Pourchet, William Padraic Henry, Patrick Joseph Hughes, Joseph O'Keeffe
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Publication number: 20180261582Abstract: Embodiments relate to transferring dies or other electronic components from a carrier substrate to a target substrate of a device as part of chip assembly for the device. Bonding material is applied to selected dies on a carrier substrate by direct boning, or to corresponding die transfer locations on a target substrate. The carrier substrate is then brought into contact with the target substrate to transfer each of the selected dies to the carrier substrate. Dies can also be directly bonded to the target substrate even in the presence of other die in situ (e.g., from a previous bonding cycle), hence, enables more than one direct bond cycle to be carried out for a target substrate. As such, multi-color (RGB) display elements can be assembled in stages (e.g., separate bonding cycles) in a flexible manner to provide redundancy or to replace inoperative LED dies.Type: ApplicationFiled: March 10, 2017Publication date: September 13, 2018Inventors: William Padraic Henry, Patrick Joseph Hughes, Vincent Brennan
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Patent number: 10070568Abstract: Methods and apparatus for use in the manufacture of a display element. Some embodiments include a method for selective pick up of a subset of a plurality of electronic devices adhered to a handle layer. The method comprises modifying a level of adhesion between one or more electronic devices of the plurality of electronic devices adhered to the handle layer, such that the subset of the plurality of electronic devices has a level of adhesion to the handle layer that is less than a force applied by a pick up tool, PUT. This enables selective pick up of the subset of the plurality of electronic devices from the handle layer by the PUT.Type: GrantFiled: November 11, 2016Date of Patent: September 4, 2018Assignee: Oculus VR, LLCInventors: Allan Pourchet, William Padraic Henry, Patrick Joseph Hughes, Joseph O'Keeffe
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Publication number: 20170141155Abstract: Methods and apparatus for use in the manufacture of a display device including pixels. Each pixel includes a plurality of sub-pixels, each sub-pixel configured to provide light of a given wavelength. The method may include: performing, using a pick up tool (PUT), a first placement cycle comprising picking up first light emitting diode (LED) dies, and placing a first LED die on a substrate of the display device at a location corresponding to a sub-pixel the display device. The method further includes performing one or more subsequent placement cycles comprising picking up a second LED die, and placing the second LED die on the substrate of the display device at a second location corresponding to the sub-pixel of the display device. Multiple first and second LED dies may be picked and placed during each placement cycle to populate each pixel of the display device to provide redundancy of LED dies at each sub-pixel.Type: ApplicationFiled: November 14, 2016Publication date: May 18, 2017Inventors: Patrick Joseph Hughes, Vincent Brennan, Joseph O'Keeffe, Christopher Percival, William Padraic Henry, Tilman Zehender
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Publication number: 20170142874Abstract: Methods and apparatus for use in the manufacture of a display element. Some embodiments include a method for selective pick up of a subset of a plurality of electronic devices adhered to a handle layer. The method comprises modifying a level of adhesion between one or more electronic devices of the plurality of electronic devices adhered to the handle layer, such that the subset of the plurality of electronic devices has a level of adhesion to the handle layer that is less than a force applied by a pick up tool, PUT. This enables selective pick up of the subset of the plurality of electronic devices from the handle layer by the PUT.Type: ApplicationFiled: November 11, 2016Publication date: May 18, 2017Inventors: Allan Pourchet, William Padraic Henry, Patrick Joseph Hughes, Joseph O'Keeffe