Abstract: The invention uses transferable solder bump connection techniques in combination with a disposable test board to test and burn-in "as received" (i.e., untested) dies. Using transferable solder bumps, a die is first attached to the top of a disposable test board. The test board can be designed to allow 100% functional testing of the die as well as burn-in. Dies that successfully complete the test and burn-in process are considered to be "known good dies." Next, heat is applied to remove the known good die from the test board. A property of the invention is that solder bumps transfer with the die such that it can be used immediately in a flip-chip configuration and affixed to a MCM or other circuit board.

Abstract: An improved method of forming metal contact bumps for infrared detector array includes depositing a thick layer of positive organic photoresist, and exposing the entire layer to light. A second, substantially thinner layer of photoresist is then applied, and exposed with a pattern of light corresponding to the contact bumps desired. The photoresist is developed to resolve the pattern in the top thin film, and the underlying thick resist is isotropically developed down to the substrate surface and under a portion of the remaining unexposed top layer. the metal to form the contact bumps is then deposited, preferably by evaporative deposition. The overhanging edges of the top layer of photoresist prevent continuous metal step coverage between the surface of the photoresist layer and the bumps formed on the substrate surface in the cavity. The remaining photoresist is then dissolved, and the metal deposited on the surface of the second layer is readily removed.

Abstract: A method and apparatus for providing temporary thermal contact between a part being processed and a heat sink is disclosed. A tacky, insert, polymer film is applied to establish intimate contact with the part and the heat sink. Since the polymer layer has greater cohesive strength than adhesive strength, the part may be separated cleanly from the polymer film with substantially no contamination. The part does adhere with sufficient force to permit improved processing such as ion etching, sputter deposition and etching, ion beam deposition, vacuum evaporation, plasma etching, reactive ion etching, chemical vapor deposition, and ion implantation without overheating. The heat sink is mounted in a supporting fixture having pressure means and vacuum means associated therewith. The vacuum means is used for pulling the device wafer onto the coated heat sink. The pressure means is used to dismount the wafer from the heat sink without physical damage or contamination.