Patents by Inventor William R. Halleck

William R. Halleck has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11899615
    Abstract: Methods and apparatuses relating to hardware processors with multiple interconnected dies are described. In one embodiment, a hardware processor includes a plurality of physically separate dies, and an interconnect to electrically couple the plurality of physically separate dies together. In another embodiment, a method to create a hardware processor includes providing a plurality of physically separate dies, and electrically coupling the plurality of physically separate dies together with an interconnect.
    Type: Grant
    Filed: January 27, 2023
    Date of Patent: February 13, 2024
    Assignee: Intel Corporation
    Inventors: Nevine Nassif, Yen-Cheng Liu, Krishnakanth V. Sistla, Gerald Pasdast, Siva Soumya Eachempati, Tejpal Singh, Ankush Varma, Mahesh K. Kumashikar, Srikanth Nimmagadda, Carleton L. Molnar, Vedaraman Geetha, Jeffrey D. Chamberlain, William R. Halleck, George Z Chrysos, John R. Ayers, Dheeraj R. Subbareddy
  • Publication number: 20230169032
    Abstract: Methods and apparatuses relating to hardware processors with multiple interconnected dies are described. In one embodiment, a hardware processor includes a plurality of physically separate dies, and an interconnect to electrically couple the plurality of physically separate dies together. In another embodiment, a method to create a hardware processor includes providing a plurality of physically separate dies, and electrically coupling the plurality of physically separate dies together with an interconnect.
    Type: Application
    Filed: January 27, 2023
    Publication date: June 1, 2023
    Inventors: NEVINE NASSIF, YEN-CHENG LIU, KRISHNAKANTH V. SISTLA, GERALD PASDAST, SIVA SOUMYA EACHEMPATI, TEJPAL SINGH, ANKUSH VARMA, MAHESH K. KUMASHIKAR, SRIKANTH NIMMAGADDA, CARLETON L. MOLNAR, VEDARAMAN GEETHA, JEFFREY D. CHAMBERLAIN, WILLIAM R. HALLECK, GEORGE Z. CHRYSOS, JOHN R. AYERS, DHEERAJ R. SUBBAREDDY
  • Patent number: 11586579
    Abstract: Methods and apparatuses relating to hardware processors with multiple interconnected dies are described. In one embodiment, a hardware processor includes a plurality of physically separate dies, and an interconnect to electrically couple the plurality of physically separate dies together. In another embodiment, a method to create a hardware processor includes providing a plurality of physically separate dies, and electrically coupling the plurality of physically separate dies together with an interconnect.
    Type: Grant
    Filed: October 28, 2021
    Date of Patent: February 21, 2023
    Assignee: Intel Corporation
    Inventors: Nevine Nassif, Yen-Cheng Liu, Krishnakanth V. Sistla, Gerald Pasdast, Siva Soumya Eachempati, Tejpal Singh, Ankush Varma, Mahesh K. Kumashikar, Srikanth Nimmagadda, Carleton L. Molnar, Vedaraman Geetha, Jeffrey D. Chamberlain, William R. Halleck, George Z. Chrysos, John R. Ayers, Dheeraj R. Subbareddy
  • Patent number: 11354264
    Abstract: Systems, methods, and apparatuses including a Physical layer (PHY) block coupled to a Media Access Control layer (MAC) block via a PHY/MAC interface. Each of the PHY and MAC blocks include a plurality of Physical Interface for PCI Express (PIPE) registers. The PHY/MAC interface includes a low pin count PIPE interface comprising a small set of wires coupled between the PHY block and the MAC block. The MAC block is configured to multiplex command, address, and data over the low pin count PIPE interface to access the plurality of PHY PIPE registers, and the PHY block is configured to multiplex command, address, and data over the low pin count PIPE interface to access the plurality of MAC PIPE registers. The PHY block may also be selectively configurable to implement a PIPE architecture to operate in a PIPE mode and a serialization and deserialization (SERDES) architecture to operate in a SERDES mode.
    Type: Grant
    Filed: February 25, 2021
    Date of Patent: June 7, 2022
    Assignee: INTEL CORPORATION
    Inventors: Venkatraman Iyer, William R. Halleck, Rahul R. Shah, Eric Lee
  • Patent number: 11294852
    Abstract: Methods and apparatuses relating to hardware processors with multiple interconnected dies are described. In one embodiment, a hardware processor includes a plurality of physically separate dies, and an interconnect to electrically couple the plurality of physically separate dies together. In another embodiment, a method to create a hardware processor includes providing a plurality of physically separate dies, and electrically coupling the plurality of physically separate dies together with an interconnect.
    Type: Grant
    Filed: June 30, 2020
    Date of Patent: April 5, 2022
    Assignee: Intel Corporation
    Inventors: Nevine Nassif, Yen-Cheng Liu, Krishnakanth V. Sistla, Gerald Pasdast, Siva Soumya Eachempati, Tejpal Singh, Ankush Varma, Mahesh K. Kumashikar, Srikanth Nimmagadda, Carleton L. Molnar, Vedaraman Geetha, Jeffrey D. Chamberlain, William R. Halleck, George Z. Chrysos, John R. Ayers, Dheeraj R. Subbareddy
  • Publication number: 20220050805
    Abstract: Methods and apparatuses relating to hardware processors with multiple interconnected dies are described. In one embodiment, a hardware processor includes a plurality of physically separate dies, and an interconnect to electrically couple the plurality of physically separate dies together. In another embodiment, a method to create a hardware processor includes providing a plurality of physically separate dies, and electrically coupling the plurality of physically separate dies together with an interconnect.
    Type: Application
    Filed: October 28, 2021
    Publication date: February 17, 2022
    Inventors: NEVINE NASSIF, YEN-CHENG LIU, KRISHNAKANTH V. SISTLA, GERALD PASDAST, SIVA SOUMYA EACHEMPATI, TEJPAL SINGH, ANKUSH VARMA, MAHESH K. KUMASHIKAR, SRIKANTH NIMMAGADDA, CARLETON L. MOLNAR, VEDARAMAN GEETHA, JEFFREY D. CHAMBERLAIN, WILLIAM R. HALLECK, GEORGE Z. CHRYSOS, JOHN R. AYERS, DHEERAJ R. SUBBAREDDY
  • Publication number: 20210182231
    Abstract: Systems, methods, and apparatuses including a Physical layer (PHY) block coupled to a Media Access Control layer (MAC) block via a PHY/MAC interface. Each of the PHY and MAC blocks include a plurality of Physical Interface for PCI Express (PIPE) registers. The PHY/MAC interface includes a low pin count PIPE interface comprising a small set of wires coupled between the PHY block and the MAC block. The MAC block is configured to multiplex command, address, and data over the low pin count PIPE interface to access the plurality of PHY PIPE registers, and the PHY block is configured to multiplex command, address, and data over the low pin count PIPE interface to access the plurality of MAC PIPE registers. The PHY block may also be selectively configurable to implement a PIPE architecture to operate in a PIPE mode and a serialization and deserialization (SERDES) architecture to operate in a SERDES mode.
    Type: Application
    Filed: February 25, 2021
    Publication date: June 17, 2021
    Inventors: Venkatraman Iyer, William R. Halleck, Rahul R. Shah, Eric Lee
  • Patent number: 10963415
    Abstract: Systems, methods, and apparatuses including a Physical layer (PHY) block coupled to a Media Access Control layer (MAC) block via a PHY/MAC interface. Each of the PHY and MAC blocks include a plurality of Physical Interface for PCI Express (PIPE) registers. The PHY/MAC interface includes a low pin count PIPE interface comprising a small set of wires coupled between the PHY block and the MAC block. The MAC block is configured to multiplex command, address, and data over the low pin count PIPE interface to access the plurality of PHY PIPE registers, and the PHY block is configured to multiplex command, address, and data over the low pin count PIPE interface to access the plurality of MAC PIPE registers. The PHY block may also be selectively configurable to implement a PIPE architecture to operate in a PIPE mode and a serialization and deserialization (SERDES) architecture to operate in a SERDES mode.
    Type: Grant
    Filed: February 26, 2020
    Date of Patent: March 30, 2021
    Assignee: INTEL CORPORATION
    Inventors: Venkatraman Iyer, William R. Halleck, Rahul R. Shah, Eric Lee
  • Patent number: 10931329
    Abstract: An apparatus includes an agent to facilitate communication in one of two or more modes, where a first of the two or more modes involves communication over links including a first number of lanes and a second of the two or more modes involves communication over links including a second number of lanes, and the first number is greater than the second number. The apparatus further includes a memory including data to indicate which of the two or modes applies to a particular link and a multiplexer to reverse lane numbering on links including either the first number of lanes or the second number of lanes.
    Type: Grant
    Filed: December 29, 2016
    Date of Patent: February 23, 2021
    Assignee: Intel Corporation
    Inventors: Rahul R. Shah, William R. Halleck, Fulvio Spagna, Venkatraman Iyer
  • Publication number: 20200334196
    Abstract: Methods and apparatuses relating to hardware processors with multiple interconnected dies are described. In one embodiment, a hardware processor includes a plurality of physically separate dies, and an interconnect to electrically couple the plurality of physically separate dies together. In another embodiment, a method to create a hardware processor includes providing a plurality of physically separate dies, and electrically coupling the plurality of physically separate dies together with an interconnect.
    Type: Application
    Filed: June 30, 2020
    Publication date: October 22, 2020
    Inventors: NEVINE NASSIF, YEN-CHENG LIU, KRISHNAKANTH V. SISTLA, GERALD PASDAST, SIVA SOUMYA EACHEMPATI, TEJPAL SINGH, ANKUSH VARMA, MAHESH K. KUMASHIKAR, SRIKANTH NIMMAGADDA, CARLETON L. MOLNAR, VEDARAMAN GEETHA, JEFFREY D. CHAMBERLAIN, WILLIAM R. HALLECK, GEORGE Z. CHRYSOS, JOHN R. AYERS, DHEERAJ R. SUBBAREDDY
  • Patent number: 10795853
    Abstract: Methods and apparatuses relating to hardware processors with multiple interconnected dies are described. In one embodiment, a hardware processor includes a plurality of physically separate dies, and an interconnect to electrically couple the plurality of physically separate dies together. In another embodiment, a method to create a hardware processor includes providing a plurality of physically separate dies, and electrically coupling the plurality of physically separate dies together with an interconnect.
    Type: Grant
    Filed: September 30, 2017
    Date of Patent: October 6, 2020
    Assignee: Intel Corporation
    Inventors: Nevine Nassif, Yen-Cheng Liu, Krishnakanth V. Sistla, Gerald Pasdast, Siva Soumya Eachempati, Tejpal Singh, Ankush Varma, Mahesh K. Kumashikar, Srikanth Nimmagadda, Carleton L. Molnar, Vedaraman Geetha, Jeffrey D. Chamberlain, William R. Halleck, George Z. Chrysos, John R. Ayers, Dheeraj R. Subbareddy
  • Publication number: 20200293480
    Abstract: Systems, methods, and apparatuses including a Physical layer (PHY) block coupled to a Media Access Control layer (MAC) block via a PHY/MAC interface. Each of the PHY and MAC blocks include a plurality of Physical Interface for PCI Express (PIPE) registers. The PHY/MAC interface includes a low pin count PIPE interface comprising a small set of wires coupled between the PHY block and the MAC block. The MAC block is configured to multiplex command, address, and data over the low pin count PIPE interface to access the plurality of PHY PIPE registers, and the PHY block is configured to multiplex command, address, and data over the low pin count PIPE interface to access the plurality of MAC PIPE registers. The PHY block may also be selectively configurable to implement a PIPE architecture to operate in a PIPE mode and a serialization and deserialization (SERDES) architecture to operate in a SERDES mode.
    Type: Application
    Filed: February 26, 2020
    Publication date: September 17, 2020
    Applicant: INTEL CORPORATION
    Inventors: Venkatraman Iyer, William R. Halleck, Rahul R. Shah, Eric Lee
  • Patent number: 10599602
    Abstract: Systems, methods, and apparatuses including a Physical layer (PHY) block coupled to a Media Access Control layer (MAC) block via a PHY/MAC interface. Each of the PHY and MAC blocks include a plurality of Physical Interface for PCI Express (PIPE) registers. The PHY/MAC interface includes a low pin count PIPE interface comprising a small set of wires coupled between the PHY block and the MAC block. The MAC block is configured to multiplex command, address, and data over the low pin count PIPE interface to access the plurality of PHY PIPE registers, and the PHY block is configured to multiplex command, address, and data over the low pin count PIPE interface to access the plurality of MAC PIPE registers. The PHY block may also be selectively configurable to implement a PIPE architecture to operate in a PIPE mode and a serialization and deserialization (SERDES) architecture to operate in a SERDES mode.
    Type: Grant
    Filed: June 20, 2019
    Date of Patent: March 24, 2020
    Assignee: Intel Corporation
    Inventors: Venkatraman Iyer, William R. Halleck, Rahul R. Shah, Eric Lee
  • Publication number: 20190310959
    Abstract: Systems, methods, and apparatuses including a Physical layer (PHY) block coupled to a Media Access Control layer (MAC) block via a PHY/MAC interface. Each of the PHY and MAC blocks include a plurality of Physical Interface for PCI Express (PIPE) registers. The PHY/MAC interface includes a low pin count PIPE interface comprising a small set of wires coupled between the PHY block and the MAC block. The MAC block is configured to multiplex command, address, and data over the low pin count PIPE interface to access the plurality of PHY PIPE registers, and the PHY block is configured to multiplex command, address, and data over the low pin count PIPE interface to access the plurality of MAC PIPE registers. The PHY block may also be selectively configurable to implement a PIPE architecture to operate in a PIPE mode and a serialization and deserialization (SERDES) architecture to operate in a SERDES mode.
    Type: Application
    Filed: June 20, 2019
    Publication date: October 10, 2019
    Applicant: INTEL CORPORATION
    Inventors: Venkatraman Iyer, William R. Halleck, Rahul R. Shah, Eric Lee
  • Patent number: 10372657
    Abstract: Systems, methods, and apparatuses including a Physical layer (PHY) block coupled to a Media Access Control layer (MAC) block via a PHY/MAC interface. Each of the PHY and MAC blocks include a plurality of Physical Interface for PCI Express (PIPE) registers. The PHY/MAC interface includes a low pin count PIPE interface comprising a small set of wires coupled between the PHY block and the MAC block. The low pin count PIPE interface is configured to transfer register commands between the PHY and MAC blocks over the small set of wires in a time-multiplexed manner to support read and write access of the PHY and MAC PIPE registers. The PHY block may also be selectively configurable to implement a PIPE architecture when operating in a PIPE mode and a serialization and deserialization (SERDES) architecture when operating in a SERDES mode.
    Type: Grant
    Filed: December 26, 2016
    Date of Patent: August 6, 2019
    Assignee: Intel Corporation
    Inventors: Venkatraman Iyer, William R. Halleck, Rahul R. Shah, Eric Lee
  • Patent number: 10324882
    Abstract: An exit pattern is sent to initiate exit from a partial width state, where only a portion of the available lanes of a link are used to transmit data and the remaining lanes are idle. The exit pattern is sent on the idle lanes, the exit pattern including an electrical ordered set (EOS), one or more fast training sequences (FTS), a start of data sequence (SDS), and a partial fast training sequence (FTSp). The SDS includes a byte number field to indicate a number of a bytes measured from a previous control interval of the link, and an end of the SDS is sent to coincide with a clean flit boundary on the active lanes. The partial width state is exited based on the exit pattern and data is sent on all available lanes following the exit from the partial width state.
    Type: Grant
    Filed: December 29, 2016
    Date of Patent: June 18, 2019
    Assignee: Intel Corporation
    Inventors: William R. Halleck, Rahul R. Shah, Venkatraman Iyer
  • Patent number: 10152446
    Abstract: An interface adapter to identify a first ready signal from a first link layer-to-physical layer (LL-PHY) interface of a first communication protocol indicating readiness of a physical layer of the first protocol to accept link layer data. The interface adapter generates a second ready signal compatible with a second LL-PHY interface of a second communication protocol to cause link layer data to be sent from a link layer of the second communication protocol according to a predefined delay. A third ready signal is generated compatible with the first LL-PHY interface to indicate to the physical layer of the first communication protocol that the link layer data is to be sent. The interface adapter uses a shift register to cause the link layer data to be passed to the physical layer according to the predefined delay.
    Type: Grant
    Filed: October 1, 2016
    Date of Patent: December 11, 2018
    Assignee: Intel Corporation
    Inventors: Venkatraman Iyer, Mahesh Wagh, William R. Halleck, Rahul R. Shah
  • Patent number: 10025746
    Abstract: A signal is received, a boundary of which is to be sent in alignment with a sync counter value. A nominal latency of a link is determined based on the sync counter value. Additional latency is applied to the signal to increase the nominal latency to a target latency for the link.
    Type: Grant
    Filed: December 20, 2014
    Date of Patent: July 17, 2018
    Assignee: Intel Corporation
    Inventors: William R. Halleck, Rahul Shah, Venkatraman Iyer
  • Publication number: 20180191523
    Abstract: An apparatus includes an agent to facilitate communication in one of two or more modes, where a first of the two or more modes involves communication over links including a first number of lanes and a second of the two or more modes involves communication over links including a second number of lanes, and the first number is greater than the second number. The apparatus further includes a memory including data to indicate which of the two or modes applies to a particular link and a multiplexer to reverse lane numbering on links including either the first number of lanes or the second number of lanes.
    Type: Application
    Filed: December 29, 2016
    Publication date: July 5, 2018
    Inventors: Rahul R. Shah, William R. Halleck, Fulvio Spagna, Venkatraman Iyer
  • Publication number: 20180181525
    Abstract: Systems, methods, and apparatuses involve a PHY coupled to a MAC. The PHY can include a drift buffer coupled to an output of a receiver and a bypass branch coupled to the output of the receiver. The PHY includes a clocking multiplexer that includes a first clock input coupled to a recovered clock of the PHY and a second clock input coupled to a p-clock of the MAC; and a clock output configured to output one of the recovered clock or the p-clock based on a selection input value. The PHY includes a bypass multiplexer that includes a first data input coupled to an output of a drift buffer and a second data input coupled to the bypass branch; and a data output configured to output one of the output of the drift buffer or data from the bypass branch based on the section input value of the clocking multiplexer.
    Type: Application
    Filed: December 26, 2016
    Publication date: June 28, 2018
    Inventors: Venkatraman Iyer, William R. Halleck, Rahul R. Shah, Eric Lee