Abstract: An evaporator comprising a graphite-Cu composite formed into a plurality of pin fins. The plurality of pin fins serve to increase the surface area of the evaporator. The evaporator surface area is processed to have a plurality of nucleation sites thereon. The evaporator may be connected directly to a integrated circuit package.

Abstract: A heatpipe having an evaporator fabricated out of composite graphite material and having a hemispherical shape. Two methods of fabricating such an evaporator include (1) bundling and bonding a plurality of composite graphite fibers and (2) providing a plurality of composite graphite fiber mats and compressing the mats about a central point. In either method the composite graphite material is configured to have a generally hemispherical outer surface. Evaporators having a generally hemispherical outer surface and made of metal, such as Cu, without graphite, are also disclosed.

Abstract: In a data processing system, the packages containing the electronic components are cooled by directing the cooling material through an array of nozzles toward the packages and components. The nozzles are fabricated in the circuit board, the flow of the coolant being the result of a difference in pressure of the coolant between the two sides of the circuit board. In the preferred embodiment, the nozzles are positioned directly below the component package. The component packages are removed from the surface of the circuit board, to which the component package is attached, to permit relatively uninhibited flow by the coolant past the component package. The nozzle arrays can be implemented to compensate for a non-uniform distribution of heat sources within a component package to provide a generally uniform temperature for the package or component.

Abstract: In order to provide thermal coupling of a package, particularly a package containing electronic components, and a heat sink, a thermal transfer assembly includes a first assembly having a group of generally parallel cooling fins coupled to the package. Coupled to the heat sink, such as cooling plate, is a second assembly also including a plurality of generally parallel cooling fins. The second set of cooling fins is positioned on the heat sink so that when the heat sink is in a predetermined position with respect to the package, the cooling fins overlap. The overlapping cooling fins permit efficient transfer of heat thus permitting heat generated in the package to be conveyed to the heat sink. The overlapping fins also permit convenient disassembly and reassembly for test and maintenance procedures. Techniques for fabrication of the thermal transfer assembly are described along with procedures for improving the operation of the heat transfer assembly.