Patents by Inventor William Robert Morrison

William Robert Morrison has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11923258
    Abstract: An example includes: a substrate having a first package surface, having a second package surface opposite the first package surface, and having a die cavity with a depth extending into the first package surface; a semiconductor die having bond pads on a first die surface and having a second die surface opposite the first die surface, the semiconductor die having a die thickness, the second die surface of the semiconductor die mounted in the die cavity; a cover over a portion of the first die surface; conductors coupling the bond pads of the semiconductor die to bond fingers on the first package surface of the substrate; and dielectric material over the conductors, the bond fingers, the bond pads, at least a portion of the first semiconductor die and at least a portion of the cover, wherein the dielectric material extends above the first package surface of the substrate.
    Type: Grant
    Filed: September 8, 2021
    Date of Patent: March 5, 2024
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: William Robert Morrison, Bradley Morgan Haskett
  • Publication number: 20220189836
    Abstract: An example includes: a substrate having a first package surface, having a second package surface opposite the first package surface, and having a die cavity with a depth extending into the first package surface; a semiconductor die having bond pads on a first die surface and having a second die surface opposite the first die surface, the semiconductor die having a die thickness, the second die surface of the semiconductor die mounted in the die cavity; a cover over a portion of the first die surface; conductors coupling the bond pads of the semiconductor die to bond fingers on the first package surface of the substrate; and dielectric material over the conductors, the bond fingers, the bond pads, at least a portion of the first semiconductor die and at least a portion of the cover, wherein the dielectric material extends above the first package surface of the substrate.
    Type: Application
    Filed: September 8, 2021
    Publication date: June 16, 2022
    Inventors: William Robert Morrison, Bradley Morgan Haskett
  • Patent number: 9487397
    Abstract: A device has a microelectromechanical system (MEMS) component with at least one surface and a coating disposed on at least a portion of the surface. The coating has a compound of the formula M(CnF2n+1Or), wherein M is a polar head group and wherein n?2r. The value of n may range from 2 to about 20, and the value of r may range from 1 to about 10. The value of n plus r may range from 3 to about 30, and a ratio of n:r may have a value of about 2:1 to about 20:1.
    Type: Grant
    Filed: September 3, 2015
    Date of Patent: November 8, 2016
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: William Robert Morrison, Mark Christopher Fisher, Murali Hanabe, Ganapathy Subramaniam Sivakumar, Simon Joshua Jacobs
  • Publication number: 20160060108
    Abstract: A device has a microelectromechanical system (MEMS) component with at least one surface and a coating disposed on at least a portion of the surface. The coating has a compound of the formula M(CnF2n+1Or), wherein M is a polar head group and wherein n?2r. The value of n may range from 2 to about 20, and the value of r may range from 1 to about 10. The value of n plus r may range from 3 to about 30, and a ratio of n:r may have a value of about 2:1 to about 20:1.
    Type: Application
    Filed: September 3, 2015
    Publication date: March 3, 2016
    Inventors: William Robert MORRISON, Mark Christopher FISHER, Murali Hanabe, Ganapathy Subramaniam SIVAKUMAR, Simon Joshua JACOBS
  • Patent number: 9150410
    Abstract: A device has a microelectromechanical system (MEMS) component with at least one surface and a coating disposed on at least a portion of the surface. The coating has a compound of the formula M(CnF2n+1Or), wherein M is a polar head group and wherein n?2r. The value of n may range from 2 to about 20, and the value of r may range from 1 to about 10. The value of n plus r may range from 3 to about 30, and a ratio of n:r may have a value of about 2:1 to about 20:1.
    Type: Grant
    Filed: July 17, 2014
    Date of Patent: October 6, 2015
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: William Robert Morrison, Mark Christopher Fisher, Murali Hanabe, Ganapathy Subramaniam Sivakumar, Simon Joshua Jacobs
  • Publication number: 20140329392
    Abstract: A device has a microelectromechanical system (MEMS) component with at least one surface and a coating disposed on at least a portion of the surface. The coating has a compound of the formula M(CnF2n+1Or), wherein M is a polar head group and wherein n?2r. The value of n may range from 2 to about 20, and the value of r may range from 1 to about 10. The value of n plus r may range from 3 to about 30, and a ratio of n:r may have a value of about 2:1 to about 20:1.
    Type: Application
    Filed: July 17, 2014
    Publication date: November 6, 2014
    Inventors: William Robert MORRISON, Mark Christopher FISHER, Murali HANABE, Ganapathy Subramaniam SIVAKUMAR, Simon Joshua JACOBS
  • Patent number: 8803296
    Abstract: A device has a microelectromechanical system (MEMS) component with at least one surface and a coating disposed on at least a portion of the surface. The coating has a compound of the formula M(CnF2n+1Or), wherein M is a polar head group and wherein n?2r. The value of n may range from 2 to about 20, and the value of r may range from 1 to about 10. The value of n plus r may range from 3 to about 30, and a ratio of n:r may have a value of about 2:1 to about 20:1.
    Type: Grant
    Filed: March 4, 2013
    Date of Patent: August 12, 2014
    Assignee: Texas Instruments Incorporated
    Inventors: William Robert Morrison, Mark Christopher Fisher, Murali Hanabe, Ganapathy Subramaniam Sivakumar, Simon Joshua Jacobs