Patents by Inventor William Robert Patrick Tonti

William Robert Patrick Tonti has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6433618
    Abstract: A variable power device circuit includes a plurality of devices for driving a load. Each of the devices has a body, which is electrically isolated from the substrate. All of the devices are coupled to an output node. The load is also coupled to the output node. A controller selectively turns on individual or multiple ones of the devices based on the electrical requirements of the load.
    Type: Grant
    Filed: September 3, 1998
    Date of Patent: August 13, 2002
    Assignee: International Business Machines Corporation
    Inventors: Claude Louis Bertin, Alvar Antonio Dean, William Robert Patrick Tonti
  • Patent number: 6097243
    Abstract: According to the preferred embodiment, a device and method for reducing power consumption by reducing unneeded node toggling is provided. The preferred embodiment reduces unneeded node toggling in a circuit by utilizing either a pull-up or pull-down transistor to pull the input of the circuit to a state that minimizes power consumption during periods in which the circuit is inactive. By tying the circuit input high or low during inactivity, node toggling is reduced or eliminated in that circuit. In the preferred embodiment, the inputs to the circuit all pulled after a time of inactivity which is proportional to the leakage current of the leakiest transistor in the circuit. By timing the input pulling proportional to the leakage current, the power consumption is minimized without excessive power loss caused by the pulling itself.
    Type: Grant
    Filed: September 24, 1998
    Date of Patent: August 1, 2000
    Assignee: International Business Machines Corporation
    Inventors: Claude L. Bertin, William Robert Patrick Tonti, Alvar Antonio Dean, Wilbur David Pricer, Patrick Edward Perry, Kenneth J. Goodnow, Sebastian T. Ventrone
  • Patent number: 5880988
    Abstract: A column of an integrated memory circuit includes two bit lines each with a right half and a left half and a plurality of similar memory cells connected to each half of each bit line. One of the memory cells connected to each line is used as a reference and the other cells are used for data storage. Each half of each bit line is connected to a sense node of a sense amplifier latch through an independently controlled transistor switch. To read the data from the first half of the first bit line, the transistors connecting the first half of the first bit line to the sense node is turned on and the transistor connecting the second half of the first bit line to the sense node is turned off. Both transistor switches connecting respective halves of the other bit line to the other sense node are turned on. Each half of each bit line includes approximately the same effective load. The load applied to the first sense node is thus about half of the load applied to the second sense node.
    Type: Grant
    Filed: July 11, 1997
    Date of Patent: March 9, 1999
    Assignee: International Business Machines Corporation
    Inventors: Claude Louis Bertin, John Atkinson Fifield, Russell James Houghton, Christopher Paul Miller, William Robert Patrick Tonti
  • Patent number: 5811868
    Abstract: An integrated high-performance decoupling capacitor, formed on a semiconductor chip, using the substrate of the chip itself in conjunction with a metallic deposit formed on the presently unused chip back surface and electrically connected to the active chip circuit to result in a significant and very effective decoupling capacitor in close proximity to the active circuit on the chip requiring such decoupling capacitance.Specifically the present invention achieves this desirable result by providing a dielectric layer on the unused backside of the chip and forming a metal deposit on the formed backside dielectric layer and an electrical connection, between the metallic deposit and the active chip circuit via a through hole in the chip.
    Type: Grant
    Filed: December 20, 1996
    Date of Patent: September 22, 1998
    Assignee: International Business Machines Corp.
    Inventors: Claude Louis Bertin, Wayne John Howell, William Robert Patrick Tonti, Jerzy Maria Zalesnski