Abstract: An interface includes an enclosure having a plurality of walls interconnected to form a parallelepiped having a space therein. The enclosure is positionable to occupy a plurality of slots located in a computer housing of a first type computer. The enclosure has a width corresponding essentially to a total width of the plurality of slots. The interface further includes a computer subsystem of a second type computer disposed within the space of the enclosure. The computer subsystem includes a circuit card, and a distribution card attached to, and electrically coupled with, the circuit card. The distribution card is connectable to a backplane of the first type computer located external to the enclosure and within the computer housing.

Abstract: A test apparatus and method for testing circuitized substrates such as printed circuit boards or ceramic substrates having one or more chips thereon. The apparatus includes one substrate (e.g., printed circuit board) located on a base and adapted for having another circuitized substrate (e.g., flexible circuit) positioned thereon and electrically coupled to conductive elements (e.g., copper pads) thereof. Elastomeric members may be used to force the flexible circuit against the conductors of the substrate being tested, this substrate positioned either within or upon a cover which is located over the flexible circuit and which assists in compressing the flexible circuit against the printed circuit board's conductive elements to assure positive connection therewith. The cover may also include elastomeric members to facilitate such connection and a pivotal arm for being actuated to engage the substrate being tested.

Abstract: A semiconductor chip carrier includes a plurality of distributed high frequency decoupling capacitors as an integral part of the carrier. The distributed capacitors are formed as a part of the first and second layers of metallurgy and separated by a layer of thin film dielectric material built up on a substrate. The distributed capacitors are positioned to extend from a ground pin of one of the layers of metallurgy to a plurality of mounting pads which are intergral parts of the other of the layers of metallurgy. A semiconductor chip is mounted to the mounting pads and receives electrical power and signals therethrough. The distributed capacitors decrease electrical noise associated with simultaneous switching of relatively large numbers of off-chip drivers which are electrically connected to the semiconductor chip.

Abstract: Apparatus for effecting controlled and accurate moistening of an object is described. A hollow rotor is provided with at least one shaped portion in its surface, that portion having a row of nozzles therein. The nozzles are drilled completely through the rotor sidewall so that they comprise a conduit between the rotor's center and the outer surface of the rotor. An apertured plate and shutter plate are movably mounted between an object to be coated and the rotor. Fluid is delivered to the center of the rotor from a supply thereof by means of an inlet tube. The rotor is coupled at its other end, which is sealed to prevent fluid escape, to a motor and driven thereby to eject fluid from the nozzles, aided by the vacuum effect of the shaped rotor portion. Only that fluid escaping through the exposed section of the slot in the apertured plate strikes and thereby coats the object to be moistened.