Abstract: A system in one embodiment includes a cable having a plurality of cable leads, and a multi-diode chip having a pad-side not facing the cable. The multi-diode chip includes a plurality of sets of contact pads on the pad-side of the multi-diode chip, and a plurality of crossed diode sets, wherein each set of crossed diodes is coupled between a first contact pad and a second contact pad of one set of contact pads, wherein at least two of the plurality of cable leads are coupled via wire-bonding to one of the plurality of sets of contact pads of the multi-diode chip for providing electrostatic discharge (ESD) protection for at least one element of the electronic device coupled to the at least two cable leads.

Abstract: In one embodiment, a system includes a cable comprising a plurality of leads and an ESD dissipating adhesive coupled to the plurality of leads in a coverage area for providing ESD protection to an element of an electronic device. The ESD adhesive comprises a mixture of a polymeric thin film and electrically conductive fillers dispersed in the film, and the ESD adhesive has a resistivity from about 50 to 100 M?. In another embodiment, a method for providing ESD protection to an element of an electronic device includes applying an ESD adhesive across exposed leads of a cable and evaporating the solvent from the ESD adhesive. At least some of the leads are coupled to an element of an electronic device. The ESD adhesive comprises a polymeric thin film, electrically conductive fillers dispersed in the polymeric thin film, and a solvent for controlling a viscosity of the ESD adhesive.

Abstract: In one embodiment, a system includes a cable comprising a plurality of leads and an ESD dissipating adhesive coupled to the plurality of leads in a coverage area for providing ESD protection to an element of an electronic device. The ESD adhesive comprises a mixture of a polymeric thin film and electrically conductive fillers dispersed in the film, and the ESD adhesive has a resistivity from about 50 to 100 M?. In another embodiment, a method for providing ESD protection to an element of an electronic device includes applying an ESD adhesive across exposed leads of a cable and evaporating the solvent from the ESD adhesive. At least some of the leads are coupled to an element of an electronic device. The ESD adhesive comprises a polymeric thin film, electrically conductive fillers dispersed in the polymeric thin film, and a solvent for controlling a viscosity of the ESD adhesive.

Abstract: A system in one embodiment includes a cable having a plurality of cable leads, and a multi-diode chip having a pad-side not facing the cable. The multi-diode chip includes a plurality of sets of contact pads on the pad-side of the multi-diode chip, and a plurality of crossed diode sets, wherein each set of crossed diodes is coupled between a first contact pad and a second contact pad of one set of contact pads, wherein at least two of the plurality of cable leads are coupled via wire-bonding to one of the plurality of sets of contact pads of the multi-diode chip for providing electrostatic discharge (ESD) protection for at least one element of the electronic device coupled to the at least two cable leads.