Patents by Inventor William Thomas Bandy, IV

William Thomas Bandy, IV has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8343386
    Abstract: An electrostatically dissipative adhesive in one embodiment includes a mixture comprising: an adhesive material; and electrically conductive particles intermixed with the adhesive material, the electrically conductive particles being present in an amount between 0 and about 10% by weight of a total weight of the mixture. An electrostatically dissipative adhesive in another embodiment includes a mixture comprising: an adhesive material; and electrically conductive particles intermixed with the adhesive material, the electrically conductive particles being present in an amount between 0 and about 10% by weight of a total weight of the mixture, wherein the mixture has at least 50% of a lap shear strength as measured in accordance with ISO 4587 after curing for 72 hours at 22° C. as the raw adhesive material has as measured in accordance with ISO 4587 after curing for 72 hours at 22° C.
    Type: Grant
    Filed: May 21, 2008
    Date of Patent: January 1, 2013
    Assignee: International Business Machines Corporation
    Inventors: William Thomas Bandy, IV, Icko E. Tim Iben, Wayne Alan McKinley
  • Patent number: 8107196
    Abstract: A system in one embodiment includes a substrate; a thin film structure coupled to the substrate, the thin film structure comprising at least one of read transducers and write transducers; a closure; and an electrostatically dissipative adhesive coupling the closure to at least one of the thin film structure and the substrate. The adhesive comprises a mixture comprising: an adhesive material; and electrically conductive particles intermixed with the adhesive material, the electrically conductive particles being present in an amount between 0 and about 10% by weight of a total weight of the mixture. The closure defines at least a portion of a tape bearing surface. Additional systems and methods are also presented.
    Type: Grant
    Filed: May 21, 2008
    Date of Patent: January 31, 2012
    Assignee: International Business Machines Corporation
    Inventors: William Thomas Bandy, IV, Icko E. Tim Iben, Wayne Alan McKinley
  • Publication number: 20090290260
    Abstract: A system in one embodiment includes a substrate; a thin film structure coupled to the substrate, the thin film structure comprising at least one of read transducers and write transducers; a closure; and an electrostatically dissipative adhesive coupling the closure to at least one of the thin film structure and the substrate. The adhesive comprises a mixture comprising: an adhesive material; and electrically conductive particles intermixed with the adhesive material, the electrically conductive particles being present in an amount between 0 and about 10% by weight of a total weight of the mixture. The closure defines at least a portion of a tape bearing surface. Additional systems and methods are also presented.
    Type: Application
    Filed: May 21, 2008
    Publication date: November 26, 2009
    Inventors: William Thomas Bandy, IV, Icko E. Tim Iben, Wayne Alan McKinley
  • Publication number: 20090289231
    Abstract: An electrostatically dissipative adhesive in one embodiment includes a mixture comprising: an adhesive material; and electrically conductive particles intermixed with the adhesive material, the electrically conductive particles being present in an amount between 0 and about 10% by weight of a total weight of the mixture. An electrostatically dissipative adhesive in another embodiment includes a mixture comprising: an adhesive material; and electrically conductive particles intermixed with the adhesive material, the electrically conductive particles being present in an amount between 0 and about 10% by weight of a total weight of the mixture, wherein the mixture has at least 50% of a lap shear strength as measured in accordance with ISO 4587 after curing for 72 hours at 22° C. as the raw adhesive material has as measured in accordance with ISO 4587 after curing for 72 hours at 22° C.
    Type: Application
    Filed: May 21, 2008
    Publication date: November 26, 2009
    Inventors: William Thomas Bandy, IV, Icko E. Tim Iben, Wayne Alan McKinley
  • Patent number: 7223922
    Abstract: A cable having an electrostatic discharge (ESD) dissipative coating. The cable includes a lead and an ESD dissipative coating operatively coupled to the lead. Other layers such as adhesives and insulating layers can be provided. The ESD dissipative coating can also function as the insulator for the lead.
    Type: Grant
    Filed: July 28, 2004
    Date of Patent: May 29, 2007
    Assignee: International Business Machines Corporation
    Inventors: William Thomas Bandy, IV, Icko Eric Timothy Iben, Peter John Golcher, John Bradley Kriehn, Ho-Yiu Lam, Jeffrey Serrell Snyder, Larry LeeRoy Tretter, George G. Zamora