Patents by Inventor William Tze-You Chen
William Tze-You Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7199438Abstract: An optical semiconductor package includes a substrate, a chip, a plurality of bonding wires, a window, a supporter, and an encapsulant. The chip is disposed on the substrate and has an optical element. The bonding wires are used for electrically connecting the chip to the substrate. The window is supported on the supporter and positioned over the optical element of the chip. The encapsulant is overmolded on the substrate for fixing the window and encapsulating the chip and the bonding wires.Type: GrantFiled: September 23, 2003Date of Patent: April 3, 2007Assignee: Advanced Semiconductor Engineering, Inc.Inventors: Bernd Karl Appelt, William Tze-You Chen
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Patent number: 6891274Abstract: An under-bump-metallurgy layer is provided. The under-bump-metallurgy layer is formed over the contact pad of a chip and a welding lump is formed over the under-ball-metallurgy layer. The under-bump-metallurgy layer comprises an adhesion layer, a barrier layer and a wettable layer. The adhesion layer is directly formed over the contact pad. The barrier layer made from a material such as nickel-vanadium alloy is formed over the adhesion layer. The wettable layer made from a material such as copper is formed over the barrier layer. The wettable layer has an overall thickness that ranges from about 3 ?m to about 8 ?m.Type: GrantFiled: August 18, 2003Date of Patent: May 10, 2005Assignee: Advanced Semiconductor Engineering, Inc.Inventors: William Tze-You Chen, Ho-Ming Tong, Chun-Chi Lee, Su Tao, Jeng-Da Wu, Chih-Huang Chang, Po-Jen Cheng
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Patent number: 6864168Abstract: A bump structure on a contact pad and a fabricating process thereof. The bump comprises an under-ball-metallurgy layer, a bonding mass and a welding lump. The under-ball-metallurgy layer is formed over the contact pad and the bonding mass is formed over the under-ball-metallurgy layer by conducting a pressure bonding process. The bonding mass having a thickness between 4 to 10 ?m is made from a material such as copper. The welding lump is formed over the bonding mass such that a sidewall of the bonding mass is also enclosed.Type: GrantFiled: August 18, 2003Date of Patent: March 8, 2005Assignee: Advanced Semiconductor Engineering, Inc.Inventors: William Tze-You Chen, Ho-Ming Tong, Chun-Chi Lee, Su Tao, Chih-Huang Chang, Jeng-Da Wu, Wen-Pin Huang, Po-Jen Cheng
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Patent number: 6838806Abstract: A gyroscope comprising: a proof mass; a frame supporting the proof mass; a connection arrangement connecting the proof mass and the frame, the connection arrangement having a first stiffness in a first direction and a second stiffness in a second direction substantially perpendicular to the first direction, one of the stiffness being significantly greater than the other stiffness; and a pair of elements adapted to sense relatively motion therebetween in either the first or the second direction.Type: GrantFiled: January 2, 2002Date of Patent: January 4, 2005Assignees: Agency for Science, Technology and Research, National University of SingaporeInventors: Bee Lee Chua, Holden King Ho Li, Yuan Xu, Francis Eng Hock Tay, William Tze-You Chen
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Patent number: 6819002Abstract: An under-ball-metallurgy layer between a bonding pad on a chip and a solder bump made with tin-based material is provided. The under-ball-metallurgy layer at least includes an adhesion layer over the bonding pad, a nickel-vanadium layer over the adhesion layer, a wettable layer over the nickel-vanadium layer and a barrier layer over the wettable layer. The barrier layer prevents the penetration of nickel atoms from the nickel-vanadium layer and reacts with tin within the solder bump to form inter-metallic compound. This invention also provides an alternative under-ball-metallurgy layer that at least includes an adhesion layer over the bonding pad, a wettable layer over the adhesion layer and a nickel-vanadium layer over the wettable layer. The nickel within the nickel-vanadium layer may react with tin within the solder bump to form an inter-metallic compound.Type: GrantFiled: August 18, 2003Date of Patent: November 16, 2004Assignee: Advanced Semiconductor Engineering, Inc.Inventors: William Tze-You Chen, Ho-Ming Tong, Chun-Chi Lee, Su Tao, Jeng-Da Wu, Chih-Huang Chang, Po-Jen Cheng
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Publication number: 20040113273Abstract: An under-bump-metallurgy layer is provided. The under-bump-metallurgy layer is formed over the contact pad of a chip and a welding lump is formed over the under-ball-metallurgy layer. The under-bump-metallurgy layer comprises an adhesion layer, a barrier layer and a wettable layer. The adhesion layer is directly formed over the contact pad. The barrier layer made from a material such as nickel-vanadium alloy is formed over the adhesion layer. The wettable layer made from a material such as copper is formed over the barrier layer. The wettable layer has an overall thickness that ranges from about 3 &mgr;m to about 8 &mgr;m.Type: ApplicationFiled: August 18, 2003Publication date: June 17, 2004Inventors: William Tze-You Chen, Ho-Ming Tong, Chun-Chi Lee, Su Tao, Jeng-Da Wu, Chih-Huang Chang, Po-Jen Cheng
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Publication number: 20040113272Abstract: A bump structure on a contact pad and a fabricating process thereof. The bump comprises an under-ball-metallurgy layer, a bonding mass and a welding lump. The under-ball-metallurgy layer is formed over the contact pad and the bonding mass is formed over the under-ball-metallurgy layer by conducting a pressure bonding process. The bonding mass having a thickness between 4 to 10 &mgr;m is made from a material such as copper. The welding lump is formed over the bonding mass such that a sidewall of the bonding mass is also enclosed.Type: ApplicationFiled: August 18, 2003Publication date: June 17, 2004Inventors: WILLIAM TZE-YOU CHEN, HO-MING TONG, CHUN-CHI LEE, SU TAO, CHIH-HUANG CHANG, JENG-DA WU, WEN-PIN HUANG, PO-JEN CHENG
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Publication number: 20040104484Abstract: An under-ball-metallurgy layer between a bonding pad on a chip and a solder bump made with tin-based material is provided. The under-ball-metallurgy layer at least includes an adhesion layer over the bonding pad, a nickel-vanadium layer over the adhesion layer, a wettable layer over the nickel-vanadium layer and a barrier layer over the wettable layer. The barrier layer prevents the penetration of nickel atoms from the nickel-vanadium layer and reacts with tin within the solder bump to form inter-metallic compound. This invention also provides an alternative under-ball-metallurgy layer that at least includes an adhesion layer over the bonding pad, a wettable over the adhesion layer and a nickel-vanadium layer over the wettable layer. The nickel within the nickel-vanadium layer may react with tin within the solder bump to form an inter-metallic compound.Type: ApplicationFiled: August 18, 2003Publication date: June 3, 2004Inventors: William Tze-You Chen, Ho-Ming Tong, Chun-Chi Lee, Su Tao, Jeng-Da Wu, Chih-Huang Chang, Po-Jen Cheng
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Publication number: 20040065949Abstract: A flip chip interconnect structure is formed on a bump pad of a chip, and includes an under bump metallurgy (UBM) formed on the bump pad, and a solder bump formed on the UBM. The solder bump includes tin and is further doped with metallic particles that are capable of reacting with tin in the solder bump to from an inter-metallic compound due to a thermal effect produced in use of a later fabrication process or an operation on the chip. Furthermore, the material of the metal particles is selected from a group consisting of copper, silver and nickel.Type: ApplicationFiled: May 6, 2003Publication date: April 8, 2004Inventors: William Tze-You Chen, Ho-Ming Tong, Chun-Chi Lee, Su Tao, Jeng-Da Wu, Chih-Huang Chang, Po-Jen Cheng
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Publication number: 20020167248Abstract: A gyroscope comprising: a proof mass; a frame supporting the proof mass; a connection arrangement connecting the proof mass and the frame, the connection arrangement having a first stiffness in a first direction and a second stiffness in a second direction substantially perpendicular to the first direction, one of the stiffness being significantly greater than the other stiffness; and a pair of elements adapted to sense relatively motion therebetween in either the first or the second direction.Type: ApplicationFiled: January 2, 2002Publication date: November 14, 2002Inventors: Bee Lee Chua, Holden King Ho Li, Yuan Xu, Eng Hock Tay, William Tze-You Chen
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Patent number: 6429530Abstract: A semiconductor package arrangement and, more particularly, a light weight and miniaturized electronic package or module, wherein the dimensions between an integrated circuit comprising a semiconductor chip and those of a chip carrier have been optimized in order to provide for minimum weight and size relationships. Furthermore, disclosed is a method of forming the semiconductor package arrangement so as to produce a small, lightweight and essentially miniaturized chip-sized chip carrier package module. The chip carrier, which may be an organic laminate, multi-layer ceramic substrate or flexible substrate, as required by specific applications, is basically designed to possess overall smaller peripheral dimensions than those of the integrated circuit or semiconductor chip which is adapted to be mounted thereon.Type: GrantFiled: November 2, 1998Date of Patent: August 6, 2002Assignee: International Business Machines CorporationInventor: William Tze-You Chen
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Patent number: 6403882Abstract: A chip package includes a die having an active surface and an inactive surface. An adhesive is formed on the inactive surface where the adhesive has a low Young's modulus of elasticity. The low Young's modulus of elasticity may be 10,000 psi or less; 1,000 psi or less; or, preferably, about 1,000 psi. Further, the adhesive may include a thermal conducting material. A protective plate is coupled to the inactive surface using the adhesive and a chip carrier is coupled to the active surface of the die.Type: GrantFiled: June 30, 1997Date of Patent: June 11, 2002Assignee: International Business Machines CorporationInventors: William Tze-You Chen, Michael Anthony Gaynes, Eric Arthur Johnson, Tien Yue Wu
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Patent number: 6013355Abstract: Registration of the layers in a multilayer electronic device is tested and measured by X-ray moire interferometry.Type: GrantFiled: December 30, 1996Date of Patent: January 11, 2000Assignee: International Business Machines Corp.Inventors: William Tze-You Chen, Douglas Howard Strope, Natalie Barbara Feilchenfeld, Yifan Guo, George Dean Ogden
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Patent number: 5709336Abstract: A dendrite surface is provided on each of the electrical contacts of a substrate, such as a test board, chip carrier, or printed wiring board. The electrical contacts on the substrate are arranged in a mirror image of the input/output pads on a wirebond chip from which the wire leads have been removed from, or not initially provided on, each of the input/output pads. The wirebond chip is aligned with the substrate, and the respective contact brought into electrical communication with each other. The wirebond chip may be removed after testing or other temporary attachment purpose, or permanently encapsulated with at least a portion of the substrate in a permanent assembly. The present invention permits wirebond chips to be selectively attached temporarily or permanently, i.e., have a pluggable capability, as well as the ability to allow a full array of I/O pad design.Type: GrantFiled: May 31, 1996Date of Patent: January 20, 1998Assignee: International Business Machines CorporationInventors: Anthony Paul Ingraham, William Tze-You Chen