Abstract: An apparatus and method for an adhesive assembly for securing a printed circuit board to a substrate. The assembly provides a printing tool with a plurality of apertures defined therethrough. Preferably, the apertures have a top opening with a larger area than a bottom opening. The printing tool is placed upon one of the printed circuit board and/or substrate, and a liquid adhesive is printed onto the printing tool. The liquid adhesive forms islands of adhesive within each aperture. Removing the printing tool deforms each island to form a raised edge at a periphery of each island. A temporary liner can be placed on the raised edges to protect the adhesive until the printed circuit board can be assembled with the substrate.

Abstract: A method for vertical removal of excess solder from a circuit substrate includes the use of a sacrificial circuit substrate with a plurality of pads and vias that are solder-wettable. The pads and vias of the sacrificial circuit substrate are placed in vertical proximity to the excess solder of the circuit substrate. The excess solder is heated until it is liquid, wherein the excess solder is wicked vertically onto the pads and into the vias of the sacrificial circuit substrate. Thereafter, the sacrificial circuit substrate is lifted from the proximity of the circuit substrate while the solder is in a liquid, taking the excess solder with it but leaving a predetermined amount on the circuit substrate.

Abstract: A multilayered electrical interconnect circuit whereby interconnect lines, placed in channel regions throughout a rerouting substrate, function to reroute densely packaged electrical components via geometrically uniform spot links placed upon only the surface layer within each channel region. The interconnect circuit has closely spaced parallel X-and Y-lines orthogonal to one another, each X- and Y-line placed within horizontal and vertical channel regions, respectively, such that electrical connections between closely spaced large-scale integrated circuits or discrete electrical components can be rerouted with a combination of one or more X- and/or Y-lines.

Abstract: A customizable interconnect circuit wherein a universal substrate of minimum layers is completely customized by programmable conductive links placed only on the top layer of the substrate. The customizable circuit having high density of orthogonally placed X- and Y-conductors capable of interconnecting closely spaced large-scale integrated circuits or discrete electrical components. By utilizing a plurality of interconnect cells regularly spaced throughout a universal, fixed substrate, interconnect routing from overlying electrical components or integrated circuits can be more directly routed to target areas.