Abstract: An apparatus includes a top plate and an extension card surrounding a space for a small electronic assembly. The extension card and small electronic assembly are mounted to the top plate. The apparatus includes a plurality of test probes extending through the top plate and moving relative to the top plate. A portion of the test probes are positioned to contact the extension card and a portion are positioned to contact the small electronic assembly when the test probes move with respect to the top plate. The apparatus includes a vacuum box in contact with the top plate and surrounding the extension card and small electronic assembly. The top plate moves relative to the test probes so the test probes contact the extension card and the small electronic assembly in response to a vacuum force evacuating an area under the top plate and within the vacuum box.

Abstract: An apparatus for a component rework nozzle includes a nozzle with a proximal end spaced apart from a distal end along an axis. The proximal end is sized to partially enclose a component during a component rework process. The component is disposed on a substrate by way of a plurality of solder joints. The apparatus includes an indentation defined in a side of the nozzle. The side of the nozzle is parallel to the axis. The indentation is shaped to maintain a separation between the nozzle and a neighboring component. The neighboring component is disposed adjacent to the component on the substrate. The apparatus includes a plurality of notches disposed on the proximal end of the nozzle. The plurality of notches are formed to balance heat distribution, during the component rework process, across the component.

Abstract: An apparatus includes a top plate and an extension card surrounding a space for a small electronic assembly. The extension card and small electronic assembly are mounted to the top plate. The apparatus includes a plurality of test probes extending through the top plate and moving relative to the top plate. A portion of the test probes are positioned to contact the extension card and a portion are positioned to contact the small electronic assembly when the test probes move with respect to the top plate. The apparatus includes a vacuum box in contact with the top plate and surrounding the extension card and small electronic assembly. The top plate moves relative to the test probes so the test probes contact the extension card and the small electronic assembly in response to a vacuum force evacuating an area under the top plate and within the vacuum box.

Abstract: An apparatus for a component rework nozzle includes a nozzle with a proximal end spaced apart from a distal end along an axis. The proximal end is sized to partially enclose a component during a component rework process. The component is disposed on a substrate by way of a plurality of solder joints. The apparatus includes an indentation defined in a side of the nozzle. The side of the nozzle is parallel to the axis. The indentation is shaped to maintain a separation between the nozzle and a neighboring component. The neighboring component is disposed adjacent to the component on the substrate. The apparatus includes a plurality of notches disposed on the proximal end of the nozzle. The plurality of notches are formed to balance heat distribution, during the component rework process, across the component.

Abstract: Methods and arrangements to attach a QFN to a PCB, systems which include a QFN attached to a PCB, and apparatuses for controlling the deposit of solder upon a PCB are disclosed. Embodiments include transformations, code, state machines or other logic to calculate a total area for the QFN IO pads. Embodiments may then determine a total area for the regions of solder applied to the PCB thermal pad to which the QFN thermal pad may be connected in dependence upon the calculated total area for the QFN IO pads. In some embodiments, the total area of the solder regions applied to the PCB thermal pad is approximately equal to the calculated total area for the QFN IO pads. In many embodiments, the number of regions of solder and the shape of the regions of solder is determined.