Abstract: Eliminating exposure of PN junctions to light capable of invoking a photovoltaic effect and/or inhibiting the oxidation and reduction reactions induced by the photovoltaic effect prevents the electrochemical dissolution of metal components on semiconductor devices by electrolysis. A darkened enclosure for use on tools for wafer CMP, brush cleaning, unloading, and rinsing will eliminate exposure. Alternatively, illumination of a semiconductor wafer can be limited to wavelengths of light that do not provide enough energy to induce a photovoltaic effect. An inhibitor in the CMP slurry and/or post-CMP water rinse blocks the oxidation and/or reduction reactions. A blocking agent, such as a high molecular weight surfactant, will interfere with both the oxidation and reduction reactions at the metal surface. Also, a poisoning agent will impede the reduction portion of electrolysis.

Abstract: Eliminating exposure of PN junctions to light capable of invoking a photovoltaic effect and/or inhibiting the oxidation and reduction reactions induced by the photovoltaic effect prevents the electrochemical dissolution of metal components on semiconductor devices by electrolysis. A darkened enclosure for use on tools for wafer CMP, brush cleaning, unloading, and rinsing will eliminate exposure. Alternatively, illumination of a semiconductor wafer can be limited to wavelengths of light that do not provide enough energy to induce a photovoltaic effect. An inhibitor in the CMP slurry and/or post-CMP water rinse blocks the oxidation and/or reduction reactions. A blocking agent, such as a high molecular weight surfactant, will interfere with both the oxidation and reduction reactions at the metal surface. Also, a poisoning agent will impede the reduction portion of electrolysis.

Abstract: Certain alloys of CoFeCu are provided in film and laminate form which have a unique combination of electromagnetic properties which enable them to be used as magnetic thin films in magnetic recording heads, shields and flux guides. The films and laminates thereof are electrodeposited from a plating bath in a DC or pulsed current electrodeposition process.

Abstract: An acidic electrolytic solution for use in the electrodeposition of copper-rich alloys on a substrate, the less noble component being incorporated by underpotential deposition. The solution includes a first salt containing copper cations; a second salt containing cations of a metal less noble than copper; and an acid electrolyte (e.g., methane sulfonic acid) such that at typical current densities the potential is in the range of underpotential deposition of the less noble metal on the copper.Also provided is a process for using the acidic electrolytic solution.

Abstract: A method for measuring concentrations of addition agents in solutions of additive mixtures, namely for monitoring additives in PbSn plating solutions, comprising the steps of: (a) preparing a basis solution which contains an electroactive species whose electroreduction reaction is sensitive to the additive of interest; (b) preparing calibration standard sample solutions comprising appropriate concentrations of all species other than the additive; (c) preparing the working solution whose additive concentration is to be determined; (d) applying a pulse voltammetry technique, at a hanging Hg drop electrode, to a sample of the basis solution located in a cell of a polarographic analyzer; (e) thereafter measuring the polarographic peak height for the indicator reaction in the basis solution; (f) adding a measured amount of the working solution to the basis solution sample in the cell; (g) thereafter measuring the peak height for the indicator reaction in the mixed solution of step (f); and (h) repeating steps (f)

Abstract: A cyclic voltammetric method for measuring concentrations of subcomponents of additive mixtures, comprising the steps of: (a) preparing a basis solution which contains all of the components of an unknown solution to be measured, except a component of interest; (b) preparing a calibration solution which contains the component of interest in a known concentration near that which would be expected in the unknown solution; (c) adding measured amounts of the calibration solution to a first defined volume of the basis solution and plotting a first cathodic charge against the added volume of the calibration standard; (d) adding measured amounts of the unknown solution to a second volume of the basis solution and plotting a second cathodic charge against the added volume of the unknown solution; and (e) comparing the slopes of the first and second curves to determine the concentration of the component of interest in the unknown solution.

Abstract: This invention relates to the prevention of mechanical and electrical failures in structures that are heat-treated, and more particularly relates to the use of coating layers containing Co and P on corrosible materials such as Cu. The invention has significant utility in the protection of Cu current-carrying lines in electronic structures that comprise multi layers that are subjected to heat treatments that would normally adversely affect the Cu lines. The CoP coating layer also acts to prevent interdiffusion between Cu and contact metals, such as Au.