Abstract: The invention relates to the field of machine elements for designing a composite of two parts, one of which is a rare-earth permanent magnet and the other of which is a metallic support.

Abstract: The invention relates to a one-component epoxy resin adhesive which is elasticated with silicone rubber and whose open joint time is adaptable to whichever production process it is being used in by the concentration of UV initiator and/or the duration and/or intensity of UV activation and which is therefore particularly suitable for automatable manufacturing processes, since the workpieces after initial fixing require no additional mounts even during thermal aftercuring. This adhesive is preferentially suitable for the extensive adhesive bonding of permanent magnets, such as in the assembly of a permasyn motor, for example.

Abstract: An attenuating structure composed of an epoxy resin which cationically cures with UV initiation is proposed for a surface wave component. The solvent-free epoxy resin is based on a cycloaliphatic epoxide and is applied to the wafer by screen printing. When the wafers are sawn up, sawing through can be carried out without detaching or splintering off the attenuating material. Attenuation and corrosion behavior of the attenuating structures fulfill the requirements for surface wave filters.

Abstract: For improved flame retardant finishing and better processability of an epoxy anhydride reaction resin system, the present invention provides a reaction resin system supplemented with phosphinic and/or phosphonic acid anhydride as the hardener component. The phosphorus-containing anhydrides do not deteriorate the hardening characteristics. Molded members manufactured therefrom exhibit adequate flame retardant behavior even with slight proportions of phosphinic or phosphonic acid anhydride given a property profile that is otherwise unmodified.

Abstract: A flame-resistant, UV-curable single-component reactive resin system comprises a phosphorus-containing acrylate, another unsaturated compound which can undergo free radical copolymerization with acrylates and a free radical initiator system.

Abstract: A one-component reactive resin system which is stable in storage but nevertheless can readily be cured completely comprises a mixture of commercially available epoxy resins and phosphorus-containing glycidyl esters, in particular phosphonic acid diglycidyl esters, as well as cationic photoinitiators. The low-viscosity reactive resin systems cannot be cured purely by means of heat and can be processed at high temperatures and in particular can have a high filler content. The reactive resin systems, which are stable to storage even after UV activation, can be cured to flame-resistant molded materials under moderate conditions.

Abstract: A halogen free casting resin suitable for covering electron devices with a fire retardant material contains an acidic ester of an hydroxy-functional phosphor compound and an organic anhydride. A stable mixture can be generated from the acidic ester and the hardener component of the casting resin, and further used for the hardening of epoxides resins. The acidic ester is chemically integrated in the epoxide resin matrix in a stable mixture, thereby improving the long term fire-retardancy of the casting resin molding compound without increasing the volatility of the mixture.

Abstract: Heat-stable structured layers can be manufactured through the application of radiation-sensitive soluble polymers in the form of a layer or film on a substrate, irradiation of the layer respectively film through negative patterns with actinic light or through the use of a light, electron, laser, or ion beam, removal of the non-irradiated layer respectively film parts and, if necessary, through subsequent tempering, in a cost-effective way in dimension-precise and high-quality form and in a single application process, when the polymers used are photopolymers in the form of addition reaction products of olefinic unsaturated monoisocyates with phenolformaldehyde resins. The layers produced with this method resist even high thermal and mechanical stress in immersion soldering processes and protect circuit surfaces effectively and permanently against moisture and corrosion; they are therefore suitable for use, in particular as solder resist and insulating layers in microelectronics.

Abstract: A method of manufacturing heat-stable structured layers by applying a radiation-sensitive soluble photopolymer in the form of a layer or film on a substrate, irradiating the layer or film through a negative pattern with actinic light or through the use of a light, electron, laser, or ion beam, removing the non-irradiated layer or film parts and, optionally tempering the remaining parts is described wherein the photopolymer comprises an addition reaction product of an olefinically unsaturated monoisocyanate and a hydroxyl group-containing epoxy compound. The invention provides a cost-effective method of manufacturing dimension-precise structured layers of high quality in a single coating process. The layers produced with this method even resist high thermal and mechanical stresses in immersion soldering processes, and protect circuit surfaces effectively and permanently against moisture and corrosion. They are suitable for use, in particular, as solder resist and insulating layers in microelectronics.

Abstract: A cost-efficient method for producing dimensionally precise and high-grade heat-resistent structured layers by applying a single coating of a radiation-sensitive soluble polyether-based photopolymer in the form of a layer or foil on a substrate; irradiating the layer or foil through a negative with actinic light or by guiding a light, electron, laser, or ion beam; removing the nonirradiated layer or foil portions; and subsequent optional annealing, wherein the photopolymer comprises an addition product of an olefin-unsaturated monoisocyanate and a polether having at least one hydroxyl group. The layers provided according to the invention can withstand the thermal and mechanical stresses of dip soldering process, and protect circuit surfaces effectively and durably against moisture and corrosion; they are therefore suitable in particular as solder resist and insulating layers in microconductor technology.

Abstract: A polyether-based photopolymer, which can be produced inexpensively and without costly purification operations comprises an addition product of an olefin-unsaturated monoisocyanate and a polyether having at least one hydroxyl group. The photopolymer is suitable for use in circuit and transmission line applications as a protective and insulating layer.

Abstract: The chemical plotting of boundary layer flows in liquids with the use of uncompacted, coated, anodically oxidized aluminum surfaces is effected using a colored or uncolored liquid or a coating or pointillization with a substance, preferably a dye, soluble in water or organic media and which can be included or adsorbed in the eloxal layer.The process serves to plot boundary layer flows in water, organic media and oils in a wide temperature range.