Abstract: The present disclosure relates to methods, compositions, and kits for concentrating and purifying at least one target analyte from a clinical biological sample. In some embodiments, the methods involve one or more aqueous two-phase system (ATPS) compositions and at least one solid phase medium. Some embodiments provide a kit comprising one or more ATPS compositions, a binding buffer; and a solid phase medium. Other embodiments provide methods of treating cancers or infectious diseases in a patient in need thereof.

Abstract: The present disclosure relates to methods of administering Compound I for treating fibrotic disorders, inflammatory disorders or autoimmune disorders.

Abstract: A method for manufacturing a light emitting diode (LED) structure is provided. A driving circuit having a plurality of contact pads is formed in a first substrate. A plurality of metal contacts is formed on the first substrate, each metal contact being located on one of the plurality of contact pads. A nonconductive adhesive layer is formed on the first substrate covering the plurality of contact pads and the plurality of metal contacts. A plurality of LED units is formed on the nonconductive adhesive layer. Each LED unit is electrically connected to one of the plurality of contact pads through one of the plurality of metal contacts.

Abstract: A LED structure includes a substrate, a plurality of LED units, a bonding layer and a metal contact. The substrate includes a driving circuit, and a plurality of LED units is formed on the substrate. The bonding layer is formed between the substrate and the plurality of LED units, and the metal contact is formed in the bonding layer beneath each LED unit to electrically connect each LED unit with a contact pad of the driving circuit. A first sectional area of the metal contact is smaller than a second sectional area of each LED unit.

Abstract: A standalone Storage Controller with PCIe Multi-Mode capability that can be configured as PCIe Root-Complex (RC), an End-Point (EP) or a bridge (BR). In EP mode, the Storage Controller acts like a regular PCIe slaved controller which is connected to a PCIe Root-Complex provided by a Host via a PCIe port. While in RC mode, the Storage Controller acts as a PCIe configuration and management entity, a Host acting as a PCIe Root-Complex, which an add-in card or chip can attach to via a PCIe port that is provided by the Storage Controller, supporting any type of Network Device Interface, without an external Root-Complex. While in bridge mode, the Storage Controller can act as a transparent or non-transparent bridge with either a Root-Complex or End-Point port for the internal connection to the bridge.

Abstract: A Multiprotocol Storage Controller (MPSC) System on a Chip (SOC) comprising multiple heterogeneous network interface ports, a switch core, a global memory mapper and a frame router. The interface ports capable of interconnecting networks of devices with differing data and signaling protocols and differing number of data and signal lines.

Abstract: The present disclosure relates to methods of administering Compound I for treating fibrotic disorders, inflammatory disorders or autoimmune disorders.

Abstract: A Multiprotocol Storage Controller (MPSC) System on a Chip (SOC) comprising multiple heterogeneous network interface ports, a switch core, a global memory mapper and a frame router. The interface ports capable of interconnecting networks of devices with differing data and signaling protocols and differing number of data and signal lines.

Abstract: A LED structure includes a substrate, a LED driving circuit, a plurality of conductive pads, and a first LED set. The LED driving circuit is formed in the substrate, and the LED driving circuit includes a plurality of contacts. The plurality of conductive pads are formed on the LED driving circuit, and each conductive pad of the plurality of conductive pads is disposed on a corresponding contact of the plurality of contacts. The first LED set includes a plurality of LED units disposed on a first conductive pad of the plurality of conductive pads. The plurality of LED units of the first LED set are in electric contact with the corresponding contact through the first conductive pad.

Abstract: The present disclosure relates to methods of administering Compound I for treating fibrotic disorders, inflammatory disorders or autoimmune disorders.

Abstract: A LED structure includes a substrate, a first semiconductor layer, a second semiconductor layer, and a color conversion layer. The first semiconductor layer is formed on the substrate, and the first semiconductor layer includes a first LED unit and a second LED unit formed therein. The first LED unit and the second LED unit emit light of a first color. The second semiconductor layer is formed above the first semiconductor layer, and the second semiconductor layer includes a third LED unit formed therein. The third LED unit emits light of a second color different from the first color. The color conversion layer is formed on the first LED unit to convert light of the first color to light of a third color different from the first color and the second color.

Abstract: A standalone Storage Controller with PCIe Multi-Mode capability that can be configured as PCIe Root-Complex (RC), an End-Point (EP) or a bridge (BR). In EP mode, the Storage Controller acts like a regular PCIe slaved controller which is connected to a PCIe Root-Complex provided by a Host via a PCIe port. While in RC mode, the Storage Controller acts as a PCIe configuration and management entity, a Host acting as a PCIe Root-Complex, which an add-in card or chip can attach to via a PCIe port that is provided by the Storage Controller, supporting any type of Network Device Interface, without an external Root-Complex. While in bridge mode, the Storage Controller can act as a transparent or non-transparent bridge with either a Root-Complex or End-Point port for the internal connection to the bridge.

Abstract: A LED structure includes a substrate, a plurality of LED units, a bonding layer and a metal contact. The substrate includes a driving circuit, and a plurality of LED units is formed on the substrate. The bonding layer is formed between the substrate and the plurality of LED units, and the metal contact is formed in the bonding layer beneath each LED unit to electrically connect each LED unit with a contact pad of the driving circuit. A first sectional area of the metal contact is smaller than a second sectional area of each LED unit.

Abstract: The LED structure includes a substrate and a plurality of LED units formed on the substrate. Each LED unit includes a bonding layer formed on the substrate, a first doping type semiconductor layer formed on the bonding layer, a second doping type semiconductor layer formed on the first doping type semiconductor layer, a passivation layer formed on the second doping type semiconductor layer and a portion of the first doping type semiconductor layer; and an electrode layer formed on a portion of the passivation layer and contacting the second doping type semiconductor layer. The plurality of LED units include a first LED unit and a second LED unit adjacent to the first LED unit. The first doping type semiconductor layer of the first LED unit horizontally extends to the first doping type semiconductor layer of the second LED unit adjacent to the first LED unit, and the first LED unit and the second LED unit are individually functionable LED units.

Abstract: A LED structure includes a substrate, a LED unit formed on the substrate, a first reflector layer formed between the substrate and the LED unit, and a second reflector layer formed on the LED unit. A common anode layer of the LED unit is formed on the first reflector layer. The first reflector layer, the LED unit and the second reflector layer are configured to collectively provide a resonant cavity.

Abstract: A LED structure includes a substrate, a bonding layer, a first doping type semiconductor layer, a multiple quantum well (MQW) layer, a second doping type semiconductor layer, a passivation layer and an electrode layer. The bonding layer is formed on the substrate, and the first doping type semiconductor layer is formed on the bonding layer. The MQW layer is formed on the first doping type semiconductor layer, and the second doping type semiconductor layer is formed on the MQW layer. The second doping type semiconductor layer includes an isolation material made through implantation, and the passivation layer is formed on the second doping type semiconductor layer. The electrode layer is formed on the passivation layer in contact with a portion of the second doping type semiconductor layer through a first opening on the passivation layer.

Abstract: The present invention relates to specific thermoplastic polyurethane moulding compounds having improved resistance to mechanical stress, especially scratching, and improved resistance to soiling by standard household chemicals and coloured foodstuffs and having very little blocking of electronic and radio signals.

Abstract: The present invention relates to a thermoplastic polyurethane composition and use thereof. The thermoplastic polyurethane composition comprises a polyurethane prepared from a polyester polyol and a polyisocyanate as well as an antioxidant. The thermoplastic polyurethane composition of the present invention can be used with other thermoplastic polymers in melt spinning process to prepare bicomponent fibers.

Abstract: A stack of strata containing LEDs is fabricated by repeatedly bonding unpatterned epitaxial structures. Because the epitaxial structures are unpatterned (e.g., not patterned into individual micro LEDs), requirements on alignment are significantly relaxed. One example is an integrated multi-color LED display panel, in which arrays of micro LEDs are integrated with corresponding driver circuitry. Multiple strata of micro LEDs are stacked on top of a base substrate that includes the driver circuitry. In this process, each stratum is fabricated as follows. An unpatterned epitaxial structure is bonded on top of the existing device. The epitaxial structure is then patterned to form micro LEDs. The stratum is filled and planarized to allow the unpatterned epitaxial structure of the next stratum to be bonded. This is repeated to build up the stack of strata.

Abstract: A semiconductor apparatus includes a driver circuit wafer including a plurality of driver circuits arranged in an array, a bonding metal layer formed over the driver circuit wafer, and a horizontally continuous functional device epi-structure layer formed over the bonding metal layer and covering the driver circuits.