Patents by Inventor Wolfgang Diem

Wolfgang Diem has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Bispecific antibodies against CD3EPSILON and ROR1
    Patent number: 11952421
    Abstract: The present invention relates to bispecific antibodies against ROR1 and CD3, their manufacture and use.
    Type: Grant
    Filed: October 8, 2015
    Date of Patent: April 9, 2024
    Assignee: Bristol-Myers Squibb Company
    Inventors: Minh Diem Vu, Klaus Strein, Oliver Ast, Tanja Fauti, Anne Freimoser-Grundschober, Ralf Hosse, Christian Klein, Ekkehard Moessner, Samuel Moser, Ramona Murr, Pablo Umana, Sabine Jung-Imhof, Stefan Klostermann, Michael Molhoj, Joerg Regula, Wolfgang Schaefer
  • Process for producing a vacuum interrupter chamber
    Patent number: 5222651
    Abstract: A process for producing a vacuum interrupter chamber includes placing spacers in bodily contact with a soldering foil and joining the spacers to the soldering foil or fixing them in a displacement-proof fashion on specially made dents in the foil, so that they can be fixed for the purpose of a reliable and simple assembly. Degassing gaps are left between soldering spacers, on which a cover of the interrupter chamber rests. The vacuum interrupter chamber is evacuated in a single furnace cycle and soldered.
    Type: Grant
    Filed: September 24, 1990
    Date of Patent: June 29, 1993
    Assignees: Calor-Emag Elektrizitaets-Aktiengesellschaft, Degussa AG
    Inventors: Gunter Pilsinger, Joseph Lipperts, Wolfgang Diem
  • Solid state bonding of ceramic and metal parts
    Patent number: 4470537
    Abstract: For solid state bonding, the faces of ceramic and metal parts to be bonded re placed together, acted upon by a gage pressure if desired, and are heated to a bonding temperature which is under their melting temperatures so that an inbetween or intermediate layer is formed between the two parts. For increasing the bond strength the metal used is one undergoing a phase transition on cooling down from the bonding temperature, the phase in existence at the bonding temperature having a smaller volume than the phase stable at room temperature, so that the decrease in the volume of the metal as dependent on the coefficient of thermal expansion is balanced at least to some degree by the volume change on phase transition.
    Type: Grant
    Filed: August 4, 1982
    Date of Patent: September 11, 1984
    Assignee: Max-Planck-Gesellschaft zur Forderung der Wissenschaften e.V.
    Inventors: Wolfgang Diem, Gerhard Elssner