Patents by Inventor Wolfgang Fricke

Wolfgang Fricke has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20120288629
    Abstract: A device 1 for the application of coating agents in the edge area of the small sides of workpieces 8 comprises a conveyance device 2, a coating roller 3, and at least two coating stamps 4. The coating roller 3 and/or the coating stamps 4 is/are advanced to the workpiece 8 with the help of pneumatic cylinders 6. The coating roller 3 and the coating stamps 4 in each case include a spraying device 5. The spraying processes of the coating roller 3 and of the coating stamps 4 are in each case pneumatically controllable.
    Type: Application
    Filed: May 11, 2012
    Publication date: November 15, 2012
    Applicants: 3H-Lacke GmbH, LCM GmbH
    Inventors: Daniel Ludewig, Wolfgang Fricke
  • Patent number: 8115808
    Abstract: A coordinate measuring machine is disclosed having an orientor automatically orienting a substrate associated therewith. A control and computing unit is further associated with the coordinate measuring machine, so that self-calibration may be performed on the basis of at least two different and automatically set orientations of the substrate.
    Type: Grant
    Filed: June 25, 2008
    Date of Patent: February 14, 2012
    Assignee: Vistec Semiconductor Systems GmbH
    Inventors: Wolfgang Fricke, Klaus Rinn, Slawomir Czerkas
  • Patent number: 7978340
    Abstract: A system and a method for determining positions of structures on a substrate are disclosed. The system includes at least one measurement table (20) movable in the X-coordinate direction and in the Y-coordinate direction, a measurement objective (9) and a camera for determining the positions of the structures (3) on the substrate (2). The position of the measurement objective (9) and/or the measurement table (20) may be determined by at least one interferometer (24). The system is surrounded by a housing representing a climatic chamber (50) provided with an active pressure regulation.
    Type: Grant
    Filed: July 31, 2008
    Date of Patent: July 12, 2011
    Assignee: Vistec Semiconductor Systems GmbH
    Inventors: Hans-Artur Boesser, Wolfgang Fricke, Michael Heiden
  • Patent number: 7584072
    Abstract: A method for allocating correction values of the degree of bending of a substrate (2) relative to a coordinate system (40) of a coordinate measuring machine (1) is disclosed. The positions of the at least two reference marks (32) on the substrate holder (27) are automatically determined relative to the coordinate system (40) of the coordinate measuring machine (1) for each substrate (2) currently placed in the substrate holder (27) in the coordinate measuring machine (1).
    Type: Grant
    Filed: June 27, 2008
    Date of Patent: September 1, 2009
    Assignee: Vistec Semiconductor Systems GmbH
    Inventors: Wolfgang Fricke, Linda Gundal
  • Patent number: 7551296
    Abstract: A method for determining the focal position of at least two edges of structures (31) on a substrate (30) is disclosed. During the movement of a measurement objective (21) in the Z-coordinate direction, a plurality of images of the at least one structure (31) is acquired with at least one measurement window (45) of a detector. An intensity profile of the structure (31) is determined for each image.
    Type: Grant
    Filed: March 1, 2008
    Date of Patent: June 23, 2009
    Assignee: Vistec Semiconductor Systems GmbH
    Inventors: Hans-Artur Boesser, Wolfgang Fricke, Klaus-Dieter Adam
  • Publication number: 20090033508
    Abstract: A system and a method for determining positions of structures on a substrate are disclosed. The system includes at least one measurement table (20) movable in the X-coordinate direction and in the Y-coordinate direction, a measurement objective (9) and a camera for determining the positions of the structures (3) on the substrate (2). The position of the measurement objective (9) and/or the measurement table (20) may be determined by at least one interferometer (24). The system is surrounded by a housing representing a climatic chamber (50) provided with an active pressure regulation.
    Type: Application
    Filed: July 31, 2008
    Publication date: February 5, 2009
    Applicant: Vistec Semiconductor Systems GmbH
    Inventors: Hans-Artur Boesser, Wolfgang Fricke, Michael Heiden
  • Publication number: 20090024351
    Abstract: A method for allocating correction values of the degree of bending of a substrate (2) relative to a coordinate system (40) of a coordinate measuring machine (1) is disclosed. The positions of the at least two reference marks (32) on the substrate holder (27) are automatically determined relative to the coordinate system (40) of the coordinate measuring machine (1) for each substrate (2) currently placed in the substrate holder (27) in the coordinate measuring machine (1).
    Type: Application
    Filed: June 27, 2008
    Publication date: January 22, 2009
    Applicant: VISTEC SEMICONDUCTOR SYSTEMS GMBH
    Inventors: Wolfgang Fricke, Linda Gundal
  • Publication number: 20090002486
    Abstract: A coordinate measuring machine is disclosed having an orientor automatically orienting a substrate associated therewith. A control and computing unit is further associated with the coordinate measuring machine, so that self-calibration may be performed on the basis of at least two different and automatically set orientations of the substrate.
    Type: Application
    Filed: June 25, 2008
    Publication date: January 1, 2009
    Applicant: VISTEC Semiconductor Systems GmbH
    Inventors: Wolfgang Fricke, Klaus Rinn, Slawomir Czerkas
  • Publication number: 20080252903
    Abstract: A method for determining the focal position of at least two edges of structures (31) on a substrate (30) is disclosed. During the movement of a measurement objective (21) in the Z-coordinate direction, a plurality of images of the at least one structure (31) is acquired with at least one measurement window (45) of a detector. An intensity profile of the structure (31) is determined for each image.
    Type: Application
    Filed: March 1, 2008
    Publication date: October 16, 2008
    Applicant: VISTEC SEMICONDUCTOR SYSTEMS GMBH
    Inventors: Hans-Artur Boesser, Wolfgang Fricke, Klaus-Dieter Adam
  • Patent number: 6920249
    Abstract: A method and a measuring instrument for determining the position of an edge to be measured on a pattern on a substrate are described. A complete, nonlinear model intensity profile, which identifies the edge to be measured, of a model edge is ascertained and stored, and a desired edge position xk is defined therein with subpixel accuracy. A camera image of the substrate having the edge to be measured is acquired, and a one-dimensional measured intensity profile of the edge to be measured is determined therefrom. The model intensity profile is identified in the measured intensity profile with an indication of its location xm relative to a reference point. The desired position p of the edge to be measured is determined with subpixel accuracy as p=xm+xk.
    Type: Grant
    Filed: September 24, 2001
    Date of Patent: July 19, 2005
    Assignee: Leica Microsystems Semiconductor GmbH
    Inventors: Klaus Rinn, Wolfgang Fricke, Joachim Wienecke
  • Publication number: 20020057839
    Abstract: A method and a measuring instrument for determining the position of an edge to be measured on a pattern on a substrate are described. A complete, nonlinear model intensity profile, which identifies the edge to be measured, of a model edge is ascertained and stored, and a desired edge position xk is defined therein with subpixel accuracy. A camera image of the substrate having the edge to be measured is acquired, and a one-dimensional measured intensity profile of the edge to be measured is determined therefrom. The model intensity profile is identified in the measured intensity profile with an indication of its location xm relative to a reference point. The desired position p of the edge to be measured is determined with subpixel accuracy as p=xm+xk.
    Type: Application
    Filed: September 24, 2001
    Publication date: May 16, 2002
    Inventors: Klaus Rinn, Wolfgang Fricke, Joachim Wienecke