Abstract: An apparatus for use with stackable processor modules to form an electrical device such as a microcomputer comprises superimposed stacked main or processor modules with one group of connectors which have connector pins at one side of the module and sockets at the other side of the module. At least one intermediate module is provided with two groups of angularly offset connectors, each of which corresponds to the group of connectors of a process or module. When assembled into a stack, two processor modules neighboring an intermediate module are angularly offset relative to each other and are connected to different connector groups of the intermediate module. In this manner, it is possible to assemble stacks of modules with different isolated bus sections that are not directly connected to each other.