Abstract: A micro electrical mechanical systems (MEMS) device includes a flexible membrane disposed over a substrate, and a first backplate disposed over the flexible membrane. The first backplate includes a first plurality of bumps facing the flexible membrane. The MEMS device further includes a plurality of features disposed at the flexible membrane, where each of the plurality of features being associated with a corresponding one of the first plurality of bumps.

Abstract: A thermoresistive micro sensor device includes a semiconductor chip; a through hole, which runs through the semiconductor chip from an upper side to a lower side; electrically conductive structures, wherein the middle section of each of the electrically conductive structures spans over the through hole at the upper side of the semiconductor chip; an electrically insulating arrangement for electrically insulating the electrically conductive structures and the semiconductor chip from each other, wherein the through hole runs through the electrically insulating arrangement; and a contact arrangement including contacts, wherein each of the contacts is electrically connected to one of the first end sections or one of the second end sections, so that electrical energy is fed to at least one of the electrically conductive structures to heat the respective electrically conductive structure, and so that an electrical resistance of one of the electrically conductive structures is measured at the contact arrangement.

Abstract: A system for measuring gas concentration includes a package having a cavity and a port, a photoacoustic gas sensor device within the package, and a Micro Electro Mechanical System (“MEMS”) valve separate from the photoacoustic gas sensor device placed over the port of the package and to allow ambient gas diffusion into the cavity in a first mode of operation, and to prevent ambient gas diffusion into the cavity and to acoustically isolate the cavity in a second mode of operation.

Abstract: A MEMS sound transducer includes a backplate and a membrane held by an edge fixing such that the membrane is deflectable along a deflection direction toward the backplate. The MEMS sound transducer further includes an elevation element arranged between the membrane and the backplate and having a first height along the deflection direction. The MEMS sound transducer also includes a supporting structure and a spacer element arranged between the membrane and the supporting structure and having a second height along the deflection direction, the second height being greater than the first height. The supporting structure is the backplate or is a supporting element arranged opposite the backplate, such that the membrane is arranged between the backplate and the supporting element.

Abstract: A MEMS-transducer comprises a membrane structure having a first main surface and a second main surface opposing the first main surface. A substrate structure holds the membrane structure, wherein the substrate structure overlaps with the first main surface of the membrane structure in a first edge region being adjacent to a first inner region of the first main surface. A gap is formed between the membrane structure and the substrate structure in the first edge region and extends from the first inner region into the first edge region.

Abstract: The application relates to a method for modernizing an existing escalator or an existing moving walkway. The method can include removing all the electrical and mechanical parts from the existing framework of the existing escalator or of the existing moving walkway, the existing framework having two framework side parts and a base structure connecting said framework side parts, and the framework side parts being connected to each other by means of cross members disposed at a distance from the base structure; and replacing the existing cross members of the existing framework with new cross members, the two framework side parts of the existing framework being connected to each other in a mutually stabilising manner at least one point at a distance from the base structure of the framework, during replacement of the cross members.

Abstract: A microelectromechanical system includes a housing with an access opening and a sound transducer with a membrane and a backplate, wherein the sound transducer is coupled to the access opening. The microelectromechanical system includes a filter arranged between the access opening and the sound transducer and includes a filter material and a pretension element, the pretension element being mechanically connected to the filter material, and wherein the pretension element produces stress in the filter material in order to provide a bending deformation of the filter in a direction away from the backplate.

Abstract: According to an embodiment, a microfabricated structure includes a cavity disposed in a substrate, a first clamping layer overlying the substrate, a deflectable membrane overlying the first clamping layer, and a second clamping layer overlying the deflectable membrane. A portion of the second clamping layer overlaps the cavity.

Abstract: The application relates to a method for modernizing an existing escalator or an existing moving walkway. The method can include removing all the electrical and mechanical parts from the existing framework of the existing escalator or of the existing moving walkway, the existing framework having two framework side parts and a base structure connecting said framework side parts, and the framework side parts being connected to each other by means of cross members disposed at a distance from the base structure; and replacing the existing cross members of the existing framework with new cross members, the two framework side parts of the existing framework being connected to each other in a mutually stabilising manner at least one point at a distance from the base structure of the framework, during replacement of the cross members.

Abstract: In one embodiment, a method of manufacturing a semiconductor device includes oxidizing a substrate to form local oxide regions that extend above a top surface of the substrate. A membrane layer is formed over the local oxide regions and the top surface of the substrate. A portion of the substrate under the membrane layer is removed. The local oxide regions under the membrane layer are removed.

Abstract: In one embodiment, a method of manufacturing a semiconductor device includes oxidizing a substrate to form local oxide regions that extend above a top surface of the substrate. A membrane layer is formed over the local oxide regions and the top surface of the substrate. A portion of the substrate under the membrane layer is removed. The local oxide regions under the membrane layer is removed.

Abstract: A microelectromechanical system includes a housing with an access opening and a sound transducer with a membrane and a backplate, wherein the sound transducer is coupled to the access opening. The microelectromechanical system includes a filter arranged between the access opening and the sound transducer and includes a filter material and a pretension element, the pretension element being mechanically connected to the filter material, and wherein the pretension element produces stress in the filter material in order to provide a bending deformation of the filter in a direction away from the backplate.

Abstract: An apparatus for transportation of a substrate is provided. The apparatus includes a vacuum chamber having a chamber wall configured to separate a vacuum side from an atmospheric side and a magnetic levitation system configured for a contactless levitation of a substrate carrier in the vacuum chamber. The magnetic levitation system includes at least one magnetic device configured for providing a magnetic force acting on the substrate carrier during transportation of the substrate carrier in the vacuum chamber along a transportation path and at least one holding unit configured to hold the at least one magnetic device being accessible from the atmospheric side.

Abstract: A MEMS sound transducer includes a backplate and a membrane held by an edge fixing such that the membrane is deflectable along a deflection direction toward the backplate. The MEMS sound transducer further includes an elevation element arranged between the membrane and the backplate and having a first height along the deflection direction. The MEMS sound transducer also includes a supporting structure and a spacer element arranged between the membrane and the supporting structure and having a second height along the deflection direction, the second height being greater than the first height. The supporting structure is the backplate or is a supporting element arranged opposite the backplate, such that the membrane is arranged between the backplate and the supporting element.

Abstract: A method for forming a microelectromechanical device may provide forming a first layer at least one of in or over a semiconductor carrier; forming a second layer at least one of in or over at least a central region of the first layer, such that a peripheral region of the first layer is at least partially free of the second layer; removing material under at least a central region of the second layer to release at least one of the central region of the second layer or a central region of the first layer; and/or removing material under at least the peripheral region of the first layer to such that the second layer is supported by the semiconductor carrier via the first layer.

Abstract: According to an embodiment, a MEMS device includes a deflectable membrane including a first plurality of electrostatic comb fingers, a first anchor structure including a second plurality of electrostatic comb fingers interdigitated with a first subset of the first plurality of electrostatic comb fingers, and a second anchor structure including a third plurality of electrostatic comb fingers interdigitated with a second subset of the first plurality of electrostatic comb fingers. The second plurality of electrostatic comb fingers are offset from the first plurality of electrostatic comb fingers in a first direction and the third plurality of electrostatic comb fingers are offset from the first plurality of electrostatic comb fingers in a second direction, where the first direction is different from the second direction.

Abstract: According to an embodiment, a microfabricated structure includes a cavity disposed in a substrate, a first clamping layer overlying the substrate, a deflectable membrane overlying the first clamping layer, and a second clamping layer overlying the deflectable membrane. A portion of the second clamping layer overlaps the cavity.

Abstract: A method for forming a microelectromechanical device may provide forming a first layer at least one of in or over a semiconductor carrier; forming a second layer at least one of in or over at least a central region of the first layer, such that a peripheral region of the first layer is at least partially free of the second layer; removing material under at least a central region of the second layer to release at least one of the central region of the second layer or a central region of the first layer; and/or removing material under at least the peripheral region of the first layer to such that the second layer is supported by the semiconductor carrier via the first layer.

Abstract: A microelectromechanical device may include: a semiconductor carrier; a microelectromechanical element disposed in a position distant to the semiconductor carrier; wherein the microelectromechanical element is configured to generate or modify an electrical signal in response to a mechanical signal and/or is configured to generate or modify a mechanical signal in response to an electrical signal; at least one contact pad, which is electrically connected to the microelectromechanical element for transferring the electrical signal between the contact pad and the microelectromechanical element; and a connection structure which extends from the semiconductor carrier to the microelectromechanical element and mechanically couples the microelectromechanical element with the semiconductor carrier.