Abstract: Disclosed aspects relate to a digital logic circuit. A clock generation circuitry has both a clock generation circuitry output and an inverter circuit to generate a derivative clock signal feature by inverting an array clock signal feature. A scannable storage element has both a scannable storage element output and a set of flip-flops. A memory array is connected with the scannable storage element output and the array clock signal feature. The digital logic circuit is configured to avoid a race violation.

Abstract: A memory cell arrangement for Random Access Memory (RAM) including one or more RAM cell groups. The RAM cell groups having two or more local bit-lines sharing a Global Bit-Line (GBL), a pre-charging circuit connected to the GBL, a multiplexer connected to multiple GBLs and configured to shift an output of a first GBL from a first bit to a second bit at least in part according to a value of a fuse bit register associated with a second GBL, and at least one pre-charge enabling circuit controlled by a combination of a pre-charge input value applied to all GBLs of the memory cell arrangement and a pre-charge enable signal for the GBL.

Abstract: A memory cell arrangement for Random Access Memory (RAM) including one or more RAM cell groups. The RAM cell groups having two or more local bit-lines sharing a Global Bit-Line (GBL), a pre-charging circuit connected to the GBL, a multiplexer connected to multiple GBLs and configured to shift an output of a first GBL from a first bit to a second bit at least in part according to a value of a fuse bit register associated with a second GBL, and at least one pre-charge enabling circuit controlled by a combination of a pre-charge input value applied to all GBLs of the memory cell arrangement and a pre-charge enable signal for the GBL.

Abstract: Disclosed aspects relate to a digital logic circuit. A clock generation circuitry has both a clock generation circuitry output and an inverter circuit to generate a derivative clock signal feature by inverting an array clock signal feature. A scannable storage element has both a scannable storage element output and a set of flip-flops. A memory array is connected with the scannable storage element output and the array clock signal feature. The digital logic circuit is configured to avoid a race violation.

Abstract: Disclosed aspects relate to a digital logic circuit. A clock generation circuitry has both a clock generation circuitry output and an inverter circuit to generate a derivative clock signal feature by inverting an array clock signal feature. A scanable storage element has both a scanable storage element output and a set of flip-flops. A memory array is connected with the scanable storage element output and the array clock signal feature. The digital logic circuit is configured to avoid a race violation.

Abstract: Disclosed aspects relate to a digital logic circuit. A clock generation circuitry has both a clock generation circuitry output and an inverter circuit to generate a derivative clock signal feature by inverting an array clock signal feature. A scanable storage element has both a scanable storage element output and a set of flip-flops. A memory array is connected with the scanable storage element output and the array clock signal feature. The digital logic circuit is configured to avoid a race violation.

Abstract: Disclosed aspects relate to a digital logic circuit. A clock generation circuitry has both a clock generation circuitry output and an inverter circuit to generate a derivative clock signal feature by inverting an array clock signal feature. A scanable storage element has both a scanable storage element output and a set of flip-flops. A memory array is connected with the scanable storage element output and the array clock signal feature. The digital logic circuit is configured to avoid a race violation.

Abstract: Disclosed aspects relate to a digital logic circuit. A clock generation circuitry has both a clock generation circuitry output and an inverter circuit to generate a derivative clock signal feature by inverting an array clock signal feature. A scanable storage element has both a scanable storage element output and a set of flip-flops. A memory array is connected with the scanable storage element output and the array clock signal feature. The digital logic circuit is configured to avoid a race violation.

Abstract: A memory cell readable through a bit line and addressable through a word line can be stressed by applying a stress voltage to the bit line for a stress voltage time, and addressing the memory cell through the word line for an addressing time included within the stress voltage time. The memory cell can be tested by writing a data value into the memory cell, stressing the memory cell, reading the stored value from the memory cell, and determining whether the stored value corresponds to the data value. A testable memory array can include a memory cell addressable through a word line and readable through a bit line, a precharge circuit, a stress circuit, and an array built-in self test (ABIST) circuit. The ABIST circuit can be configured to stress the memory cell by applying a stress signal to the stress circuit.

Abstract: A memory cell readable through a bit line and addressable through a word line can be stressed by applying a stress voltage to the bit line for a stress voltage time, and addressing the memory cell through the word line for an addressing time included within the stress voltage time. The memory cell can be tested by writing a data value into the memory cell, stressing the memory cell, reading the stored value from the memory cell, and determining whether the stored value corresponds to the data value. A testable memory array can include a memory cell addressable through a word line and readable through a bit line, a precharge circuit, a stress circuit, and an array built-in self test (ABIST) circuit. The ABIST circuit can be configured to stress the memory cell by applying a stress signal to the stress circuit.

Abstract: A memory array includes m·(n+1) memory cells, wherein n and m are natural numbers greater than zero. Each of the plurality of memory cells is connected to one of (n+1) bitlines and one of m wordlines. The memory array further includes n outputs configured for reading a content of the memory array. The memory array further includes n output switches, wherein an i-th output switch is configured for selectively connecting, in response to a switching signal, either an i-th bitline or an (i+1)-th bitline to an i-th output, and wherein i is a natural number and 0?i?n?1. The memory array further includes an (n+1)-th output switch, wherein the (n+1)-th output switch is configured for selectively connecting, in response to the switching signal, either the (n+1)-th bitline or a defined potential to an (n+1)-th output.

Abstract: A memory cell that is readable through a bit line and addressable through a word line can be stressed using a method that includes addressing the memory cell, through the word line, for an addressing time. The memory cell can be stressed by applying a stress voltage to the bit line for a stress voltage time that overlaps with the addressing time for a stress time ?t. A method for testing a memory cell can include writing a data value into the memory cell, stressing the memory cell, reading a stored value from the memory cell and determining whether the stored value corresponds to the data value. A testable memory array can include at least one memory cell that is addressable through a word line and readable through a bit line and a stress circuit for applying a stress voltage to the bit line.

Abstract: An aspect relates to a memory array that includes at least a first and a second six transistor static random access memory cell, and first and second address decoders. The first address decoder comprises a first latch, the second address decoder a second latch. First and second address data paths provide first and second address data to the at least two address decoders. The first latch is electrically conductive connected to the first data path and the second latch is electrically conductive connected to the second data path. The first latch is further electrically conductive connectable to the second data path via a first multiplexer. The first multiplexer and the at least two latches are configured to be selectively operated in a first write mode for a write access or in a read mode for a read access to the memory array.

Abstract: An aspect relates to a memory array that includes at least a first and a second six transistor static random access memory cell, and first and second address decoders. The first address decoder comprises a first latch, the second address decoder a second latch. First and second address data paths provide first and second address data to the at least two address decoders. The first latch is electrically conductive connected to the first data path and the second latch is electrically conductive connected to the second data path. The first latch is further electrically conductive connectable to the second data path via a first multiplexer. The first multiplexer and the at least two latches are configured to be selectively operated in a first write mode for a write access or in a read mode for a read access to the memory array.

Abstract: A technique for generating an adjustable boost voltage for a device includes charging, using first and second switches, a capacitor to a first voltage during a charging phase. The technique also includes stacking, using a third switch, a second voltage onto the first voltage across the capacitor in a boost phase to generate a boost voltage. In this case, the boost voltage is applied to a driver circuit of the device only during the boost phase and at least one of the first and second voltages is adjustable, thereby making the boost voltage adjustable.

Abstract: In a circuit that reduces power consumption in an array system of memory cells accessible in parallel, a local evaluation circuit is connected to a memory cell and a global bit line of the array system of memory cells. A selection circuitry splits the global bit line into an upper part and a lower part of the global bit line. The selection circuitry is adapted to receive an early set prediction signal and to connect the upper part of the global bit line to the lower part of the global bit line based on the early set prediction signal. The early set prediction signal indicates whether a set of memory cells, which include the memory cell, is being read. The circuit also includes a N:1 multiplexer connected to the lower part of the global bit line to receive the lower part of the global bit line as input.

Abstract: In a circuit that reduces power consumption in an array system of memory cells accessible in parallel, a local evaluation circuit is connected to a memory cell and a global bit line of the array system of memory cells. A selection circuitry splits the global bit line into an upper part and a lower part of the global bit line. The selection circuitry is adapted to receive an early set prediction signal and to connect the upper part of the global bit line to the lower part of the global bit line based on the early set prediction signal. The early set prediction signal indicates whether a set of memory cells, which include the memory cell, is being read. The circuit also includes a N:1 multiplexer connected to the lower part of the global bit line to receive the lower part of the global bit line as input.

Abstract: A technique for generating an adjustable boost voltage for a device includes charging, using first and second switches, a capacitor to a first voltage during a charging phase. The technique also includes stacking, using a third switch, a second voltage onto the first voltage across the capacitor in a boost phase to generate a boost voltage. In this case, the boost voltage is applied to a driver circuit of the device only during the boost phase and at least one of the first and second voltages is adjustable, thereby making the boost voltage adjustable.

Abstract: An asymmetrical random access memory cell (1) including cross coupled inverters (2, 3) which are driven at their nodes (22, 32) by separate bit-lines (blt, blc) of a pair of complementary bit-lines, which are connected via a pass-transistors (21, 31), wherein said cross coupled inverters (2, 3) have different switching thresholds and exhibit asymmetrical physical behaviours, wherein an additional pass-transistor (4) is provided in series to one of the pass-transistors (21) between one of the nodes (22) and its dedicated bit-line (blc). Further the invention relates to a random access memory including such memory cells and to a method of operating such a memory.

Abstract: Asymmetrical random access memory cell, memory comprising asymmetrical memory cells and method to operate such a memory The invention relates to an asymmetrical random access memory cell (1) comprising cross coupled inverters (2, 3) which are driven at their nodes (22, 32) by separate bit-lines (b1t, b1c) of a pair of complementary bit-lines, which are connected via a pass-transistors (21, 31), wherein said cross coupled inverters (2, 3) have different switching thresholds and exhibit asymmetrical physical behaviours, wherein an additional pass-transistor (4) is provided in series to one of the pass-transistors (21) between one of the nodes (22) and its dedicated bit-line (blc). Further the invention relates to a random access memory comprising such memory cells and to a method of operating such a memory.