Abstract: A device for analyzing a beam profile of a laser beam includes a carrier plate, a plurality of first temperature-sensitive measuring elements, in particular diodes, which are arranged in a preferably matrix-like arrangement on a first side of the carrier plate at a plurality of measuring locations, and a plurality of second temperature-sensitive measuring elements, in particular diodes, which are arranged in another preferably matrix-like arrangement on a second side of the carrier plate. One of the first measuring elements is arranged in each case opposite one of the second measuring elements and is thermally coupled to the first measuring element using strip conductors which extend through the carrier plate. Such a device can be included in a laser processing machine and used in an associated method for analyzing a beam profile of a laser beam.

Abstract: A method is performed for determining a suitable workpiece processing focal position of a laser beam. The method includes adjusting one or more of a laser beam and a workpiece until a periphery of the laser beam contacts a lateral edge of the workpiece, determining, from at least a focal position of the laser beam associated with the peripheral beam contact with the workpiece, a suitable workpiece processing focal position of the laser beam, and then adjusting the laser beam to the suitable workpiece processing focal position.

Abstract: A device for analyzing a beam profile of a laser beam includes a carrier plate, a plurality of first temperature-sensitive measuring elements, in particular diodes, which are arranged in a preferably matrix-like arrangement on a first side of the carrier plate at a plurality of measuring locations, and a plurality of second temperature-sensitive measuring elements, in particular diodes, which are arranged in another preferably matrix-like arrangement on a second side of the carrier plate. One of the first measuring elements is arranged in each case opposite one of the second measuring elements and is thermally coupled to the first measuring element using strip conductors which extend through the carrier plate. Such a device can be included in a laser processing machine and used in an associated method for analyzing a beam profile of a laser beam.

Abstract: Methods and devices are provided for adjusting the relative position and/or relative movement between a workpiece and a tool of a machine tool in the direction of an axis. An actuating variable for a basic axis comprising one or more drives is generated in the first controller of a basic axis control system, an actuating variable for a higher-dynamic additional axis comprising a drive is generated in a second controller of an additional axis control system, and a third actuating variable, which is fed both to the additional axis control system and to the basic axis control system, is generated in a third controller.

Abstract: Devices and related methods of controlling relative movement between a tool of a machine tool and a work piece including dividing a total desired relative tool to workpiece movement in a direction of an axis into a first movement component and a second movement component; controlling the first movement component with a first closed-loop axis control; determining a resulting movement quantity corresponding to the first movement component; feeding a position error from the first closed-loop axis control to the second closed-loop axis control controlling the second movement component in a closed-loop with the second closed-loop axis control, including adjusting for the position error of the first movement component.

Abstract: Methods and devices are provided for adjusting the relative position and/or relative movement between a workpiece and a tool of a machine tool in the direction of an axis. An actuating variable for a basic axis comprising one or more drives is generated in the first controller of a basic axis control system, an actuating variable for a higher-dynamic additional axis comprising a drive is generated in a second controller of an additional axis control system, and a third actuating variable, which is fed both to the additional axis control system and to the basic axis control system, is generated in a third controller.

Abstract: A method is performed for determining a suitable workpiece processing focal position of a laser beam. The method includes adjusting one or more of a laser beam and a workpiece until a periphery of the laser beam contacts a lateral edge of the workpiece, determining, from at least a focal position of the laser beam associated with the peripheral beam contact with the workpiece, a suitable workpiece processing focal position of the laser beam, and then adjusting the laser beam to the suitable workpiece processing focal position.

Abstract: Devices and related methods of controlling relative movement between a tool of a machine tool and a work piece including dividing a total desired relative tool to workpiece movement in a direction of an axis into a first movement component and a second movement component; controlling the first movement component with a first closed-loop axis control; determining a resulting movement quantity corresponding to the first movement component; feeding a position error from the first closed-loop axis control to the second closed-loop axis control controlling the second movement component in a closed-loop with the second closed-loop axis control, including adjusting for the position error of the first movement component.

Abstract: A laser cutting method employs at least two sensors which are operative during the cutting operation to monitor process parameters and send signals indicative of the monitored parameters determining parameters of the cutting operation in which are indicative of the status of the penetration of the workpiece. The signals from each of the sensors is evaluated by comparing the sensed parameters in the signals with usability criteria to determine the usability of the signals. The signal which compares most favorably with the usability criteria therefor is transmitted to the controller to modify the parameters for the cutting workpiece. In the absence of a control signal from the evaluation, the controller proceeds with the cutting in accordance with parameters which are then operative in the controller. Generally, the selected signal effects the speed of relative movement between the workpiece and cutting head.

Abstract: A laser cutting method employs at least two sensors which are operative during the cutting operation to monitor process parameters and send signals indicative of the monitored parameters determining parameters of the cutting operation in which are indicative of the status of the penetration of the workpiece. The signals from each of the sensors is evaluated by comparing the sensed parameters in the signals with usability criteria to determine the usability of the signals. The signal which compares most favorably with the usability criteria therefor is transmitted to the controller to modify the parameters for the cutting workpiece. In the absence of a control signal from the evaluation, the controller proceeds with the cutting in accordance with parameters which are then operative in the controller. Generally, the selected signal effects the speed of relative movement between the workpiece and cutting head.