Abstract: The invention relates to a circuit configuration (1) for controlling the operation of a half-bridge (13) by pulse-width modulation, especially in a synchronous rectifier mode. Said circuit configuration comprises a first terminal connection (23, 25) for electrically connecting the circuit configuration (1) to an insulated gate terminal of a bridge valve (15, 17) of the half-bridge (13), a second terminal connection (20, 22) for electrically connecting the circuit configuration (1) to an additional terminal of the bridge valve (15, 17), a lead (16, 18) electrically connecting the first terminal connection (23, 25) to the second terminal connection (20, 22), and an electric valve (43, 45) that can be switched on and off by pulse-width modulated signals. Said electric valve (43, 45) is disposed in the lead (16, 18) so that a flow of current through the lead (16, 18) can be released and blocked.

Abstract: The invention relates to a circuit configuration (1) for controlling the operation of a half-bridge (13) by pulse-width modulation, especially in a synchronous rectifier mode. Said circuit configuration comprises a first terminal connection (23, 25) for electrically connecting the circuit configuration (1) to an insulated gate terminal of a bridge valve (15, 17) of the half-bridge (13), a second terminal connection (20, 22) for electrically connecting the circuit configuration (1) to an additional terminal of the bridge valve (15, 17), a lead (16, 18) electrically connecting the first terminal connection (23, 25) to the second terminal connection (20, 22), and an electric valve (43, 45) that can be switched on and off by pulse-width modulated signals. Said electric valve (43, 45) is disposed in the lead (16, 18) so that a flow of current through the lead (16, 18) can be released and blocked.

Abstract: Multilayer circuit board (10b) for electrically interconnecting components (12b) of an electronic circuit, wherein one of the components (12b-1) has a cooling plane (14b) which is in planar contact over at least one cooling plane section (16b) of the cooling plane with a metal plane (22b-1) disposed in the topmost circuit board layer (20b-1) and possessing a first electrical potential, wherein there is provided a metal plane (24b-1) possessing a second electrical potential which is in electrical contact with at least one (12b-2) of the components (12b), and wherein there is formed at least one pair of overlapping metal planes from one of the metal planes (22b) possessing the first electrical potential and one of the metal planes (24b) possessing the second electrical potential, the overlap of the two metal planes being at least as large as the cooling plane section (16b).