Patents by Inventor Won Geun KIM
Won Geun KIM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240172556Abstract: An organic electric element includes a hole transport band layer which includes compound represented by Formula 1 and an electron transport band layer includes compound represented by Formula 2. The driving voltage of an organic electric element including the organic electric element can be lowered and the luminous efficiency and lifespan can be improved.Type: ApplicationFiled: February 21, 2022Publication date: May 23, 2024Inventors: Sun Hee LEE, Jung Geun LEE, Hyoung Keun PARK, Soung Yun MUN, Won Sam KIM, Hyun Jung BAEK
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Patent number: 11923213Abstract: Proposed is a substrate heating unit including: a laser generator providing a laser beam for heating a substrate; and a beam shaper processing the laser beam from the laser generator and selectively providing one of a first beam having a uniform energy distribution and a second beam having an edge-enhanced energy distribution to the substrate.Type: GrantFiled: December 20, 2020Date of Patent: March 5, 2024Assignee: SEMES CO., LTD.Inventors: Tae Shin Kim, Young Dae Chung, Ji Hoon Jeong, Jee Young Lee, Won Geun Kim
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Patent number: 11925059Abstract: An organic light emitting diode display device includes a substrate having an emitting area and a non-emitting area. An insulating layer is on the substrate, and the insulating layer includes a plurality of convex portions, a plurality of connecting portions and at least one wall in the emitting area. A height of the at least one wall is greater than a height of the plurality of convex portions. A first electrode is on the substream, emitting layer is on the first electrode, a second electrode is on the emitting layer. The first electrode, the emitting layer and the second electrode constitute a light emitting diode.Type: GrantFiled: June 30, 2020Date of Patent: March 5, 2024Assignee: LG Display Co., Ltd.Inventors: Hyun-Soo Lim, Kang-Ju Lee, Soo-Kang Kim, Won-Hoe Koo, Min-Geun Choi
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Patent number: 11911153Abstract: The present invention provides a device for measuring biological information including a sensor array, wherein the sensor array includes a plurality of sensors that are either sensors for amplifying photoreactivity or sensors forming an island network connected by a plurality of multi-channels and, in the device, the average value of biological information about the skin tissues is measured based on values output from the sensor array, and a method of measuring biological information using the device.Type: GrantFiled: November 4, 2020Date of Patent: February 27, 2024Assignees: UNIVERSITY-INDUSTRY COOPERATION GROUP OF KYUNG HEE UNIVERSITY, Korea Electronics Technology InstituteInventors: Sun Kook Kim, Sung Ho Lee, Min Goo Lee, Hyuk Sang Jung, Min Jung Kim, Young Ki Hong, Won Geun Song
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Publication number: 20240035166Abstract: A method of processing a substrate includes an etchant supplying operation of supplying an etchant to a substrate; a puddle operation of, by rotating the substrate at a first rotational speed, forming a liquid film of the etchant supplied to the substrate in a puddle shape; and a thickness adjusting operation of changing a rotational speed of the substrate to a rotational speed different from the first rotational speed to adjust a thickness of the liquid film of the etchant. Using the method, dispersion of the etching rate may be effectively controlled.Type: ApplicationFiled: February 9, 2023Publication date: February 1, 2024Inventors: Jee Young LEE, Won Geun KIM, Young Dae CHUNG, Ji Hoon JEONG, Tae Shin KIM, Won Sik SON
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Publication number: 20230377911Abstract: A method of etching a thin film includes: a first puddling operation of forming a first puddle of a chemical solution on a substrate by supplying and spreading the chemical solution on the substrate on which a thin film is formed; a first etching operation of partially etching the thin film using the chemical solution on the substrate; a first rinsing operation of supplying the chemical solution onto the substrate to rinse off the first puddle of the chemical solution and apply the chemical solution onto the substrate; a second puddling operation of forming a second puddle of the chemical solution on the substrate; a second etching operation of partially etching the thin film; and a second rinsing operation of supplying the chemical solution onto the substrate to rinse off the second puddle of the chemical solution on the substrate and apply the chemical solution on to the substrate.Type: ApplicationFiled: March 30, 2023Publication date: November 23, 2023Inventor: Won-Geun KIM
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Publication number: 20230360933Abstract: The present invention provides a substrate treating facility, including: a process chamber including an annular beam emitting unit which emits an annular laser beam to a substrate and heats the substrate; and a laser beam generator configured to generate the laser beam emitted to the substrate through the annular beam emitting unit of the process chamber.Type: ApplicationFiled: May 9, 2022Publication date: November 9, 2023Inventors: Tae Shin KIM, Ji Hoon JEONG, Young Dae CHUNG, Jee Young LEE, Won-Geun KIM
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Patent number: 11804371Abstract: Provided is a substrate treatment apparatus including a treatment container equipped with a conductive member. The conductive member is made of a material having a lower resistivity than that of the treatment container. The conductive member prevents a rise of an electric potential of the treatment container, which is caused by charging during treatment of a substrate, thereby preventing the substrate from being contaminated and damaged by particles and electrostatic arcing.Type: GrantFiled: July 2, 2020Date of Patent: October 31, 2023Assignee: SEMES CO., LTD.Inventors: Do Yeon Kim, Se Hoon Oh, Won Geun Kim, Ju Mi Lee, Ho Jong Hwang, Pil Kyun Heo, Hyun Yoon, Choong Hyun Lee, Hyun Goo Park
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Patent number: 11772198Abstract: A thin layer etching apparatus includes an etchant supply unit configured to supply an etchant onto a substrate to etch a thin layer formed on the substrate, a temperature measuring unit configured to measure a temperature of the substrate while an etching process is performed by the etchant, a laser irradiating unit configured to irradiate a first laser beam on a first portion including a central portion of the substrate and to irradiate a second laser beam in a ring shape on a second portion surrounding the first portion so that the temperature of the substrate is maintained at a predetermined temperature during the etching process, and a process control unit configured to control power of the first and second laser beams based on the temperature of the substrate measured by the temperature measuring unit to reduce a temperature difference between the first and second portions of the substrate.Type: GrantFiled: December 8, 2020Date of Patent: October 3, 2023Assignee: SEMES CO., LTD.Inventors: Won Geun Kim, Tae Shin Kim
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Patent number: 11715651Abstract: A substrate treatment apparatus includes a substrate support unit, a chemical supply unit supplying a chemical solution onto an upper surface of a substrate supported on the substrate support unit, a laser irradiation unit applying a laser pulse to the substrate to heat the substrate, and a controller controlling the laser irradiation unit to emit the laser pulse such that the substrate is repeatedly heated and cooled to maintain a preset temperature.Type: GrantFiled: October 24, 2020Date of Patent: August 1, 2023Assignee: SEMES CO., LTD.Inventors: Young Dae Chung, Won Geun Kim, Jee Young Lee, Ji Hoon Jeong, Tae Shin Kim, Jung Suk Goh, Cheng Bin Cui, Ye Rim Yeon
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Publication number: 20230207350Abstract: Provided is an apparatus for treating a substrate, which includes: a chamber having a treating space; a substrate support unit supporting and rotating a substrate in the treating space; a liquid supply unit supplying a chemical liquid to the substrate supported on the substrate support unit; a laser irradiation unit irradiating a laser to a bottom of the substrate supported on the substrate support unit; and a laser reflection unit coupled to the laser irradiation unit, and reflecting the laser irradiated and reflected to the bottom of the substrate, in which the laser reflection unit includes a reflection member reflecting the laser reflected from the substrate, and a driving member tilting the reflection member at a predetermined tilt angle.Type: ApplicationFiled: December 28, 2022Publication date: June 29, 2023Applicant: SEMES CO., LTD.Inventors: Tae Shin KIM, Young Dae Chung, Won-Geun Kim, Jee Young Lee, Ji Hoon Jeong
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Publication number: 20230039663Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a support unit horizontally maintaining a substrate; a laser irradiation unit for irradiating the substrate with a laser; a photo-detector for detecting an energy of a reflective light reflected from the substrate among a laser irradiated on the substrate; and a processor, and wherein the processor irradiates a first laser of a first output to the substrate, and sets a second output of a second laser for irradiating the substrate to heat the substrate, based on an energy of a first reflective light reflected from the substrate by the first laser detected from the photo-detector.Type: ApplicationFiled: July 15, 2022Publication date: February 9, 2023Applicant: SEMES CO., LTD.Inventors: Jee Young LEE, Young Dae CHUNG, Ji Hoon JEONG, Won-Geun KIM, Tae Shin KIM
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Patent number: 11495467Abstract: Method and apparatus for etching a thin layer including silicon nitride formed on a substrate are disclosed. Etchant including phosphoric acid and water is supplied on the substrate so that a liquid layer is formed on the substrate. The thin layer is etched by reaction between the thin layer and the etchant. Thickness of the liquid layer is measured to detect variation in the thickness of the liquid layer while etching the thin layer. Variation in the concentration of the phosphoric acid and the water is calculated based on the variation in the thickness of the liquid layer. Water is supplied on the substrate based on the variation in the concentration of the phosphoric acid and the water so that the concentration of the phosphoric acid and the water becomes a predetermined value.Type: GrantFiled: December 8, 2020Date of Patent: November 8, 2022Assignee: SEMES CO., LTD.Inventors: Jung Suk Goh, Jae Seong Lee, Do Youn Lim, Kuk Saeng Kim, Young Dae Chung, Tae Shin Kim, Jee Young Lee, Won Geun Kim, Ji Hoon Jeong, Kwang Sup Kim, Pil Kyun Heo, Yoon Ki Sa, Ye Rim Yeon, Hyun Yoon, Do Yeon Kim, Yong Jun Seo, Byeong Geun Kim, Young Je Um
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Publication number: 20220084847Abstract: Substrate treating equipment includes a first process chamber group including a plurality of process chambers, each of which includes a laser beam emitting unit that applies a laser beam to a substrate to heat the substrate, one laser beam generator that generates the laser beam applied to the substrate through the laser beam emitting unit of each of the plurality of process chambers included in the first process chamber group, and a beam shifting module including one or more mirrors corresponsable to the plurality of process chambers included in the first process chamber group. Each of the one or more mirrors is shifted to a position in which the mirror forms an optical path of the laser beam toward a predetermined one of the plurality of process chambers.Type: ApplicationFiled: June 14, 2021Publication date: March 17, 2022Inventors: JEE YOUNG LEE, YOUNG DAE CHUNG, JI HOON JEONG, TAE SHIN KIM, WON-GEUN KIM
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Publication number: 20220068698Abstract: The present disclosure provides a substrate treating apparatus. The substrate treating apparatus includes a support unit that supports a substrate, and a heating unit that irradiates a beam to the substrate and heat the substrate, and the heating unit further includes an irradiation part that irradiates the beam, and a rotation part that rotates the beam.Type: ApplicationFiled: August 5, 2021Publication date: March 3, 2022Inventors: JI HOON JEONG, WON-GEUN KIM, YOUNG DAE CHUNG, JEE YOUNG LEE, TAE SHIN KIM
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Publication number: 20220055074Abstract: The present disclosure provides a substrate treating apparatus. The substrate treating apparatus includes a support unit that supports a substrate, and a laser unit that irradiates a laser beam to the substrate supported by the support unit, the laser unit includes an irradiation member that irradiates the laser beam, a lens disposed on a travel path of the laser beam irradiated by the irradiation member to be rotatable, and a reflection member having an inclined surface for changing the travel path of the laser beam that passed through the lens.Type: ApplicationFiled: August 11, 2021Publication date: February 24, 2022Inventors: JI HOON JEONG, WON-GEUN KIM, YOUNG DAE CHUNG, TAE SHIN KIM, JEE YOUNG LEE
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Publication number: 20210202280Abstract: Proposed is a substrate heating unit including: a laser generator providing a laser beam for heating a substrate; and a beam shaper processing the laser beam from the laser generator and selectively providing one of a first beam having a uniform energy distribution and a second beam having an edge-enhanced energy distribution to the substrate.Type: ApplicationFiled: December 20, 2020Publication date: July 1, 2021Applicant: SEMES CO., LTD.Inventors: Tae Shin KIM, Young Dae CHUNG, Ji Hoon JEONG, Jee Young LEE, Won Geun KIM
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Publication number: 20210178522Abstract: A thin layer etching apparatus includes an etchant supply unit configured to supply an etchant onto a substrate to etch a thin layer formed on the substrate, a temperature measuring unit configured to measure a temperature of the substrate while an etching process is performed by the etchant, a laser irradiating unit configured to irradiate a first laser beam on a first portion including a central portion of the substrate and to irradiate a second laser beam in a ring shape on a second portion surrounding the first portion so that the temperature of the substrate is maintained at a predetermined temperature during the etching process, and a process control unit configured to control power of the first and second laser beams based on the temperature of the substrate measured by the temperature measuring unit to reduce a temperature difference between the first and second portions of the substrate.Type: ApplicationFiled: December 8, 2020Publication date: June 17, 2021Applicant: SEMES CO., LTD.Inventors: Won Geun KIM, Tae Shin KIM
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Publication number: 20210183660Abstract: Method and apparatus for etching a thin layer including silicon nitride formed on a substrate are disclosed. Etchant including phosphoric acid and water is supplied on the substrate so that a liquid layer is formed on the substrate. The thin layer is etched by reaction between the thin layer and the etchant. Thickness of the liquid layer is measured to detect variation in the thickness of the liquid layer while etching the thin layer. Variation in the concentration of the phosphoric acid and the water is calculated based on the variation in the thickness of the liquid layer. Water is supplied on the substrate based on the variation in the concentration of the phosphoric acid and the water so that the concentration of the phosphoric acid and the water becomes a predetermined value.Type: ApplicationFiled: December 8, 2020Publication date: June 17, 2021Applicant: SEMES CO., LTD.Inventors: Jung Suk GOH, Jae Seong LEE, Do Youn LIM, Kuk Saeng KIM, Young Dae CHUNG, Tae Shin KIM, Jee Young LEE, Won Geun KIM, Ji Hoon JEONG, Kwang Sup KIM, Pil Kyun HEO, Yoon Ki SA, Ye Rim YEON, Hyun YOON, Do Yeon KIM, Yong Jun SEO, Byeong Geun KIM, Young Je UM
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Publication number: 20210134614Abstract: A substrate treatment apparatus includes a substrate support unit, a chemical supply unit supplying a chemical solution onto an upper surface of a substrate supported on the substrate support unit, a laser irradiation unit applying a laser pulse to the substrate to heat the substrate, and a controller controlling the laser irradiation unit to emit the laser pulse such that the substrate is repeatedly heated and cooled to maintain a preset temperature.Type: ApplicationFiled: October 24, 2020Publication date: May 6, 2021Applicant: SEMES CO., LTD.Inventors: Young Dae CHUNG, Won Geun KIM, Jee Young LEE, Ji Hoon JEONG, Tae Shin KIM, Jung Suk GOH, Cheng Bin CUI, Ye Rim YEON