Patents by Inventor Won-mi CHOI
Won-mi CHOI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240167711Abstract: The simulation system for predicting heating and cooling loads of a building comprises the collection unit collecting measurement data of a target building from a BEMS, the identification unit identifying indoor and outdoor temperature, humidity, and insolation measured in the building in real time based on RTS method, the correlation derivation unit deriving a correlation between energy usage based on the BEMS measurement data collected by the collection unit and the cooling and heating loads according to indoor and outdoor temperature, humidity, and insolation identified by the identification unit, the simulation unit predicting a change in cooling and heating loads according to a change in at least one of pieces of measurement data based on the correlation derived from the correlation derivation unit to perform a simulation, and the information provision unit providing a simulation result from the simulation unit in a visible form to a user terminal.Type: ApplicationFiled: September 19, 2023Publication date: May 23, 2024Inventors: Tae Dong LEE, Won Jang PARK, Min Ho CHOI, Soo Hyun YANG, Moo Kyung SEO, Han Sung CHOI, Hye Mi LIM, Ji Hun PARK, So Jeong PARK, Ki Bum HAN, Hyeong Jae JEON
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Patent number: 11966106Abstract: An optical path control member according to an embodiment comprises: a first substrate; a first electrode disposed on the first substrate; a second substrate disposed on the first substrate; a second electrode disposed under the second substrate; and a light conversion part disposed between the first electrode and the second electrode, wherein: each of the first substrate and the second substrate includes a first direction, a second direction different from the first direction, and a third direction defined as a thickness-direction of the first substrate and the second substrate; the light conversion part includes a partition wall part and a reception part alternately arranged; and the reception part has a light transmittance changing according to application of a voltage, extends in a fourth direction, and has a lower surface inclined at an acute angle with respect to one side surface of the first substrate.Type: GrantFiled: April 15, 2021Date of Patent: April 23, 2024Assignee: LG INNOTEK CO., LTD.Inventors: In Hae Lee, Won Seok Choi, Chan Mi Ju
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Publication number: 20230207211Abstract: A multilayer electronic component includes a body including a dielectric layer and an internal electrode alternately disposed with the dielectric layer interposed therebetween in a first direction; and an external electrode disposed on the body and connected to the internal electrode, wherein 0.46 to 1.08 at% is a range of an indium (In) content compared to nickel (Ni) and indium (In) contents in a surface layer portion of the internal electrode.Type: ApplicationFiled: June 15, 2022Publication date: June 29, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Yu Hong Oh, Jun Oh Kim, Byung Kun Kim, Min Jung Cho, Won Mi Choi, Su Yeon Lee, Kyung Ryul Lee, Yun Sung Kang
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Patent number: 11313018Abstract: Present invention is about a transformation-induced plasticity high-entropy alloy which can provide improved mechanical properties compared to those obtained by conventional methods, due to the phase transformation occurring at the time of deformation at a cryogenic temperature. According to the present invention, the high-entropy alloy (HEA) includes 10-35 at % of Co, 3-15 at % of Cr, 3-15 at % of V, 35-48 at % of Fe, and 0-25 at % of Ni (exclusive of 25), and mainly consists of an FCC phase at room temperature, wherein transformation-induced plasticity, in which at least part of the FCC phase changes to a BCC phase, occurs at a cryogenic temperature (?196° C.Type: GrantFiled: March 30, 2018Date of Patent: April 26, 2022Assignee: POSTECH ACADEMY-INDUSTRY FOUNDATIONInventors: Byeong-joo Lee, Sung-hak Lee, Seok-su Sohn, Hyoung-seop Kim, Dong-geun Kim, Yong-hee Jo, Won-mi Choi
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Patent number: 11168386Abstract: The present invention relates to a high-entropy alloy especially having excellent low-temperature tensile strength and elongation by means of having configured, through thermodynamic calculations, an alloy composition region having an FCC single-phase microstructure at 700° C. or higher, and enabling the FCC single-phase microstructure at room temperature and at an ultra-low temperature. The high-entropy alloy, according to the present invention, comprises: Co: 3-12 at %; Cr: 3-18 at %; Fe: 3-50 at %; Mn: 3-20 at %; Ni: 17-45 at %; V: 3-12 at %; and unavoidable impurities, wherein the ratio of the V content to the Ni content (V/Ni) is 0.5 or less, and the sum of the V content and the Co content is 22 at % or less.Type: GrantFiled: March 21, 2017Date of Patent: November 9, 2021Assignees: POSTECH ACADEMY-INDUSTRY FOUNDATION, THE INDUSTRY & ACADEMIC COOPERATION IN CHUNGNAM NATIONAL UNIVERSITYInventors: Byeong-joo Lee, Sung-hak Lee, Hyoung-seop Kim, Young-sang Na, Sun-ig Hong, Won-mi Choi, Chang-woo Jeon, Seung-mun Jung
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Publication number: 20210269900Abstract: Present invention is about a transformation-induced plasticity high-entropy alloy which can provide improved mechanical properties compared to those obtained by conventional methods, due to the phase transformation occurring at the time of deformation at a cryogenic temperature. According to the present invention, the high-entropy alloy (HEA) includes 10-35 at % of Co, 3-15 at % of Cr, 3-15 at % of V, 35-48 at % of Fe, and 0-25 at % of Ni (exclusive of 25), and mainly consists of an FCC phase at room temperature, wherein transformation-induced plasticity, in which at least part of the FCC phase changes to a BCC phase, occurs at a cryogenic temperature (?196° C.Type: ApplicationFiled: March 30, 2018Publication date: September 2, 2021Applicant: POSTECH ACADEMY-INDUSTRY FOUNDATIONInventors: Byeong-joo LEE, Sung-hak LEE, Seok-su SOHN, Hyoung-seop KIM, Dong-geun KIM, Yong-hee JO, Won-mi CHOI
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Patent number: 10988834Abstract: The present invention relates to a high-entropy alloy especially having excellent low-temperature tensile strength and elongation by means of having configured, through thermodynamic calculations, an alloy composition region having an FCC single-phase microstructure at 700° C. or higher, and enabling the FCC single-phase microstructure at room temperature and at an ultra-low temperature. The high-entropy alloy, according to the present invention, comprises: Cr: 3-18 at %; Fe: 3-60 at %; Mn: 3-40 at% ; Ni: 20-80 at %: 3-12 at %; and unavoidable impurities, wherein the ratio of the V content to the Ni content (V/Ni) is 0.5 or less.Type: GrantFiled: March 21, 2017Date of Patent: April 27, 2021Assignees: POSTECH ACADEMY-INDUSTRY FOUNDATION, THE INDUSTRY & ACADEMIC COOPERATION IN CHUNGNAM NATIONAL UNIVERSITYInventors: Byeong-joo Lee, Sung-hak Lee, Hyoung-seop Kim, Young-sang Na, Sun-ig Hong, Won-mi Choi, Chang-woo Jeon, Seung-mun Jung
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Publication number: 20190071755Abstract: The present invention relates to a high-entropy alloy especially having excellent low-temperature tensile strength and elongation by means of having configured, through thermodynamic calculations, an alloy composition region having an FCC single-phase microstructure at 700° C. or higher, and enabling the FCC single-phase microstructure at room temperature and at an ultra-low temperature. The high-entropy alloy, according to the present invention, comprises: Co: 3-12 at %; Cr: 3-18 at %; Fe: 3-50 at %; Mn: 3-20 at %; Ni: 17-45 at %; V: 3-12 at %; and unavoidable impurities, wherein the ratio of the V content to the Ni content (V/Ni) is 0.5 or less, and the sum of the V content and the Co content is 22 at % or less.Type: ApplicationFiled: March 21, 2017Publication date: March 7, 2019Inventors: Byeong-joo LEE, Sung-hak LEE, Hyoung-seop KIM, Young-sang NA, Sun-ig HONG, Won-mi CHOI, Chang-woo JEON, Seung-mun JUNG
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Publication number: 20190055630Abstract: The present invention relates to a high-entropy alloy especially having excellent low-temperature tensile strength and elongation by means of having configured, through thermodynamic calculations, an alloy composition region having an FCC single-phase microstructure at 700° C. or higher, and enabling the FCC single-phase microstructure at room temperature and at an ultra-low temperature. The high-entropy alloy, according to the present invention, comprises: Cr: 3-18 at %; Fe: 3-60 at %; Mn: 3-40 at% ; Ni: 20-80 at %: 3-12 at %; and unavoidable impurities, wherein the ratio of the V content to the Ni content (V/Ni) is 0.5 or less.Type: ApplicationFiled: March 21, 2017Publication date: February 21, 2019Inventors: Byeong-joo LEE, Sung-hak LEE, Hyoung-seop KIM, Young-sang NA, Sung-ig HONG, Won-mi CHOI, Chang-woo JEON, Seung-mum JUNG