Patents by Inventor Won-Wook So
Won-Wook So has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11985757Abstract: A printed circuit board assembly includes a first printed circuit board, a second printed circuit board disposed on the first printed circuit board and including an antenna pattern, a third printed circuit board disposed on the first printed circuit board, one or more first electronic components disposed between the first and the second printed circuit board and electrically connected to at least one of the first and the second printed circuit board, one or more second electronic components disposed between the first and the third printed circuit board, and electrically connected to at least one of the first and the third printed circuit board, a first interposer substrate electrically connecting the first printed circuit board and the second printed circuit board to each other, and a second interposer substrate electrically connecting the first printed circuit board and the third printed circuit board to each other.Type: GrantFiled: July 9, 2021Date of Patent: May 14, 2024Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Won Wook So, Doo Il Kim, Young Sik Hur
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Publication number: 20240142597Abstract: Disclosed is a method of detecting a moving target by a target detecting apparatus. The method includes: acquiring radar data from a radar installed in a vehicle, extracting location coordinates of a moving target from the radar data, obtaining a line of a reflective surface on which a signal of the radar is reflected using location coordinates of a fixed object, determining whether the moving target is in a Line of Sight (LOS) area of the radar or in a Non Line of Sight (NLOS) area of the radar based on the location coordinates of the moving target and the line segment of the reflective surface, and based on determining that the moving target is in an area corresponding to the NLOS area of the radar, converting the location coordinates of the moving target into actual coordinates corresponding to an actual location of the moving target.Type: ApplicationFiled: January 30, 2023Publication date: May 2, 2024Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Won Wook SO, Gilha LEE, Taegyu RYU, YunJong LEE
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Publication number: 20240101810Abstract: The present invention relates to a composition for forming a composite polymer film, a method for preparing the composition for forming a composite polymer film, a composite polymer film and a method for preparing the composite polymer film. The composition for forming a composite polymer film comprises: a fluorine-based polymer solution comprising a fluorine-based polymer; and polyvinylidene fluoride nanoparticles dispersed in the fluorine-based polymer solution. The method for preparing the composition for forming a composite polymer film comprises the steps of: preparing a fluorine-based polymer solution comprising a fluorine-based polymer; and dispersing polyvinylidene fluoride nanoparticles in the fluorine-based polymer solution. The composite polymer film comprises: a polymer matrix formed from a fluorine-based polymer; and polyvinylidene fluoride nanoparticles dispersed in the polymer matrix.Type: ApplicationFiled: September 4, 2020Publication date: March 28, 2024Applicants: KOREA RESEARCH INSTITUTE OF CHEMICAL TECHNOLOGY, KOREA RESEARCH INSTITUTE OF CHEMICAL TECHNOLOGYInventors: Eun Ho SOHN, Shin Hong YOOK, Hong Suk KANG, In Joon PARK, Sang Goo LEE, Soo Bok LEE, Won Wook SO, Hyeon Jun HEO, Dong Je HAN, Seon Woo KIM
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Patent number: 11909099Abstract: An antenna module includes an antenna substrate including an antenna pattern; a semiconductor package disposed on a lower surface of the antenna substrate, electrically connected to the antenna substrate, and having a semiconductor chip embedded therein; and an electronic component disposed at a side of the antenna substrate, electrically connected to the antenna substrate, and spaced apart from the semiconductor package by a predetermined distance. The antenna module includes a connection substrate connected to a portion of the antenna substrate, the connection substrate having an extension portion extending outward from the side of the antenna substrate, and the electronic component is disposed on the extension portion of the connection substrate to electrically connect to an inner wiring layer of the antenna substrate.Type: GrantFiled: November 3, 2021Date of Patent: February 20, 2024Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Won Wook So, Jin Seon Park, Young Sik Hur, Jung Chul Gong, Yong Ho Baek
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Patent number: 11894614Abstract: An antenna apparatus includes: a ground plane including first sides parallel to a first direction and second sides parallel to a second direction, on a plane formed in the first and second directions; a dielectric layer disposed on the ground plane in a third direction; an antenna patch overlapping the ground plane in the third direction; and vias connected to the ground plane and passing through at least a portion of the dielectric layer. Edges of the vias at least partially overlap the first sides of the ground plane in the third direction.Type: GrantFiled: April 15, 2021Date of Patent: February 6, 2024Assignees: Samsung Electro-Mechanics Co., Ltd., Research & Business Foundation SUNGKYUNKWAN UNIVERSITYInventors: Won Wook So, Jeongki Ryoo, Woncheol Lee, Youngsik Hur, Keum Cheol Hwang, Nam Heung Kim, Yong-serk Kim
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Patent number: 11777200Abstract: An antenna module includes a first connection member including at least one first wiring layer and at least one first insulating layer; an antenna package disposed on a first surface of the first connection member, and including a plurality of antenna members and a plurality of feed vias; an integrated circuit (IC) disposed on a second surface of the first connection member and electrically connected to the corresponding wire of at least one first wiring layer; and a second connection member including at least one second wiring layer electrically connected to the IC and at least one second insulating layer, and disposed between the first connection member and the IC, wherein the second connection member has a third surface facing the first connection member and having an area smaller than that of the second surface, and a fourth surface facing the IC.Type: GrantFiled: April 8, 2021Date of Patent: October 3, 2023Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Doo Il Kim, Dae Kwon Jung, Young Sik Hur, Won Wook So, Yong Ho Baek, Woo Jung Choi
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Publication number: 20230278944Abstract: The present invention relates to a method for preparing a perfluorodialkyl ether, comprising the steps of: (A) preparing a perfluorodialkyl ether from a compound represented by Formula 1 in the presence of a metal fluoride; and (B) isolating the perfluorodialkyl ether, and to an apparatus for preparing perfluorodialkyl ether, comprising: a reactor for preparing a perfluorodialkyl ether from a compound represented by Formula 1 in the presence of a metal fluoride; a reactant supplier for introducing the compound represented by Formula 1 into the reactor; and a discharge unit for discharging the perfluorodialkyl ether from the upper portion of the reactor.Type: ApplicationFiled: July 26, 2021Publication date: September 7, 2023Applicants: KOREA RESEARCH INSTITUTE OF CHEMICAL TECHNOLOGY, KOREA ELECTROTECHNOLOGY RESEARCH INSTITUTEInventors: Sang Goo LEE, In Joon PARK, Won Wook SO, Shin Hong YOOK, Hong Suk KANG, Eun Ho SOHN, Ki Dong SONG, Yeon Ho OH, Hyun Jae JANG
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Publication number: 20230152425Abstract: A method for detecting a moving target through a vehicle radar system includes acquiring radar data from a radar sensor disposed with respect to a vehicle, and using the radar data to detect a plane of a structure. The method also includes setting a reference classification line based on the detected plane, and determining whether the moving target is in a line of sight (LOS) area or a non-line of sight (NLOS) area based on the reference classification line.Type: ApplicationFiled: July 13, 2022Publication date: May 18, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Won Wook SO, Gilha LEE, Taegyu RYU
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Patent number: 11641065Abstract: An antenna device is provided. The antenna device includes a first antenna patch configured to transmit and receive an RF signal in a first frequency bandwidth and disposed a first dielectric layer; a second antenna patch disposed on a second dielectric layer and coupled to the first antenna patch; a third antenna patch disposed on a third dielectric layer and coupled to the second antenna patch; and a fourth antenna patch configured to transmit and receive an RF signal in the second frequency bandwidth, wherein the second antenna patch includes a plurality of first sub-antenna patches that do not overlap the first antenna patch, and the third antenna patch includes a plurality of second sub-antenna patches that overlap the first sub-antenna patches.Type: GrantFiled: June 29, 2021Date of Patent: May 2, 2023Assignees: Samsung Electro-Mechanics Co., Ltd., Research & Business Foundation SUNGKYUNKWAN UNIVERSITYInventors: Won Wook So, Jeongki Ryoo, Woncheol Lee, Youngsik Hur, Keum Cheol Hwang, Nam Heung Kim, Yong-Serk Kim
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Publication number: 20230121641Abstract: A dielectric resonator antenna includes a dielectric material block extending in a first direction, a second direction different from the first direction, and a third direction perpendicular to the first direction and the second direction; and a feeding part extending in the third direction from a bottom surface of the dielectric material block to a part of the dielectric material block, wherein the feeding part overlaps a diagonal, or an extension line of the diagonal, of the bottom surface of the dielectric material block intersecting a first position where a first edge of the bottom surface of the dielectric material block parallel to the first direction and a second edge of the bottom surface of the dielectric material block parallel to the second direction meet.Type: ApplicationFiled: September 30, 2022Publication date: April 20, 2023Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Woncheol LEE, Wongi KIM, Jeongki RYOO, Won Wook SO, Gilha LEE, Sungyong AN
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Publication number: 20230100403Abstract: According to an embodiment of the present invention, provided is a process for polymerizing molecular weight—adjustable polymer, comprising: a reactant supply step of supplying a gaseous monomer, a surfactant, and an initiator; a polymerization reaction step of performing a polymerization reaction in which the monomer, the surfactant, and the initiator participate; and a product discharging step of discharging the polymer compound produced by the polymerization reaction, wherein the flow rate of the supplied initiator is inversely proportional to the molecular weight of the polymer compound, and the molecular weight of the polymer compound produced by the polymerization reaction is adjusted by controlling the flow rate of the initiator.Type: ApplicationFiled: February 22, 2021Publication date: March 30, 2023Applicant: KOREA RESEARCH INSTITUTE OF CHEMICAL TECHNOLOGYInventors: Hong Suk KANG, In Joon PARK, Shin Hong YOOK, Eun-Ho SOHN, Sang Goo LEE, Soo Bok LEE, Won Wook SO
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Patent number: 11581275Abstract: An antenna module includes an antenna substrate, a first semiconductor package, disposed on the antenna substrate, including a first connection member including one or more first redistribution layers, electrically connected to the antenna substrate, and a first semiconductor chip disposed on the first connection member, and a second semiconductor package, disposed on the antenna substrate to be spaced apart from the first semiconductor package, including a second connection member including one or more second redistribution layers, electrically connected to the antenna substrate, and a second semiconductor chip disposed on the second connection member. The first semiconductor chip and the second semiconductor chip are different types of semiconductor chips.Type: GrantFiled: December 23, 2020Date of Patent: February 14, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Doo Il Kim, Won Wook So, Young Sik Hur, Jung Chul Gong
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Patent number: 11503713Abstract: An antenna substrate includes: a first substrate including an antenna pattern disposed on an upper surface of the first substrate; a second substrate having a first planar surface, an area of which is smaller than an area of a planar surface of the first substrate; and a flexible substrate connecting the first and second substrates to each other and bent to allow the first planar surface of the second substrate to face a side surface of the first substrate, which is perpendicular to the upper surface of the first substrate.Type: GrantFiled: November 17, 2020Date of Patent: November 15, 2022Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Doo Il Kim, Young Sik Hur, Won Wook So, Yong Ho Baek
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Patent number: 11482786Abstract: An antenna apparatus includes a ground layer and an antenna patch overlapping via a dielectric layer therebetween, a first feed via and a second feed via penetrating at least a portion of the dielectric layer, a power supply line connected to the first feed via, and a coupling pattern disposed adjacent to the power supply line and coupled with the power supply line.Type: GrantFiled: December 9, 2020Date of Patent: October 25, 2022Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Eunhyuk Kwak, Won Wook So, Juhyoung Park, Daeki Lim, Jeongki Ryoo, Nam Ki Kim, Woncheol Lee, Hyungjin Lee, Dongok Ko, Jaemin Keum
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Publication number: 20220166149Abstract: An antenna device is provided. The antenna device includes a first antenna patch configured to transmit and receive an RF signal in a first frequency bandwidth and disposed a first dielectric layer; a second antenna patch disposed on a second dielectric layer and coupled to the first antenna patch; a third antenna patch disposed on a third dielectric layer and coupled to the second antenna patch; and a fourth antenna patch configured to transmit and receive an RF signal in the second frequency bandwidth, wherein the second antenna patch includes a plurality of first sub-antenna patches that do not overlap the first antenna patch, and the third antenna patch includes a plurality of second sub-antenna patches that overlap the first sub-antenna patches.Type: ApplicationFiled: June 29, 2021Publication date: May 26, 2022Applicants: SAMSUNG ELECTRO-MECHANICS CO., LTD., Research & Business Foundation SUNGKYUNKWAN UNIVERSITYInventors: Won Wook SO, Jeongki RYOO, Woncheol LEE, Youngsik HUR, Keum Cheol HWANG, Nam Heung KIM, Yong-serk KIM
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Publication number: 20220123479Abstract: An antenna apparatus includes: a ground plane including first sides parallel to a first direction and second sides parallel to a second direction, on a plane formed in the first and second directions; a dielectric layer disposed on the ground plane in a third direction; an antenna patch overlapping the ground plane in the third direction; and vias connected to the ground plane and passing through at least a portion of the dielectric layer. Edges of the vias at least partially overlap the first sides of the ground plane in the third direction.Type: ApplicationFiled: April 15, 2021Publication date: April 21, 2022Applicants: SAMSUNG ELECTRO-MECHANICS CO., LTD., Research & Business Foundation SUNGKYUNKWAN UNIVERSITYInventors: Won Wook SO, Jeongki RYOO, Woncheol LEE, Youngsik HUR, Keum Cheol HWANG, Nam Heung KIM, Yong-serk KIM
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Publication number: 20220077584Abstract: An antenna apparatus includes a ground layer and an antenna patch overlapping via a dielectric layer therebetween, a first feed via and a second feed via penetrating at least a portion of the dielectric layer, a power supply line connected to the first feed via, and a coupling pattern disposed adjacent to the power supply line and coupled with the power supply line.Type: ApplicationFiled: December 9, 2020Publication date: March 10, 2022Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Eunhyuk KWAK, Won Wook SO, Juhyoung PARK, Daeki LIM, Jeongki RYOO, Nam Ki KIM, Woncheol LEE, Hyungjin LEE, Dongok KO, Jaemin KEUM
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Publication number: 20220059926Abstract: An antenna module includes an antenna substrate including an antenna pattern; a semiconductor package disposed on a lower surface of the antenna substrate, electrically connected to the antenna substrate, and having a semiconductor chip embedded therein; and an electronic component disposed at a side of the antenna substrate, electrically connected to the antenna substrate, and spaced apart from the semiconductor package by a predetermined distance. The antenna module includes a connection substrate connected to a portion of the antenna substrate, the connection substrate having an extension portion extending outward from the side of the antenna substrate, and the electronic component is disposed on the extension portion of the connection substrate to electrically connect to an inner wiring layer of the antenna substrate.Type: ApplicationFiled: November 3, 2021Publication date: February 24, 2022Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Won Wook SO, Jin Seon PARK, Young Sik HUR, Jung Chul GONG, Yong Ho BAEK
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Patent number: 11177551Abstract: An antenna module includes: an antenna substrate including an antenna pattern; a semiconductor package disposed on a lower surface of the antenna substrate, electrically connected to the antenna substrate, and having at least one semiconductor chip embedded therein; and an electronic component disposed on the lower surface or a side surface of the antenna substrate, electrically connected to the antenna substrate, and spaced apart from the semiconductor package by a predetermined distance. The electronic component has a thickness greater than that of the semiconductor chip.Type: GrantFiled: March 4, 2019Date of Patent: November 16, 2021Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Won Wook So, Jin Seon Park, Young Sik Hur, Jung Chul Gong, Yong Ho Baek
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Publication number: 20210337652Abstract: A printed circuit board assembly includes a first printed circuit board, a second printed circuit board disposed on the first printed circuit board and including an antenna pattern, a third printed circuit board disposed on the first printed circuit board, one or more first electronic components disposed between the first and the second printed circuit board and electrically connected to at least one of the first and the second printed circuit board, one or more second electronic components disposed between the first and the third printed circuit board, and electrically connected to at least one of the first and the third printed circuit board, a first interposer substrate electrically connecting the first printed circuit board and the second printed circuit board to each other, and a second interposer substrate electrically connecting the first printed circuit board and the third printed circuit board to each other.Type: ApplicationFiled: July 9, 2021Publication date: October 28, 2021Inventors: Won Wook SO, Doo Il KIM, Young Sik HUR