Patents by Inventor Won-yeong Kim

Won-yeong Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240162113
    Abstract: In one example, an electronic device comprises a substrate comprising a conductive structure and an inner side and an outer side, a first electronic component over the inner side of the substrate and coupled with the conductive structure, a lid over the substrate and the first electronic component and comprising a first hole in the lid, and a thermal interface material between the first electronic component and the lid. The thermal interface material is in the first hole. Other examples and related methods are also disclosed herein.
    Type: Application
    Filed: November 11, 2022
    Publication date: May 16, 2024
    Applicants: Amkor Technology Singapore Holding Pte. Ltd., Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Dong Hyeon Park, Yun Ah Kim, Seok Ho Na, Won Ho Choi, Dong Su Ryu, Jo Hyun Bae, Min Jae Kong, Jin Young Khim, Jae Yeong Bae, Dong Hee Kang
  • Publication number: 20240145779
    Abstract: Provided is a biphasic electrolyte solution including: an aqueous electrolyte solution layer including a kosmotropic metal salt and water; and a nonaqueous electrolyte solution layer including a second metal salt and a nonaqueous organic solvent, and the biphasic electrolyte solution may provide a battery which satisfies both excellent battery performance and life characteristics.
    Type: Application
    Filed: October 26, 2023
    Publication date: May 2, 2024
    Inventors: Sang-Young LEE, Won-Yeong KIM, Hong-I KIM
  • Patent number: 11963386
    Abstract: A display apparatus includes a base substrate, a light emitting structure disposed on the base substrate, and a thin film encapsulation layer disposed on the light emitting structure and including at least one inorganic layer and at least one organic layer. The at least one inorganic layer includes a high density layer having a density of greater than or equal to about 2.0 g/cm3 and a low density layer having a density of less than about 2.0 g/cm3. The high density layer and the low density layer are in contact with each other.
    Type: Grant
    Filed: September 2, 2022
    Date of Patent: April 16, 2024
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Chang Yeong Song, Won Jong Kim, Yi Su Kim, Jong Woo Kim, Hye In Yang, Woo Suk Jung, Yong Chan Ju, Jae Heung Ha
  • Publication number: 20240075724
    Abstract: Disclosed is a dental orthodontic sheet having a composite structure in which different materials are stacked and bound to each other. The composite structure dental orthodontic sheet includes a first sheet layer, a second sheet layer, and an intermediate sheet layer formed between the first sheet layer and the second sheet layer, wherein the intermediate sheet layer includes a mat portion made of a softer material than each of the first sheet layer and the second sheet layer, the mat portion being formed so as to have a mesh structure, and a binding portion configured to allow mesh holes of the mat portion to be filled with materials of the first sheet layer and the second sheet layer such that the first sheet layer and the second sheet layer are bound to each other.
    Type: Application
    Filed: May 30, 2023
    Publication date: March 7, 2024
    Applicant: DENTIS CO., LTD.
    Inventors: Gi Bong SIM, Hee Seok PARK, Byeong Il KIM, Eun Yeong PARK, Won Gun CHANG
  • Publication number: 20240072228
    Abstract: A display device comprises a first pixel including a first emission area, a second pixel including a second emission area spaced apart from the first emission area in a first direction, and a bank partitioning the first emission area and the second emission area, wherein the first pixel includes a first alignment electrode, a second alignment electrode, and a third alignment electrode sequentially located, spaced apart from each other in the first direction, and overlapping with the first emission area, first light-emitting elements above, and overlapping with, the first alignment electrode and the second alignment electrode, second light-emitting elements above, and overlapping with, the second alignment electrode and the third alignment electrode, and a dummy electrode between the first emission area and the second emission area, and overlapping with the bank.
    Type: Application
    Filed: August 2, 2023
    Publication date: February 29, 2024
    Inventors: Won Jun LEE, Dong Woo KIM, Do Yeong PARK, Se Hyun LEE, Kwi Hyun KIM, Min Gyeong SHIN, Jin Joo HA
  • Patent number: 10465761
    Abstract: The present invention relates to a coil spring pad for a vehicle suspension system, comprising: an accommodating groove (51) in which a lower end portion of a coil spring (10) is inserted and accommodated; and a pad extension part (55) which is formed from a first surface (35) of an upper surface (33) of a coil spring pad (31) and covers the whole section, except for a convexly raised portion and a through hole (73) of a lower seat (71), thereby preventing horizontal deformation of the coil spring pad (31).
    Type: Grant
    Filed: August 22, 2016
    Date of Patent: November 5, 2019
    Assignee: DAEWON KANG UP CO., LTD.
    Inventors: Ha-Yun Kim, Bong-Soo Jun, Jai-Shik Yi, Won-Yeong Kim
  • Patent number: 6071350
    Abstract: An apparatus for manufacturing a semiconductor device employs a vacuum system, in which a heating source is installed in a predetermined portion of a venting-gas inlet. A venting-speed controlling valve is installed in a predetermined portion of an exhaust pipe, for controlling the speed of gas flowing from a load lock chamber to a pump by controlling the opening and closing thereof. An exhaust pipe may have a main pipe with different diameters in different portions to reduce the venting speed. Accordingly, condensation-induced particle formation can be reduced by thus preventing adiabatic expansion of the gas in a load lock chamber.
    Type: Grant
    Filed: December 1, 1997
    Date of Patent: June 6, 2000
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jae-sun Jeon, Won-yeong Kim, Yun-mo Yang, Seung-ki Chae
  • Patent number: 5833425
    Abstract: An apparatus for manufacturing a semiconductor device by employing a vacuum system is provided. A heating source is installed in a predetermined portion of a venting-gas inlet. A venting-speed controlling valve is installed in a predetermined portion of an exhaust pipe, for controlling the speed of gas flowing from a load lock chamber to a pump by controlling the opening and closing thereof. An exhaust pipe may have a main pipe with different diameters in different portions to reduce the venting speed. Accordingly, condensation-induced particle formation can be reduced by thus preventing adiabatic expansion of the gas in a load lock chamber.
    Type: Grant
    Filed: November 20, 1996
    Date of Patent: November 10, 1998
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jae-sun Jeon, Won-yeong Kim, Yun-mo Yang, Seung-ki Chae