Patents by Inventor Won-Hyeog Jin

Won-Hyeog Jin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6641983
    Abstract: The present invention to a method for forming an exposed portion of a circuit pattern in a printed circuit board, wherein a solder resist is coated on a substrate having a circuit pattern, is hardened, and thereafter is processed by a laser in order to form a portion exposing the circuit pattern such as the solder land. When the solder resist is processed by the laser, the number of errors can be greatly reduced as compared to a processing error occurred in exposure or developing process, whereby a circuit pattern that is integrated higher than the solder land is formed for thereby miniaturizing the printed circuit board.
    Type: Grant
    Filed: September 11, 2000
    Date of Patent: November 4, 2003
    Assignee: LG Electronics Inc.
    Inventors: Sung-Gue Lee, Yong-Soon Jang, Won-Hyeog Jin