Patents by Inventor Won Suk Lee
Won Suk Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240147677Abstract: A lower module of a power electronic device includes a lower module included in a power electronic device that is divided into an upper module and a lower module by an intermediate plate and comprises a blower fan to introduce air into the inner space of the lower module; a plurality of capacitors installed in a suspended form on the intermediate plate and spaced apart from the blower fan; a heat sink having a plurality of heat dissipation fins through which heat generated from a heating component disposed on the upper module is conducted, and disposed adjacent to the capacitors to cool the plurality of heat dissipation fins by air moved from the plurality of capacitors; a DC reactor cooled by the air moved from the heat dissipation fins; and a discharge plate having a vent hole to discharge the air moved from the DC reactor to the outside.Type: ApplicationFiled: December 3, 2021Publication date: May 2, 2024Inventors: Soo Yong HWANG, Kil Ju JUNG, Su Hyeong LEE, Won Suk CHOI, Kyu Hwa KIM
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Publication number: 20240136538Abstract: Disclosed is an ionomer for a high-temperature polymer electrolyte membrane fuel cell, which includes a phosphorus (P)-containing functional group having proton conductivity and partially contains fluorine in the main chain thereof.Type: ApplicationFiled: December 20, 2022Publication date: April 25, 2024Inventors: Won Jae Choi, Songi Oh, Da Hee Kwak, Ji Hoon Jang, Sung Hee Shin, Jae Suk Lee, Hye Min Oh, In Gyu Bak
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Publication number: 20240126013Abstract: A structure includes a polarization device such as a polarization splitter, a polarization combiner or a polarization splitter rotator including a waveguide having a light absorber at an end section with an at least hook shape, e.g., it can be hooked or spiral shape. The structure also includes another waveguide adjacent the stated waveguide. The hook or spiral shape acts as a light absorber that reduces undesired optical noise such as excessive light insertion loss and/or light scattering. The hook or spiral shape may also be used on supplemental waveguides used to further filter and/or refine an optical signal in one of the waveguides of the polarization device, e.g., downstream of an output section of the polarization splitter and/or rotator.Type: ApplicationFiled: October 13, 2022Publication date: April 18, 2024Inventors: Yusheng Bian, Won Suk Lee, Andreas D. Stricker
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Publication number: 20240103221Abstract: Structures for an optical coupler and methods of forming a structure for an optical coupler. The structure comprises a stacked waveguide core including a first waveguide core and a second waveguide core. The first waveguide core includes a first tapered section, and the second waveguide core includes a second tapered section positioned to overlap with the first tapered section. The structure further comprises a third waveguide core including a third tapered section positioned adjacent to the first tapered section of the first waveguide core and the second tapered section of the second waveguide core.Type: ApplicationFiled: September 26, 2022Publication date: March 28, 2024Inventors: Yusheng Bian, Won Suk Lee
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Publication number: 20240101810Abstract: The present invention relates to a composition for forming a composite polymer film, a method for preparing the composition for forming a composite polymer film, a composite polymer film and a method for preparing the composite polymer film. The composition for forming a composite polymer film comprises: a fluorine-based polymer solution comprising a fluorine-based polymer; and polyvinylidene fluoride nanoparticles dispersed in the fluorine-based polymer solution. The method for preparing the composition for forming a composite polymer film comprises the steps of: preparing a fluorine-based polymer solution comprising a fluorine-based polymer; and dispersing polyvinylidene fluoride nanoparticles in the fluorine-based polymer solution. The composite polymer film comprises: a polymer matrix formed from a fluorine-based polymer; and polyvinylidene fluoride nanoparticles dispersed in the polymer matrix.Type: ApplicationFiled: September 4, 2020Publication date: March 28, 2024Applicants: KOREA RESEARCH INSTITUTE OF CHEMICAL TECHNOLOGY, KOREA RESEARCH INSTITUTE OF CHEMICAL TECHNOLOGYInventors: Eun Ho SOHN, Shin Hong YOOK, Hong Suk KANG, In Joon PARK, Sang Goo LEE, Soo Bok LEE, Won Wook SO, Hyeon Jun HEO, Dong Je HAN, Seon Woo KIM
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Patent number: 11941153Abstract: Provided is a de-identification method for big data, for anonymizing the big data so that the big data may be freely distributed to an external system without concern about personal information leakage and enabling a statistical value calculated from the distributed data to be maximally close to a statistical value of original data to thereby secure the reliability of statistical analysis. Records in which values of abstraction reference fields are all the same and the number thereof is less than or equal to N are separately grouped without being excluded from being abstracted, and a connection-type attribute value including an occurrence rate value of a corresponding category attribute value in a group is allocated as an attribute value of an abstracted record to minimize abstraction missing data, so that the statistical value calculated from the distributed data becomes maximally close to the statistical value of the original data.Type: GrantFiled: May 31, 2019Date of Patent: March 26, 2024Assignee: BOALA CO., LTD.Inventor: Won Suk Lee
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Publication number: 20240099081Abstract: A flexible display device including a substrate, a light emitting layer, a first insulating layer, and a conductive layer. The substrate includes a bent region and a non-bent region. The light emitting layer overlaps the non-bent region. The first insulating layer is disposed on the substrate. The conductive layer is disposed on the first insulating layer. A sidewall of the first insulating layer includes a first tapered surface. The first tapered surface includes at least three curved surface portions continuously arranged with one another.Type: ApplicationFiled: November 27, 2023Publication date: March 21, 2024Inventors: Ki Hyun CHO, Yong Jae PARK, Sang Jo LEE, Won Suk CHOI, Yoon Sun CHOI
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Patent number: 11803012Abstract: Disclosed is a photonic structure and associated method. The structure includes a closed-curve waveguide having a first height, as measured from the top surface of an insulator layer, and an outer curved sidewall that extends essentially vertically the full first height (e.g., to minimize signal loss). The structure includes a closed-curve thermal coupler and a heating element. The closed-curve thermal coupler is thermally coupled to and laterally surrounded by the closed-curve waveguide and has a second height that is less than the first height. In some embodiments, the closed-curve waveguide and the closed-curve thermal coupler are continuous portions of the same semiconductor layer having different thicknesses. The heating element is thermally coupled to the closed-curve thermal coupler and thereby indirectly thermally coupled to the closed-curve waveguide.Type: GrantFiled: November 15, 2022Date of Patent: October 31, 2023Assignee: GlobalFoundries U.S. Inc.Inventors: Michal Rakowski, Petar I. Todorov, Yusheng Bian, Won Suk Lee, Asif J. Chowdhury, Kenneth J. Giewont
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Patent number: 11798466Abstract: A display device can include a display panel configured to display an image, a scan driving circuit configured to supply a scan signal to the display panel, and a data driving circuit configured to supply a data voltage to the display panel. The data driving circuit can include a data controller configured to vary an output timing of the data voltage based on independent control for each of at least one latch.Type: GrantFiled: September 27, 2022Date of Patent: October 24, 2023Assignee: LG DISPLAY CO., LTD.Inventor: Won Suk Lee
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Publication number: 20230269104Abstract: Provided is a method of managing a data history and a device performing the method. The method of managing the data history includes generating second data based on first data, calculating a second hash value for the second data based on the second data and a first hash value for the first data, and storing the second hash value on a blockchain network to verify the second data, and a history of the first data is verified using the first hash value stored on the blockchain network.Type: ApplicationFiled: December 9, 2022Publication date: August 24, 2023Inventors: Min Kyo IN, Won Suk LEE, Suwook HA
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Patent number: 11693184Abstract: The present disclosure relates to semiconductor structures and, more particularly, to waveguide attenuators and methods of manufacture. The structure includes: a main bus waveguide structure; a first hybrid waveguide structure evanescently coupled to the main bus waveguide structure and comprising a first geometry of material; and a second hybrid waveguide structure evanescently coupled to the main bus waveguide structure and comprising a second geometry of the material.Type: GrantFiled: May 20, 2022Date of Patent: July 4, 2023Assignee: GLOBALFOUNDRIES U.S. INC.Inventors: Yusheng Bian, Won Suk Lee, Abdelsalam A. Aboketaf
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Publication number: 20230197604Abstract: A semiconductor device is provided. The semiconductor device includes: a first interlayer insulating film defining a lower wiring trench; a lower wiring structure including a first lower barrier film which extends along sidewalls of the lower wiring trench, and a lower filling film which is on the first lower barrier film; a second interlayer insulating film on the first interlayer insulating film, the second interlayer insulating film defining an upper wiring trench which exposes at least part of the lower wiring structure; and an upper wiring structure provided in the upper wiring trench and connected to the lower wiring structure. An upper surface of the first lower barrier film is closer to a bottom surface of the lower wiring trench than each of an upper surface of the first interlayer insulating film and an upper surface the lower filling film. The upper surface of the first lower barrier film is concave.Type: ApplicationFiled: June 21, 2022Publication date: June 22, 2023Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: John Soo KIM, Min Wook CHUNG, Kyoung Suk KIM, Soo Kyung KIM, Won Suk LEE, Jong Jin LEE
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Publication number: 20230196980Abstract: A display device can include a display panel configured to display an image, a scan driving circuit configured to supply a scan signal to the display panel, and a data driving circuit configured to supply a data voltage to the display panel. The data driving circuit can include a data controller configured to vary an output timing of the data voltage based on independent control for each of at least one latch.Type: ApplicationFiled: September 27, 2022Publication date: June 22, 2023Applicant: LG Display Co., Ltd.Inventor: Won Suk LEE
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Patent number: 11630912Abstract: Provided are a system and a method for controlling transaction data access. A system for controlling transaction data access comprising: a transaction management module configured to determine a plurality of security levels for transaction data; a data encryption module configured to perform multiple level encrypting the transaction data according to the plurality of security levels; and a data storage module configured to store the encrypted data as a block, and provide the block to a peer-to-peer (P2P) network.Type: GrantFiled: March 18, 2021Date of Patent: April 18, 2023Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTEInventors: Min Kyo In, Won Suk Lee
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Patent number: 11610839Abstract: The present disclosure relates to semiconductor structures and, more particularly, to dummy fill structures and methods of manufacture. The structure includes: a passive device formed in interlevel dielectric material; and a plurality of metal dummy fill structures composed of at least one main branch and two extending legs from at least one side of the main branch, the at least two extending legs being positioned and structured to suppress eddy currents of the passive device.Type: GrantFiled: October 29, 2019Date of Patent: March 21, 2023Assignee: GLOBALFOUNDRIES U.S. INC.Inventors: Tung-Hsing Lee, Teng-Yin Lin, Frank W. Mont, Edward J. Gordon, Asmaa Elkadi, Alexander Martin, Won Suk Lee, Anvitha Shampur
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Patent number: 11609475Abstract: Embodiments of the disclosure provide an optical ring modulator. The optical ring modulator includes waveguide with a first semiconductor material of a first doping type, and a second semiconductor material having a second doping type adjacent the first semiconductor material. A P-N junction is between the first semiconductor material and the second semiconductor material. A plurality of photonic crystal layers, each embedded within the first semiconductor material or the second semiconductor material, has an upper surface that is substantially coplanar with an upper surface of the waveguide structure.Type: GrantFiled: December 11, 2020Date of Patent: March 21, 2023Assignee: GLOBALFOUNDRIES U.S. Inc.Inventors: Michal Rakowski, Yusheng Bian, Won Suk Lee, Roderick A. Augur
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Publication number: 20230073958Abstract: Disclosed is a photonic structure and associated method. The structure includes a closed-curve waveguide having a first height, as measured from the top surface of an insulator layer, and an outer curved sidewall that extends essentially vertically the full first height (e.g., to minimize signal loss). The structure includes a closed-curve thermal coupler and a heating element. The closed-curve thermal coupler is thermally coupled to and laterally surrounded by the closed-curve waveguide and has a second height that is less than the first height. In some embodiments, the closed-curve waveguide and the closed-curve thermal coupler are continuous portions of the same semiconductor layer having different thicknesses. The heating element is thermally coupled to the closed-curve thermal coupler and thereby indirectly thermally coupled to the closed-curve waveguide.Type: ApplicationFiled: November 15, 2022Publication date: March 9, 2023Inventors: Michal Rakowski, Petar I. Todorov, Yusheng Bian, Won Suk Lee, Asif J. Chowdhury, Kenneth J. Giewont
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Patent number: 11567260Abstract: Structures including an optical component and methods of forming a structure including an optical component. The structure includes an optical component on a substrate, and a back-end-of-line stack including multiple metal levels. Each of the metal levels includes a dielectric layer and metal features positioned over the optical component as metal fill in the dielectric layer. The metal features in at least two of the metal levels are arranged to overlap such that the optical component is fully covered normal to the substrate.Type: GrantFiled: October 14, 2021Date of Patent: January 31, 2023Assignee: GlobalFoundries U.S. Inc.Inventors: Yusheng Bian, Won Suk Lee, Lin Jiang, Colleen Meagher
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Patent number: 11555964Abstract: Disclosed is a photonic structure and associated method. The structure includes a closed-curve waveguide having a first height, as measured from the top surface of an insulator layer, and an outer curved sidewall that extends essentially vertically the full first height (e.g., to minimize signal loss). The structure includes a closed-curve thermal coupler and a heating element. The closed-curve thermal coupler is thermally coupled to and laterally surrounded by the closed-curve waveguide and has a second height that is less than the first height. In some embodiments, the closed-curve waveguide and the closed-curve thermal coupler are continuous portions of the same semiconductor layer having different thicknesses. The heating element is thermally coupled to the closed-curve thermal coupler and thereby indirectly thermally coupled to the closed-curve waveguide.Type: GrantFiled: June 30, 2021Date of Patent: January 17, 2023Assignee: GlobalFoundries U.S. Inc.Inventors: Michal Rakowski, Petar I. Todorov, Yusheng Bian, Won Suk Lee, Asif J. Chowdhury, Kenneth J. Giewont
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Publication number: 20230003937Abstract: Disclosed is a photonic structure and associated method. The structure includes a closed-curve waveguide having a first height, as measured from the top surface of an insulator layer, and an outer curved sidewall that extends essentially vertically the full first height (e.g., to minimize signal loss). The structure includes a closed-curve thermal coupler and a heating element. The closed-curve thermal coupler is thermally coupled to and laterally surrounded by the closed-curve waveguide and has a second height that is less than the first height. In some embodiments, the closed-curve waveguide and the closed-curve thermal coupler are continuous portions of the same semiconductor layer having different thicknesses. The heating element is thermally coupled to the closed-curve thermal coupler and thereby indirectly thermally coupled to the closed-curve waveguide.Type: ApplicationFiled: June 30, 2021Publication date: January 5, 2023Applicant: GLOBALFOUNDRIES U.S. Inc.Inventors: Michal Rakowski, Petar I. Todorov, Yusheng Bian, Won Suk Lee, Asif J. Chowdhury, Kenneth Giewont