Abstract: A semiconductor device includes a substrate, an active pattern disposed on the substrate and extending in a first direction, gate electrodes covering the active pattern and extending in a second direction, a gate spacer disposed on a sidewall of each of the gate electrodes, a source/drain pattern disposed between adjacent ones of the gate electrodes, an etch stop film disposed along a sidewall of the gate spacer and a profile of the source/drain pattern, an interlayer insulating film disposed between the adjacent ones of the gate electrodes with a contact trench exposing the source/drain pattern defined therein, a liner film disposed on an outer sidewall of the contact trench, and a source/drain contact disposed on the liner film and filling the contact trench, in which the source/drain contact is connected to the source/drain pattern. At least a portion of the liner film may be disposed in the source/drain pattern.

Abstract: A light emitting display device includes a display panel including a subpixel, and a driver configured to drive the display panel, and in the subpixel, initialization of both ends of an organic light emitting diode is performed simultaneously with writing of a data voltage.

Abstract: A semiconductor memory device includes a memory cell array, a row decoder, a plurality of page buffers, and a voltage switching circuit. The memory cell array includes a plurality of memory cells. The row decoder is connected to the memory cell array through word lines. The plurality of page buffers are connected to the memory cell array through bit lines. The voltage switching circuit decodes an operation voltage and transmits the decoded operation voltage to the row decoder. The plurality of page buffers are formed in a first under cell region among first and second under cell regions, the first and second under cell regions being adjacent to each other in a first direction under the memory cell array. At least a portion of the voltage switching circuit is formed in an under slim region that is adjacent to the first under cell region and the second under cell region in a second direction.

Abstract: A three-dimensional semiconductor device may comprise a first cell region, a second cell region, and a via plug region disposed between the first cell region and the second cell region; a word line stack disposed in the first cell region, the via plug region, and the second cell region, the word line stack including a plurality of word lines and a plurality of interlayer insulating layers which are alternately stacked; and a plurality of via plugs exclusively connected to the plurality of the word lines, respectively, by vertically penetrating through the word line stack in the via plug region. The via plugs may have an arrangement of a zigzag pattern in a row direction from a top view. The diameters of the via plugs may increase in the row direction.

Abstract: A memory may include a first wafer, and a second wafer stacked on and bonded to the first wafer. The first wafer may include a cell structure including a memory cell array; and a first logic structure disposed under the cell structure, and including a row control circuit. The second wafer may include a second logic structure including a column control circuit.

Abstract: The present invention relates to a technical idea of cooling the surface of a material or the internal temperature under the material by emitting heat under an element to the outside while minimizing absorption of light in the solar spectrum, and more particularly to a technology for developing a material having a high transmittance or high reflectance with respect to incident sunlight and a high absorptivity selectively in a wavelength range of 8 ?m to 13 ?m corresponding to the sky window section of the atmosphere.

Abstract: An aspect of the present disclosure relates to a high-strength steel material having enhanced resistance to crack initiation and propagation at low temperature.

Abstract: An aspect of the present invention relates to a high-strength steel, having excellent fracture initiation resistance and fracture propagation arrestability at low temperature.

Abstract: An aspect of the present disclosure relates to a high-strength steel material having enhanced resistance to crack initiation and propagation at low temperature.

Abstract: An aspect of the present invention relates to a high-strength steel, having excellent fracture initiation resistance and fracture propagation arrestability at low temperature.

Abstract: A structure of a brake-cooling duct, which is disposed at one side of an intercooler tank to cool a brake disc using air may include the brake-cooling duct has an air movement channel and a through-hole formed in a side surface thereof to expose the channel to an outside, wherein the brake-cooling duct is disposed close to one side of the intercooler tank so that an external surface of the intercooler tank is exposed to the channel via the through-hole, allowing the air introduced into the channel to be brought into contact with the external surface of the intercooler tank, and thereafter be discharged rearward thereof.

Abstract: A structure of a brake-cooling duct, which is disposed at one side of an intercooler tank to cool a brake disc using air may include the brake-cooling duct has an air movement channel and a through-hole formed in a side surface thereof to expose the channel to an outside, wherein the brake-cooling duct is disposed close to one side of the intercooler tank so that an external surface of the intercooler tank is exposed to the channel via the through-hole, allowing the air introduced into the channel to be brought into contact with the external surface of the intercooler tank, and thereafter be discharged rearward thereof.

Abstract: The present invention relates to a method of manufacturing an LED module, which enhances heat dissipation efficiency of the LED module through a configuration of installing a plurality of electrically separated conductive electrode plates to be close to each other on a same plane, stacking insulation layers on the top and bottom sides of the electrode plates, forming a plurality of ground holes on one side of the insulation layers to expose the electrode plates, and then grounding both electrodes of LED chips to the separated electrode plates.

Abstract: The present invention relates to a method of manufacturing an LED module, which enhances heat dissipation efficiency of the LED module through a configuration of installing a plurality of electrically separated conductive electrode plates to be close to each other on a same plane, stacking insulation layers on the top and bottom sides of the electrode plates, forming a plurality of ground holes on one side of the insulation layers to expose the electrode plates, and then grounding both electrodes of LED chips to the separated electrode plates.

Abstract: Provided is a session management method of managing a session created between a wireless universal serial bus (USB) host and a wireless USB device through a wireless network, the session management method including: receiving session status messages periodically transmitted for checking a status of the created session; counting a number of continuous reception failures representing a number of the session status messages that are not received; and if the number of the continuous reception failures of session status messages is greater than a reference number, changing the current status of the session to a suspended status if the current status of the session is a connected status, and closing the created session if the current status of the session is a suspended status.

Abstract: A network switch and a method of preventing an IP address collision is provided. When a new node tries to use an IP address, which is being used in one broadcast domain, it is possible to detect and prevent an IP address collision in real-time, disconnect only the new node which caused the IP address collision, and quickly resolve network environment to the original state that existed prior to the collision, in order to prevent communication breakdown without the use of an additional device.

Abstract: A timing controller provides a cable plug status detection function by receiving a reference lock signal from a graphics system connected via a constituent cable and comparing the reference lock signal to one or more reference time periods to determine the cable plug status.

Abstract: A method of interfacing between a universal serial bus (USB) host and a USB device. The USB host and the USB device include modules to process packets according to network protocols, instead of USB bus interfaces. Therefore, the USB device can be connected to the USB host even without a USB cable, and thus is not affected by the distance between the USB host and USB device.

Abstract: A timing controller provides a cable plug status detection function by receiving a reference lock signal from a graphics system connected via a constituent cable and comparing the reference lock signal to one or more reference time periods to determine the cable plug status.

Abstract: A phone book group management method includes: providing a display field for entering a contact name and a group name of a phone book; receiving a contact name and at least one group name consecutively in the display field; analyzing the received contact name and at least one group name; and registering contact information in a group according to the analyzed contact name and at least one group name. A new group may be created while registering a contact name in a phone book or while editing phone book data of a registered contact. Accordingly, the procedure for registering a contact may be simplified, and management of user groups may be executed more easily and efficiently.