Patents by Inventor Woo Mei Sue

Woo Mei Sue has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4579745
    Abstract: A process and apparatus for forming a cup-shaped skin for a skin-enveloped food, in which a dough strip of predetermined width and thickness and a suitable extensibility is extruded through a hole of a plate by an inverted frusto-conical or pyramidal die. The extruded dough envelope is received on a vertically displaceable lifting plate of a shaping cup, where stuffing and sealing of the dough envelope may then be performed. The extruding die and the hole of the plate are so dimensioned that the resulting dough envelope will have a thickness gradient which tapers from a thicker central base portion to a thinner peripheral upper portion.
    Type: Grant
    Filed: November 9, 1984
    Date of Patent: April 1, 1986
    Inventor: Woo Mei Sue