Abstract: A reflection sheet and a method of manufacturing a reflection sheet are disclosed. The reflection sheet comprises a substrate layer and a reflective layer formed on the substrate layer, wherein the reflective layer comprises an alloy consisting of silver (Ag), palladium (Pd) and neodymium (Nd).

Abstract: Provided is a touch panel comprising: a transparent substrate, a transparent conductive material disposed on the 5 substrate, and a Ag—Pd—Nd alloy layer disposed on the transparent conductive material. Provided are also a preparation method of the touch panel and a display comprising the touch panel. Provided are also a Ag—Pd—Nd alloy for touch panel, comprising: 97.9 to 99.2 weight % of Ag, 0.7 to 1.8 weight % of Pd, and 0.1 to 0.3 weight % of Nd, based on 100 weight % of the alloy.

Abstract: Disclosed is a solder particle including a plastic core; a copper-free metal layer which is formed on an external surface of the plastic core; and a solder layer which is formed on the copper-free metal layer and contains not less than 85 wt % tin. Thus, it is possible to provide a solder particle with a copper-free metal layer, which is excellent in strength and conductivity and prevents or minimizes generation of a void during a reflow process or the like.

Abstract: Disclosed is a solder particle including a plastic core; a copper-free metal layer which is formed on an external surface of the plastic core; and a solder layer which is formed on the copper-free metal layer and contains not less than 85 wt % tin. Thus, it is possible to provide a solder particle with a copper-free metal layer, which is excellent in strength and conductivity and prevents or minimizes generation of a void during a reflow process or the like.

Abstract: A reflection sheet and a method of manufacturing a reflection sheet are disclosed. The reflection sheet comprises a substrate layer and a reflective layer formed on the substrate layer, wherein the reflective layer comprises an alloy consisting of silver (Ag), palladium (Pd) and neodymium (Nd).

Abstract: A modular welding machine effectively recovers heat generated from each individual welding machine by applying a lightened and simplified water-cooled cooling structure. A plurality of the modularized welding machines is provided to perform multiple welding processes in multi-positions. Each component parts of the modularized welding machine is modularized into groups to be configured on a single panel and installed within a single case. The modular welding machine can perform multiple welding processes in multi-positions and includes a plurality of individual welding machine modules. A water-cooled cooling plate is installed in each module. The cooling plate has a flow path in which the cooling water circulates for cooling the heat-radiating parts.

Abstract: An inverter type water-cooled single welding machine module. The welding machine module contains a plurality of inverter welding machines embedded inside one case. As a part of measures to reduce size and lighten the weight of each individual welding machine, the conventional air-cooled method of using fans is replaced with a water-cooled method. The individual welding machines can be manufactured to be smaller and lighter by drastically reducing the size of the individual welding machines (in the order of ? to ?) due to effects of decreasing the number of heat dissipation components to be used and reducing the capacity and size thereof through efficiency enhancement of the heat dissipation components.

Abstract: Provided is a touch panel comprising: a transparent substrate, a transparent conductive material disposed on the 5 substrate, and a Ag—Pd—Nd alloy layer disposed on the transparent conductive material. Provided are also a preparation method of the touch panel and a display comprising the touch panel. Provided are also a Ag—Pd—Nd alloy for touch panel, comprising: 97.9 to 99.2 weight % of Ag, 0.7 to 1.8 weight % of Pd, and 0.1 to 0.3 weight % of Nd, based on 100 weight % of the alloy.

Abstract: The present invention discloses an anisotropic conductive adhesive comprising an insulating adhesive component and a number of conductive particles dispersed in the insulating adhesive component, wherein the insulating adhesive component contains a crosslinked rubber resin. The anisotropic conductive adhesive of the present invention prevents exfoliation of an adhesive or reduction in adhesive strength of circuit by minimizing its the heat-contraction occurring in the process of a polymerization or a hardening reaction when connecting micro-circuits, whereby a short circuit between adjacent electrodes can be prevented when connecting the circuits, and excellent connection reliability according to a long-term use is achieved.

Abstract: The present invention relates to an anisotropic conductive adhesive comprising an anisotropic conductive adhesive combined with a crystalline polymer to realize anisotropic conductivity and PTC (Positive Temperature Coefficient) characteristics at the same time. The anisotropic conductive adhesive having PTC characteristics according to the present invention comprises an insulating adhesive component and a plurality of conductive particles dispersed in adhesive component, in which the insulating adhesive component comprises a crystalline polymer. Since the anisotropic conductive adhesive according to the present invention includes a crystalline polymer, when temperature rises and the volume expands, electrical resistance is rapidly increased, whereby current flow is intercepted resulting in blocking current, providing PTC characteristics acting as a switch. Thus, it shows circuit protection function as well.