Abstract: A spatter protection cover for an electronics module includes a top wall that covers a top surface of a plastic module housing. The cover can include side walls and end walls that cover the side surfaces and end surfaces of the plastic housing. The cover can be a one-piece metallic construction that fits over the plastic module housing or can be defined by separate cover sections that can be adhesively applied to the plastic module housing. The top wall of the cover can include connector openings and/or indicator openings for aligning with connectors and indicator lights, respectively, of the plastic module housing. The cover can include ribs that establish and maintain a select thermally insulative air gap between the top wall of the cover and the top surface of the plastic module housing.

Abstract: A switching regulator is provided. The switching regulator comprises a switching controller configured to activate a switching conversion operation based on an enable signal, a gate driver configured to generate first and second gate signals under control of the switching controller and a switching circuit configured to convert an input voltage applied to an input voltage node to a output voltage. The switching circuit includes a P-type transistor connected between the input voltage node and a switching node and gated based on the first gate signal, an N-type transistor connected between the switching node and a power ground terminal and gated based on the second gate signal and an inductor connected between the switching node and an output node and configured to output the output voltage.

Abstract: The disclosed wafer processing apparatus includes a vacuum chuck unit configured to adsorb and support a wafer assembly including a wafer; a rotary chuck unit configured to rotate the vacuum chuck unit; a rotating shaft connected to the rotary chuck unit to rotate the rotary chuck unit; a ring cover unit configured to press the wafer assembly such that a processing solution sprayed onto the wafer is not diffused into the vacuum chuck unit; a sealing ring installed in the vacuum chuck unit and configured to support the wafer assembly; and a medium supply unit configured to supply an inspection medium to the vacuum chuck unit such that the inspection medium for identifying damage to the sealing ring flows into the sealing ring.

Abstract: A wafer processing apparatus includes a rotating chuck rotatably installed on a driver, a vacuum chuck which is disposed on the rotating chuck and on which a wafer is seated, a chuck module installed in the rotating chuck to fix the wafer to the vacuum chuck, and a moving module configured to move the vacuum chuck or the chuck module to increase a gap between adjacent dies of the wafer.

Abstract: A wafer processing apparatus includes a rotating chuck rotatably installed on a driver, a vacuum chuck which is disposed on the rotating chuck and on which a wafer is seated, a chuck module installed in the rotating chuck to fix the wafer to the vacuum chuck, and a moving module configured to move the vacuum chuck or the chuck module to increase a gap between adjacent dies of the wafer.

Abstract: A power management integrated circuit including: a clock generator that generates an input clock; a first phase delay controller that delays the input clock by a first phase and outputs a first supply clock to a first switching converter; a second phase delay controller that delays the input clock by a second phase and outputs a second supply clock to a second switching converter; and a third phase delay controller that delays the input clock by a third phase and outputs a third supply clock to a third switching converter, wherein the first phase, the second phase and the third phase have different phases from each other.

Abstract: A wafer cleaning apparatus according to the present disclosure includes a rotary table that supports and rotates a wafer so that the wafer rotates about a rotational axis, and an ultrasonic vibration device that vibrates a liquid film so that vibration having an ultrasonic frequency is generated in the liquid film formed on an upper surface of the wafer.

Abstract: A wafer processing apparatus includes a rotating chuck which is rotatably installed inside a cup housing and on which a substrate is mounted, a nozzle table rotatably installed inside the rotating chuck, a guide installed inside the nozzle table, a moving module movably installed on the guide, a guide arm configured to support a fluid supply line part, a lower nozzle part coupled to the guide arm to move together with the moving module and connected to the fluid supply line part, a driving shaft part connected to the rotating chuck and the nozzle table to rotate the rotating chuck and the nozzle table, a moving shaft rotatably installed inside the driving shaft part and connected to the moving module to move the moving module, and a driver connected to the driving shaft part and the moving shaft.

Abstract: A power management integrated circuit including: a first regulator configured to provide a first output signal to a component; a second regulator configured to provide a second output signal to the component; a third regulator configured to provide a third output signal to the component; a power tracker configured to track first, second and third output signals, aggregate an offset voltage with a selection signal, and generate a reference voltage, wherein the selection signal corresponds to one of the first, second and third output signals; and a sub-regulator configured to generate an input voltage corresponding to the reference voltage and provide the generated input voltage to the first, second and third regulators.

Abstract: A wafer processing apparatus of the present invention includes a suction nozzle configured to suction sludge from a cup housing, a flow line connected to the suction nozzle such that the sludge and a chemical solution flow therein, a suction tank connected to the flow line such that the sludge and the chemical solution flow thereto, and an ejector installed on a flow line to generate suction pressure in the suction nozzle and the flow line.

Abstract: The disclosed wafer processing apparatus includes a vacuum chuck unit configured to adsorb and support a wafer assembly including a wafer; a rotary chuck unit configured to rotate the vacuum chuck unit; a rotating shaft connected to the rotary chuck unit to rotate the rotary chuck unit; a ring cover unit configured to press the wafer assembly such that a processing solution sprayed onto the wafer is not diffused into the vacuum chuck unit; a sealing ring installed in the vacuum chuck unit and configured to support the wafer assembly; and a medium supply unit configured to supply an inspection medium to the vacuum chuck unit such that the inspection medium for identifying damage to the sealing ring flows into the sealing ring.

Abstract: A wafer processing apparatus includes a vacuum chuck on which a wafer is seated, a ring cover installed on a circumferential portion of the vacuum chuck, a medium supply part connected to the vacuum chuck to supply an inspection medium to the vacuum chuck, and a sealing ring which is installed in the vacuum chuck to support the wafer and into which the inspection medium supplied to the vacuum chuck is introduced.

Abstract: A wafer processing apparatus includes a rotating chuck rotatably installed on a driver, a vacuum chuck which is disposed on the rotating chuck and on which a wafer is seated, a chuck module installed in the rotating chuck to fix the wafer to the vacuum chuck, and a moving module configured to move the vacuum chuck or the chuck module to increase a gap between adjacent dies of the wafer.

Abstract: A wafer processing apparatus includes a rotating chuck rotatably installed on a driver, a vacuum chuck which is disposed on the rotating chuck and on which a wafer is seated, a ring cover disposed along a circumferential portion of the vacuum chuck to press the wafer to seal the circumferential portion of the vacuum chuck, and a chuck module installed in the rotating chuck to fix the ring cover to the rotating chuck.

Abstract: A wafer processing apparatus includes a vacuum chuck on which a wafer is seated, a ring cover disposed along a circumferential portion of the vacuum chuck to press the wafer to seal the circumferential portion of the vacuum chuck, and a sealing ring pressed against an adhesive sheet on the wafer and pressed by the ring cover.

Abstract: A wafer processing apparatus includes a rotating chuck which is rotatably installed inside a cup housing and on which a substrate is mounted, a nozzle table rotatably installed inside the rotating chuck, a guide installed inside the nozzle table, a moving module movably installed on the guide, a guide arm configured to support a fluid supply line part, a lower nozzle part coupled to the guide arm to move together with the moving module and connected to the fluid supply line part, a driving shaft part connected to the rotating chuck and the nozzle table to rotate the rotating chuck and the nozzle table, a moving shaft rotatably installed inside the driving shaft part and connected to the moving module to move the moving module, and a driver connected to the driving shaft part and the moving shaft.

Abstract: A control circuit in a switching regulator, the switching regulator including an inductor and a switching circuit configured to control a current passing through the inductor in response to a control signal, the control circuit configured to receive a feedback voltage of an output voltage of the switching regulator and receive the current passing through the inductor as a current sensing signal. The control circuit includes a first internal signal generator configured to generate a first internal signal based on the feedback voltage and a reference voltage, a second internal signal generator configured to generate a second internal signal based on the current sensing signal such that a base level of the second internal signal varies according to the feedback voltage and the reference voltage, and a comparator configured to output the control signal based on the first and second internal signals.

Abstract: A control circuit in a switching regulator, the switching regulator including an inductor and a switching circuit configured to control a current passing through the inductor in response to a control signal, the control circuit configured to receive a feedback voltage of an output voltage of the switching regulator and receive the current passing through the inductor as a current sensing signal. The control circuit includes a first internal signal generator configured to generate a first internal signal based on the feedback voltage and a reference voltage, a second internal signal generator configured to generate a second internal signal based on the current sensing signal such that a base level of the second internal signal varies according to the feedback voltage and the reference voltage, and a comparator configured to output the control signal based on the first and second internal signals.