Abstract: A memory card includes a substrate and a resin-molded layer. The substrate includes contact pads that are on a second face thereof for communication with a card reader. Semiconductor chips are on a first face of the substrate and electrically connected to the contact pads through bonding wires and circuit wiring. The resin-molded layer is on the first face and covers the chips.

Abstract: A memory card includes a substrate and a resin-molded layer. The substrate includes contact pads that are on a second face thereof for communication with a card reader. Semiconductor chips are on a first face of the substrate and electrically connected to the contact pads through bonding wires and circuit wiring. The resin-molded layer is on the first face and covers the chips.

Abstract: A memory card includes a substrate and a resin-molded layer. The substrate includes contact pads that are on a second face thereof for communication with a card reader. Semiconductor chips are on a first face of the substrate and electrically connected to the contact pads through bonding wires and circuit wiring. The resin-molded layer is on the first face and covers the chips. The fabrication process for the memory cards begins with fabrication of a multi-substrate that includes several unit substrates. At least one semiconductor chip is provided on each unit substrate and electrically connected. A continuous resin-molded layer is then formed to extend over the unit substrates. Separating the unit substrates of the multi-substrate divides the continuous resin-molded layer into individual resin-molded units and provides the memory cards.