Abstract: A development system for manufacturing semiconductor devices uses a container to easily remove by-products of development from a wafer by: soaking the wafer in the developer with the pattern face downward; spraying rinse onto the pattern face from below; rotating the wafer at high speed to remove the rinse and by-products; and then cleaning and ventilating the container so that the developer, rinse, cleaning solution and development by-products are removed from the container. No by-products are left in the comers of the pattern of the pattern face, because the development and rinse are performed with the pattern facing downward. No by-products, developer, rinse or cleaning solution contaminate the wafer, because steps of the process are performed in an enclosed container which is cleaned and ventilated between development of each wafer.

Abstract: A developing device for a semiconductor device fabrication accomplishes complete removal of by-products formed during development of a photoresist, by inverting the wafer over a container of developer and dipping the pattern-forming face into the developer. While the wafer is still inverted over the container, the pattern-forming face is sprayed with a rinse and the wafer is spun to remove the rinse and by-products. The device includes the container provided on a table and supplied with developer, a spin chuck using vacuum suctioning the face of the wafer opposite to the pattern-forming face, a driving motor for rotating the spin chuck, a vertical driver for moving the wafer into and out of the container, and an inverting driver for rotating the spin chuck and the vertical driver so as to selectively turn the pattern-forming face of the wafer to look upward or downward.

Abstract: An apparatus for thermal processing of semiconductor wafers includes a table having in lateral sequence a heating chamber, a holding chamber, and a cassette stage and a boat for holding the wafers being processed. The apparatus further includes a boat transfer part for moving the boat between the holding chamber and the heating chamber, a wafer charging part for transferring the wafers loaded in a cassette on the cassette stage to the boat while it is in the holding chamber, and a wafer discharging part for transferring the wafers loaded in the boat back to the cassette on the cassette stage.

Abstract: A UV irradiation apparatus, which includes a UV lamp installed in a chamber for generating UV rays; a vacuum chuck installed below the UV lamp for supporting and moving a wafer; and, a reflector surrounding the UV lamp for concentrating UV rays on the vacuum chuck. The apparatus further includes heating blocks for controlling the temperature at both sides of the vacuum chuck. Thus, it is possible to maintain an essentially constant temperature around the wafer supported by the vacuum chuck. As a result of the temperature control, when a protection tape attached to the front side of the wafer is irradiated with UV rays, an adhesive of the protective tape can be effectively degraded by a chemically reaction under optimum conditions, to thereby easily detach the protection tape from the wafer.

Abstract: A masking film adhering method for transporting smoothly and accurately a masking film tape to which a wafer is stuck to the cutting location where the masking film is to be cut. The wafer is stuck onto the masking film tape by passing the masking film tape and the wafer through upper and lower adhesive rollers. The separation of the masking film tape is then increased from a cutting table so that the masking film tape having the wafer stuck thereon may not become adhered to the cutting table, by moving the upper adhesive roller upwardly when the wafer completely passes through the adhesive roller. After the masking film is transported to a cutting location, maintaining a predetermined distance between the masking film and the cutting table, the masking film tape is cut along the shape of the wafer. Sagging of the masking film due to the weight of the wafer is prevented to avoid the masking film tape adhesion to the cutting table.

Abstract: A masking film adhering method and apparatus for transporting smoothly and accurately a masking film tape to which a wafer is stuck to the cutting location where the masking film is to be cut. The wafer is stuck onto the masking film tape by passing the masking film tape and the wafer through upper and lower adhesive rollers. The separation of the masking film tape is then increased from a cutting table so that the masking film tape having the wafer stuck thereon may not become adhered to the cutting table, by moving the upper adhesive roller upwardly when the wafer completely passes through the adhesive roller. After the masking film is transported to a cutting location, maintaining a predetermined distance between the masking film and the cutting table, the masking film tape is cut along the shape of the wafer. Sagging of the masking film due to the weight of the wafer is prevented to avoid the masking film tape adhesion to the cutting table.