Patents by Inventor Wu Chen
Wu Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11934610Abstract: A touch control method is provided. The touch control method is applied in a touch device including a plurality of touch electrodes, the touch control method includes: step S1, sending a scanning signal to the plurality of touch electrodes, the scanning signal being a multi-frequency scanning signal; step S2, acquiring touch data according to the multi-frequency scanning signal; and step S3, calculating a current touch position according to the touch data.Type: GrantFiled: February 26, 2020Date of Patent: March 19, 2024Assignee: FocalTech Electronics (Shenzhen) Co., Ltd.Inventors: Wei-Jing Hou, Jian-Wu Chen, Hui-Dan Xiao, Da-Chun Wu, Zhen-Huan Mou, You-Gang Gong, Guan-Qun Pan
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Patent number: 11936183Abstract: An energy Internet system, an energy routing conversion device, and an energy control method, relating to a field of energy information. An alternating-current (AC) side energy routing conversion device of the energy Internet system includes a plurality of first route ports, and a direct-current (DC) side energy routing conversion device includes a plurality of second route ports, where each second route port is connected to a corresponding first route port by means of a corresponding DC busbar. A plurality of energy devices are connected to a DC busbar by means of corresponding first AC/DC converters or first DC converters. The AC side energy routing conversion device and the DC side energy routing conversion device collect energy information of the energy devices and adjust energy of the energy devices on a basis of energy balance constraint conditions.Type: GrantFiled: December 13, 2018Date of Patent: March 19, 2024Assignee: GREE ELECTRIC APPLIANCES, INC. OF ZHUHAIInventors: Mingzhu Dong, Zhigang Zhao, Meng Huang, Xuefen Zhang, Shugong Nan, Shiyong Jiang, Meng Li, Wenqiang Tang, Peng Ren, Wu Wen, Lingjun Wang, Xiao Luo, Wenhao Wu, Jianjun Huang, Weijin Li, Yunhong Zeng, Bei Chen
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Patent number: 11935954Abstract: A semiconductor device structure includes a fin structure formed over a substrate. The structure also includes nanostructures formed over the fin structure. The structure also includes a gate structure wrapped around the nanostructures. The structure also includes a first inner spacer formed beside the gate structure. The structure also includes a second inner spacer formed beside the first inner spacer. The structure also includes spacer layers formed over opposite sides of the gate structure above the nanostructures. The structure also includes source/drain epitaxial structures formed over opposite sides of the fin structure. The second inner spacer is partially embedded in the source/drain epitaxial structures.Type: GrantFiled: July 30, 2021Date of Patent: March 19, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Bwo-Ning Chen, Xusheng Wu, Chang-Miao Liu, Chien-Tai Chan
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Publication number: 20240088463Abstract: A system, method, and computer program product for determining the cause of a battery condition, such as a thermal runaway event, are provided. An example battery safety evaluation system may include a battery having a housing and an interior battery compartment. The battery safety evaluation system may include internal sensing elements attached to the interior battery compartment and configured to capture data representative of an internal battery condition event. The battery safety evaluation system may further include an external sensing element attached to the battery housing and configured to capture data representative of an external battery condition event. In addition, the battery safety evaluation system may include a controller for determining a cause of the battery condition based at least in part on a time sequence of events generated from the internal data captured by the internal sensing element and the external data captured by the external sensing element.Type: ApplicationFiled: August 21, 2023Publication date: March 14, 2024Inventors: Fan YANG, Wu CHEN, Yu HU, Jie WANG
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Publication number: 20240089666Abstract: A double-sided loudspeaker includes a first speaker base and a second speaker base assembled with each other and provided with a ventilation hole; a first side magnetic plate injection molded at the first speaker base or the second speaker base; a second side magnetic plate injection molded at the first speaker base or the second speaker base; a magnetic member disposed between the first side magnetic plate and the second side magnetic plate and including a main magnetic plate, a first magnetic unit and a second magnetic unit; a first diaphragm disposed at the first speaker base; a first voice coil disposed at the first diaphragm and movably arranged at the first magnetic unit; a second diaphragm disposed at the second speaker base; and a second voice coil disposed at the second diaphragm and movably arranged at the second magnetic unit.Type: ApplicationFiled: December 13, 2022Publication date: March 14, 2024Inventors: PING-YU LEE, DE-WU WANG, ZHI-LONG NIU, YU-HSI CHEN
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Patent number: 11929624Abstract: The invention discloses a power network flexible controller topology shared by modules. Each single-phase topology comprises an AC/AC converter including N1 CHB modules, and an AC/DC module including N?N1 full-bridge rectifiers; the AC input terminals of N1 CHB modules are connected in series to form an AC port on one side of the AC/AC converter, the AC output terminals of N1 CHB modules are connected in series to form the AC port on the other side of the AC/AC converter, the AC input terminals of N?N1 full-bridge rectifiers are connected in series to form the AC port of the AC/DC module, the AC port on one side of the AC/AC converter is connected in series with the AC side port of the AC/DC module and then connected to a first AC network nd the AC port on the other side of the AC/AC converter is connected in series with the DC side port of the AC/DC module.Type: GrantFiled: June 23, 2021Date of Patent: March 12, 2024Assignee: SOUTHEAST UNIVERSITYInventors: Wu Chen, Guohao He
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Patent number: 11926618Abstract: A compound of formula (I) or an optical isomer thereof, and pharmaceutically acceptable salts, prodrugs, aquo-complexes or non-aqueous-solvent complexes thereof are provided. Experiments prove that, compared with a control compound MGL-3196, the compound of formula (I), which is obtained through specific substitution sites and specific substitution types, is higher in agonist activity to THR-beta and significantly improved in selectivity on THR-beta/THR-alpha. The compound can be used in preparing THR-beta agonist and drugs for treating adaption diseases (including dyslipidemia, hypercholesteremia, non-alcoholic steatohepatitis and non-alcoholic fatty liver disease) applicable to the THR-beta agonist.Type: GrantFiled: August 20, 2020Date of Patent: March 12, 2024Assignee: HINOVA PHARMACEUTICALS INC.Inventors: Wu Du, Yu Li, Haibo Li, Yuanwei Chen, Chengzhi Zhang, Xinghai Li
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Patent number: 11923359Abstract: A method for forming a FinFET device structure is provided. The method includes forming a first fin structure and a second fin structure over a substrate and forming a liner layer over the first fin structure and the second fin structure. The method also includes forming an isolation layer over the liner layer and removing a portion of the liner layer and a portion of the isolation layer, such that the liner layer includes a first liner layer on an outer sidewall surface of the first fin structure and a second liner layer on an inner sidewall surface of the first fin structure, and a top surface of the second liner layer is higher than a top surface of the first liner layer.Type: GrantFiled: July 12, 2021Date of Patent: March 5, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chung-Shu Wu, Shu-Uei Jang, Wei-Yeh Tang, Ryan Chia-Jen Chen, An-Chyi Wei
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Publication number: 20240065367Abstract: A sports shoe is provided. The sports shoe includes a shoe vamp and a shoe sole connected to the shoe vamp. The shoe vamp includes a textile component, wherein the textile component includes thermoplastic polyester fibers. The shoe sole includes a shoe outsole and a shoe midsole foam disposed between the shoe outsole and the shoe vamp, wherein the shoe outsole includes a vulcanizate and the shoe midsole foam includes a first thermoplastic elastomer. The vulcanizate includes rubber particles, a second thermoplastic elastomer, and an interface-compatible resin, wherein the content of the rubber particles is greater than the content of the second thermoplastic elastomer. The rubber particles are dispersed in the second thermoplastic elastomer in the form of spherical particles with particle sizes of about 0.5-10 um.Type: ApplicationFiled: August 23, 2023Publication date: February 29, 2024Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Jin-An WU, Che-Tseng LIN, Chien-Ming CHEN
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Publication number: 20240072155Abstract: A method includes forming a transistor, which includes forming a dummy gate stack over a semiconductor region, and forming an Inter-Layer Dielectric (ILD). The dummy gate stack is in the ILD, and the ILD covers a source/drain region in the semiconductor region. The method further includes removing the dummy gate stack to form a trench in the first ILD, forming a low-k gate spacer in the trench, forming a replacement gate dielectric extending into the trench, forming a metal layer to fill the trench, and performing a planarization to remove excess portions of the replacement gate dielectric and the metal layer to form a gate dielectric and a metal gate, respectively. A source region and a drain region are then formed on opposite sides of the metal gate.Type: ApplicationFiled: November 8, 2023Publication date: February 29, 2024Inventors: Kuo-Hua Pan, Je-Wei Hsu, Hua Feng Chen, Jyun-Ming Lin, Chen-Huang Peng, Min-Yann Hsieh, Java Wu
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Publication number: 20240065765Abstract: A method of orthopedic treatment includes steps of: by using a computer aided design (CAD) tool based on profile data that is related to a to-be-treated part of a bone of a patient, obtaining a model of a preliminary instrument that substantially fits the to-be-treated part; by using the CAD tool, obtaining a model of a patient specific instrument (PSI) based on the model of the preliminary instrument; producing the PSI based on the model of the PSI, the PSI being adjustable; performing medical operation on the to-be-treated part, and then attaching the PSI to the to-be-treated part; after attaching the PSI to the to-be-treated part, adjusting the PSI such that the PSI is adapted to real conditions of the to-be-treated part.Type: ApplicationFiled: August 22, 2023Publication date: February 29, 2024Inventors: Alvin Chao-Yu CHEN, Yi-Sheng CHAN, Chi-Pin HSU, Shang-Chih LIN, Chin-Ju WU, Jeng-Ywan JENG
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Patent number: 11915064Abstract: The disclosure relates to processing application programming interface (API) requests. Embodiments include receiving, at an API wrapper, from a first caller, a first call to an API and sending the first call to the API. Embodiments include receiving, by the API wrapper, from one or more second callers, a second one or more calls to the API prior to receiving a response from the API to the first call. Embodiments include receiving, by the API wrapper, the response from the API to the first call and responding to the first call from the first caller with the response from the API to the first call. Embodiments include responding, by the API wrapper, to the second one or more calls from the one or more second callers with the response from the API to the first call without sending the second one or more calls to the API.Type: GrantFiled: February 17, 2022Date of Patent: February 27, 2024Assignee: VMware, Inc.Inventors: Yu Wu, Jin Feng, Sifan Liu, Zhiliang Zhang, Kai-chia Chen
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Patent number: 11916105Abstract: Semiconductor device and the manufacturing method thereof are disclosed. An exemplary semiconductor device comprises a semiconductor stack including semiconductor layers over a substrate, wherein the semiconductor layers are separated from each other and are stacked up along a direction substantially perpendicular to a top surface of the substrate; an isolation structure around a bottom portion of the semiconductor stack and separating active regions; a metal gate structure over a channel region of the semiconductor stack and wrapping each of the semiconductor layers; a gate spacer over a source/drain (S/D) region of the semiconductor stack and along sidewalls of a top portion of the metal gate structure; and an inner spacer over the S/D region of the semiconductor stack and along sidewalls of lower portions of the metal gate structure and wrapping edge portions of each of the semiconductor layers.Type: GrantFiled: March 26, 2021Date of Patent: February 27, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Bwo-Ning Chen, Xusheng Wu, Pin-Ju Liang, Chang-Miao Liu, Shih-Hao Lin
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Patent number: 11906598Abstract: A testing system includes: a dividing circuit configured to receive a testing signal and provide a plurality of input signals according to the testing signal; and a plurality of power-amplifier chips coupled to the dividing circuit, each of the plurality of power-amplifier chips being configured to be tested by receiving a respective input signal of the plurality of input signals and generating a respective output signal for a predetermined testing time.Type: GrantFiled: August 8, 2022Date of Patent: February 20, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.Inventors: Hsieh-Hung Hsieh, Wu-Chen Lin, Yen-Jen Chen, Tzu-Jin Yeh
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Patent number: 11909214Abstract: The present disclosure relates to the field of electric power system, and more particularly to a topology of a series-connected MMC with a small number of modules, where the topology is composed of a three-phase bridge circuit, half-bridge valve strings, a three-phase filter inductor, and a three-phase grid frequency transformer. The topology of a series-connected MMC with a small number of modules in the present disclosure needs only two half-bridge valve strings, thus greatly reducing the number of the submodules as compared with the conventional MMC structure. When achieving the same high DC voltage output, the present disclosure can improve the power density of the MMC, realize stable three-phase AC output voltage, and further achieve balance of capacitor voltages in the two half-bridge valve strings.Type: GrantFiled: May 7, 2021Date of Patent: February 20, 2024Assignee: SOUTHEAST UNIVERSITYInventors: Wu Chen, Liangcai Shu, Haozhe Jin, Xiaokun He
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Patent number: 11878296Abstract: A process for separating a catalyst component from a catalyst-containing slurry by centrifugation including separating the catalyst component from the mother liquor of the catalyst-containing slurry using a stacked disc centrifuge equipped with an auto-discharging functionality. The solids discharge from the stacked disc centrifuge is enhanced by adding a washing solution to the bowl and the solids discharge chute of the stacked disc centrifuge.Type: GrantFiled: January 25, 2021Date of Patent: January 23, 2024Assignee: Dow Global Technologies LLCInventors: Mrunmayi Kumbhalkar, Wu Chen, Brian Murdoch, Haifeng Shi, Lin Zhao
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Patent number: 11868177Abstract: An electronic device includes a host, a main display, an auxiliary display, and a hinge mechanism. The auxiliary display is located between the host and the main display and includes a sliding part and a lifting part. The sliding part is slidably connected to the host. The hinge mechanism includes a first bracket, a second bracket pivotally connected to the first bracket, and a third bracket pivotally connected to the second bracket. The first bracket is secured to the host, and the second bracket is secured to the main display. The third bracket is secured to the lifting part of the auxiliary display.Type: GrantFiled: December 26, 2022Date of Patent: January 9, 2024Assignee: Acer IncorporatedInventors: Chia-Bo Chen, Cheng-Nan Ling, Wu-Chen Lee, Yi-Hsuan Yang
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Publication number: 20240008222Abstract: A coolant guiding structure can guide a coolant to a plurality of electronic components spaced from each other. The coolant guiding structure includes a housing, a plurality of first baffles, a plurality of second baffles, and a plurality of spoiler assemblies. The housing includes a liquid inlet and a liquid outlet. The liquid inlet can introduce the coolant into the housing, and the liquid outlet can discharge the coolant out of the housing. A first opening is formed between two adjacent first baffles, a second opening is formed between two adjacent second baffles, and a guide channel is formed between the first opening and the second opening. Each first baffle and a corresponding second baffle can accommodate one electronic component therebetween. At least two spoiler assemblies are disposed in the guide channel. The present disclosure further provides an electronic assembly.Type: ApplicationFiled: June 30, 2023Publication date: January 4, 2024Applicant: Fulian Precision Electronics (Tianjin) Co., LTD.Inventor: XIANG-WU CHEN
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Publication number: 20230413487Abstract: A heat sink includes a substrate, a heat pipe embedded in the substrate, a first fin group, and a plurality of heat conducting members. The substrate includes a first surface and a second surface facing away from the first surface. The first fin group is arranged on the first surface. A part of each of the plurality of heat conducting members is embedded in the substrate from the second surface and contacts the heat pipe, the other part of each of the plurality of heat conducting members is located outside of the substrate. An electronic device having the heat sink is also provided.Type: ApplicationFiled: August 5, 2022Publication date: December 21, 2023Inventor: XIANG-WU CHEN
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Patent number: 11846987Abstract: A portable electronic device including a first body, a second body, a stand, and a hinge structure is provided. The stand has a first pivot part and a second pivot part opposite to the first pivot part, wherein the first pivot part is pivotally connected to the first body, and the second body is pivotally connected to the second pivot part. The hinge structure includes a first bracket secured to the second body, a second bracket secured to the second pivot part of the stand, a first movable base, a first shaft secured to the first bracket and pivoted to the first movable base, a second movable base, a second shaft secured to the first movable base and pivoted to the second movable base, and a sliding shaft fixed to the second movable base and slidably connected to the second bracket.Type: GrantFiled: May 26, 2022Date of Patent: December 19, 2023Assignee: Acer IncorporatedInventors: Chia-Bo Chen, Yi-Hsuan Yang, Hung-Chi Chen, Wu-Chen Lee