Abstract: An electronic module preparation layer (A) and a manufacturing method therefor. The electronic module preparation layer (A) comprises a substrate (10), multiple electronic modules (20) and two release layers (30, 40). The multiple electronic modules (20) are coated in the substrate (10) by means of the two release layers (30, 40) so as to provide a protective effect. When a user needs to input a program code to various electronic modules (20), since one of the release layers, i.e.

Abstract: An electronic module preparation layer (A) and a manufacturing method therefor. The electronic module preparation layer (A) comprises a substrate (10), multiple electronic modules (20) and two release layers (30, 40). The multiple electronic modules (20) are coated in the substrate (10) by means of the two release layers (30, 40) so as to provide a protective effect. When a user needs to input a program code to various electronic modules (20), since one of the release layers, i.e.

Abstract: A capacitive fingerprint sensing module includes a flexible printed circuit board, a lower conductive adhesive layer, an upper conductive adhesive layer, and a positioning frame. The flexible printed circuit board has an upper surface and a lower surface. The upper surface has a finger pressing region and a first sensing layer. The lower surface has a second sensing layer. The lower conductive adhesive layer is formed on the second sensing layer and provided to cover second sensing electrodes mounted on the second sensing layer. The upper conductive adhesive layer is formed on the finger pressing region. The positioning frame has an opening facing upward and a slot. The flexible printed circuit board is inserted through the slot and embedded in the positioning frame. Accordingly, effects of conductivity enhancement and accuracy improvement of the capacitive fingerprint sensing module are produced.

Abstract: A capacitive fingerprint sensing module includes a flexible printed circuit board, a lower conductive adhesive layer, an upper conductive adhesive layer, and a positioning frame. The flexible printed circuit board has an upper surface and a lower surface. The upper surface has a finger pressing region and a first sensing layer. The lower surface has a second sensing layer. The lower conductive adhesive layer is formed on the second sensing layer and provided to cover second sensing electrodes mounted on the second sensing layer. The upper conductive adhesive layer is formed on the finger pressing region. The positioning frame has an opening facing upward and a slot. The flexible printed circuit board is inserted through the slot and embedded in the positioning frame. Accordingly, effects of conductivity enhancement and accuracy improvement of the capacitive fingerprint sensing module are produced.

Abstract: A switch assembly has a switch unit and a separating cap. The switch unit has a pressing element. The separating cap is attached to the switch unit and encloses the pressing element. Accordingly, glue filled into an object in which the switch assembly is mounted can be kept from attaching to the pressing element and the operation accuracy of the switch unit can be improved.

Abstract: An electrical speaker assembly has a speaker element and two caps. The speaker element has two sides. The caps are attached respectively to the two sides of the speaker element, and each cap has a resonance space between the cap and a corresponding one of the sides of the speaker element, wherein one of the caps has a wire notch defined in the cap.

Abstract: An electrical speaker assembly has a speaker element and two caps. The speaker element has two sides. The caps are attached respectively to the two sides of the speaker element, and each cap has a resonance space between the cap and a corresponding one of the sides of the speaker element, wherein one of the caps has a wire notch defined in the cap.

Abstract: A retina identifying module has a retina identifying chip and an encapsulation body. The encapsulation body is transparent, is mounted on and enclosing the retina identifying chip, and has a convex top face. Accordingly, the thickness of the retina identifying module can be effectively reduced.

Abstract: A smart card has a bottom layer, a circuit board, a microprocessor, a retina identifying module, an operation unit, and a top layer. The microprocessor is mounted on the circuit board. The operation unit is mounted on the circuit board and is electrically connected with the microprocessor. The retina identifying module is mounted on the circuit board, is electrically connected with the microprocessor, and has a retina identifying chip and an encapsulation. The retina identifying chip is mounted on the circuit board and is electrically connected with the microprocessor. The encapsulation body is transparent, is mounted on and encloses the retina identifying chip, and has a convex top face. The top layer is mounted on the circuit board to cover the microprocessor, the operation unit and the retina identifying module.

Abstract: The smart card has a supporting body, a flexible circuit board, a holding frame, a fingerprint identifying module, and a cover sheet. The flexible circuit board is attached to the top of the supporting body and has a data chip. The holding frame is mounted on the flexible circuit board and has a holding recess and an opening. The fingerprint identifying module is mounted in the holding frame and has an identifying chip, a flexible electrical connection sheet, and a hard supporting board to provide a supporting effect to the identifying chip. The cover sheet is attached to the top of the flexible circuit board and has an identifying window. The identifying window is defined through the cover sheet and corresponds to the identifying chip in position to allow the identifying chip to be exposed from the identifying window.