Abstract: The present invention provides novel tank circuits that are totally passive, and they are made of conductive-grade carbon nanotubes (CNTs) on substrates, and preferably flexible substrates. These components and structures contain no traditional electronic materials such as silicon, metal oxides, or ceramics, and they are totally organic. They may be used in applications where the resonant frequency and amplitude of the sensor can be modulated by a thermal, mechanical, or chemical signal, such as temperature, strain, pressure, vibration, or humidity. All-organic, and consequently combustible, passive RF sensors have unique applications for defense and consumer industries.

Abstract: The present invention provides novel tank circuits that are totally passive, and they are made of conductive-grade carbon nanotubes (CNTs) on substrates, and preferably flexible substrates. These components and structures contain no traditional electronic materials such as silicon, metal oxides, or ceramics, and they are totally organic. They may be used in applications where the resonant frequency and amplitude of the sensor can be modulated by a thermal, mechanical, or chemical signal, such as temperature, strain, pressure, vibration, or humidity. All-organic, and consequently combustible, passive RF sensors have unique applications for defense and consumer industries.

Abstract: The present invention is directed towards contact planarization methods that can be used to planarize substrate surfaces having a wide range of topographic feature densities for lithography applications. These processes use thermally curable, photo-curable, or thermoplastic materials to provide globally planarized surfaces over topographic substrate surfaces for lithography applications. Additional coating(s) with global planarity and uniform thickness can be obtained on the planarized surfaces. These inventive methods can be utilized with single-layer, bilayer, or multi-layer processing involving bottom anti-reflective coatings, photoresists, hardmasks, and other organic and inorganic polymers in an appropriate coating sequence as required by the particular application. More specifically, this invention produces globally planar surfaces for use in dual damascene and bilayer processes with greatly improved photolithography process latitude.

Abstract: An improved method for applying polymeric antireflective coatings to substrate surfaces and the resulting precursor structures are provided. Broadly, the methods comprise plasma enhanced chemical vapor depositing (PECVD) a polymer on the substrate surfaces. The most preferred starting monomers are 4-fluorostyrene, 2,3,4,5,6-pentafluorostyrene, and allylpentafluorobenzene. The PECVD processes comprise subjecting the monomers to sufficient electric current and pressure so as to cause the monomers to sublime to form a vapor which is then changed to the plasma state by application of an electric current. The vaporized monomers are subsequently polymerized onto a substrate surface in a deposition chamber. The inventive methods are useful for providing highly conformal antireflective coatings on large surface substrates having super submicron (0.25 ?m or smaller) features.

Abstract: Novel nonstick molds and methods of forming and using such molds are provided. The molds are formed of a nonstick material such as those selected from the group consisting of fluoropolymers, fluorinated siloxane polymers, silicones, and mixtures thereof. The nonstick mold is imprinted with a negative image of a master mold, where the master mold is designed to have a topography pattern corresponding to that desired on the surface of a microelectronic substrate. The nonstick mold is then used to transfer the pattern or image to a flowable film on the substrate surface. This film is subsequently cured or hardened, resulting in the desired pattern ready for further processing.

Abstract: The present invention is directed towards planarization materials that produce little or no volatile byproducts during the hardening process when used in contact planarization processes. The materials can be hardened by photo-irradiation or by heat during the planarization process, and they include one or more types of monomers, oligomers, or mixtures thereof, an optional cross-linker, and an optional organic reactive solvents. The solvent, if used, is chemically reacted with the monomers or oligomers and thus becomes part of the polymer matrix during the curing process. These materials can be used for damascene, dual damascene, bi-layer, and multi-layer applications, microelectromechanical system (MEMS), packaging, optical devices, photonics, optoelectronics, microelectronics, and sensor devices fabrication.

Abstract: The present invention is directed towards contact planarization methods that can be used to planarize substrate surfaces having a wide range of topographic feature densities for lithography applications. These processes use thermally curable, photo-curable, or thermoplastic materials to provide globally planarized surfaces over topographic substrate surfaces for lithography applications. Additional coating(s) with global planarity and uniform thickness can be obtained on the planarized surfaces. These inventive methods can be utilized with single-layer, bilayer, or multi-layer processing involving bottom anti-reflective coatings, photoresists, hardmasks, and other organic and inorganic polymers in an appropriate coating sequence as required by the particular application. More specifically, this invention produces globally planar surfaces for use in dual damascene and bilayer processes with greatly improved photolithography process latitude.

Abstract: An improved method for applying polymeric antireflective coatings to substrate surfaces and the resulting precursor structures are provided. Broadly, the methods comprise plasma enhanced chemical vapor depositing (PECVD) a polymer on the substrate surfaces. The most preferred starting monomers are 4-fluorostyrene, 2,3,4,5,6-pentafluorostyrene, and allylpentafluorobenzene. The PECVD processes comprise subjecting the monomers to sufficient electric current and pressure so as to cause the monomers to sublime to form a vapor which is then changed to the plasma state by application of an electric current. The vaporized monomers are subsequently polymerized onto a substrate surface in a deposition chamber. The inventive methods are useful for providing highly conformal antireflective coatings on large surface substrates having super submicron (0.25 &mgr;m or smaller) features.

Abstract: The present invention is directed towards planarization materials that produce little or no volatile byproducts during the hardening process when used in contact planarization processes. The materials can be hardened by photo-irradiation or by heat during the planarization process, and they include one or more types of monomers, oligomers, or mixtures thereof, an optional cross-linker, and an optional organic reactive solvents. The solvent, if used, is chemically reacted with the monomers or oligomers and thus becomes part of the polymer matrix during the curing process. These materials can be used for damascene, dual damascene, bi-layer, and multi-layer applications, microelectromechanical system (MEMS), packaging, optical devices, photonics, optoelectronics, microelectronics, and sensor devices fabrication.

Abstract: Novel nonstick molds and methods of forming and using such molds are provided. The molds are formed of a nonstick material such as those selected from the group consisting of fluoropolymers, fluorinated siloxane polymers, silicones, and mixtures thereof. The nonstick mold is imprinted with a negative image of a master mold, where the master mold is designed to have a topography pattern corresponding to that desired on the surface of a microelectronic substrate. The nonstick mold is then used to transfer the pattern or image to a flowable film on the substrate surface. This film is subsequently cured or hardened, resulting in the desired pattern ready for further processing.