Patents by Inventor Wu Wenli

Wu Wenli has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Bundle spacing device
    Patent number: 9663280
    Abstract: A bundle spacing device having a first pair of opposing surfaces spaced apart from each other a first distance and a second pair of opposing surfaces spaced apart from each other a second distance, different than the first distance, and generally perpendicular to the first pair of opposing surfaces. The bundle spacing device is configured such that bundles can be coupled to the bundle spacing device in a first position or a second position. The bundle spacing device can also have a first passage extending along a first axis, a second passage extending along a second axis that is perpendicular to the first axis, and a third passage extending along a third axis that is perpendicular to the first axis and parallel to the second axis.
    Type: Grant
    Filed: June 11, 2015
    Date of Patent: May 30, 2017
    Assignee: Panduit Corp.
    Inventors: Jonathan A. DeMik, Michael J. Vermeer, Wu Wenli
  • Bundle Spacing Device
    Publication number: 20150291326
    Abstract: A bundle spacing device having a first pair of opposing surfaces spaced apart from each other a first distance and a second pair of opposing surfaces spaced apart from each other a second distance, different than the first distance, and generally perpendicular to the first pair of opposing surfaces. The bundle spacing device is configured such that bundles can be coupled to the bundle spacing device in a first position or a second position. The bundle spacing device can also have a first passage extending along a first axis, a second passage extending along a second axis that is perpendicular to the first axis, and a third passage extending along a third axis that is perpendicular to the first axis and parallel to the second axis.
    Type: Application
    Filed: June 11, 2015
    Publication date: October 15, 2015
    Applicant: Panduit Corp.
    Inventors: Jonathan A. DeMik, Michael J. Vermeer, Wu Wenli
  • Bundle spacing device
    Patent number: 9067717
    Abstract: A bundle spacing device having a first pair of opposing surfaces spaced apart from each other a first distance and a second pair of opposing surfaces spaced apart from each other a second distance, different than the first distance, and generally perpendicular to the first pair of opposing surfaces. The bundle spacing device is configured such that bundles can be coupled to the bundle spacing device in a first position or a second position. The bundle spacing device can also have a first passage extending along a first axis, a second passage extending along a second axis that is perpendicular to the first axis, and a third passage extending along a third axis that is perpendicular to the first axis and parallel to the second axis.
    Type: Grant
    Filed: May 14, 2012
    Date of Patent: June 30, 2015
    Assignee: Panduit Corp.
    Inventors: Jonathan A. DeMik, Michael J. Vermeer, Wu Wenli
  • Bundle Spacing Device
    Publication number: 20130104347
    Abstract: A bundle spacing device having a first pair of opposing surfaces spaced apart from each other a first distance and a second pair of opposing surfaces spaced apart from each other a second distance, different than the first distance, and generally perpendicular to the first pair of opposing surfaces. The bundle spacing device is configured such that bundles can be coupled to the bundle spacing device in a first position or a second position. The bundle spacing device can also have a first passage extending along a first axis, a second passage extending along a second axis that is perpendicular to the first axis, and a third passage extending along a third axis that is perpendicular to the first axis and parallel to the second axis.
    Type: Application
    Filed: May 14, 2012
    Publication date: May 2, 2013
    Applicant: PANDUIT CORP.
    Inventors: Jonathan A. DeMik, Michael J. Vermeer, Wu Wenli