Abstract: In a method for treating a semiconductor substrate, a single substrate is positioned in a single-substrate process chamber and subjected to wet etching, cleaning and/or drying steps. The single substrate may be exposed to etch or clean chemistry in the single-substrate processing chamber as turbulence is induced in the etch or clean chemistry to thin the boundary layer of fluid attached to the substrate. Megasonic energy and/or disturbances in the chamber surfaces may provide the turbulence for boundary layer thinning. According to another aspect of a method according to the present invention, megasonic energy may be directed into a region within the single-substrate process chamber to create a zone of boundary layer thinning across the substrate surface, and a single substrate may be translated through the zone during a rinsing or cleaning process within the chamber to optimize cleaning/rinsing performance within the zone.

Abstract: A process vessel which may be utilized in wet processing of semiconductor wafers includes a tank having one or more fluid displacers attachable to the tank. The one or more fluid displacer(s) have position in which they extend into the interior of the tank. The fluid displacers may be carried by a lid moveable into a closed position covering the opening in the tank. Movement of the lid into the closed position causes the fluid displacers to extend into the tank.

Abstract: Described herein is a chemical injection system and method utilizing a chemical storage vessel coupled to a bulk source of chemical and proportioned to contain a volume of chemical useful for multiple applications for which the chemical is to be utilized. A dispense vessel proportioned to contain a volume of chemical useful for a single application is fluidly coupled to the chemical storage vessel. A controller controls operation of a system of valves and sensors, which operate to fill the chemical storage vessel, and to precisely dispense the volume required for a single application from the storage vessel into the dispense vessel and then ultimately into the vessel in which the chemical is needed.