Abstract: A semiconductor package includes a carrier having a recess, a semiconductor die arranged on the carrier such that a first side of the semiconductor die faces the carrier, and a contact clip arranged over a second side of the semiconductor die, opposite the first side. The contact clip includes a lowered part. The lowered part is arranged in the recess.

Abstract: A packaged semiconductor device includes a die paddle, a semiconductor die mounted on the die paddle, a plurality of fused leads extending away from a first side of the die paddle, a discrete lead that extends away from the first side of the die paddle and is physically detached from the plurality of fused leads, a first electrical connection between a first terminal of the semiconductor die and the discrete lead, an encapsulation material that encapsulates the semiconductor die, and a stabilizer bar connected to a first outer edge side of the discrete lead. The first outer edge side of the discrete lead is opposite from a second outer edge side of the discrete lead which faces the plurality of fused leads.

Abstract: A semiconductor device includes a lead frame including a die paddle and a lead, a semiconductor chip, and a clip. The semiconductor chip has a first side and a second side opposite to the first side. The first side is attached to the die paddle and the second side includes a first bond pad and a second bond pad. The clip electrically couples the first bond pad to the lead. The clip contacts the first bond pad at a first edge portion of the first bond pad adjacent to the second bond pad and defines a first cavity between a central portion of the first bond pad and the clip. Solder is within the first cavity to electrically couple the clip to the first bond pad. The semiconductor device includes a first opening to the first cavity to route flux away from the second bond pad during reflow soldering.

Abstract: A semiconductor device includes a lead frame including a die paddle and a lead, a semiconductor chip, and a clip. The semiconductor chip has a first side and a second side opposite to the first side. The first side is attached to the die paddle and the second side includes a first bond pad and a second bond pad. The clip electrically couples the first bond pad to the lead. The clip contacts the first bond pad at a first edge portion of the first bond pad adjacent to the second bond pad and defines a first cavity between a central portion of the first bond pad and the clip. Solder is within the first cavity to electrically couple the clip to the first bond pad. The semiconductor device includes a first opening to the first cavity to route flux away from the second bond pad during reflow soldering.

Abstract: A semiconductor device includes a lead frame including a die paddle and a lead, a semiconductor chip, and a clip. The semiconductor chip has a first side and a second side opposite to the first side. The first side is attached to the die paddle and the second side includes a first bond pad and a second bond pad. The clip electrically couples the first bond pad to the lead. The clip contacts the first bond pad at a first edge portion of the first bond pad adjacent to the second bond pad and defines a first cavity between a central portion of the first bond pad and the clip. Solder is within the first cavity to electrically couple the clip to the first bond pad. The semiconductor device includes a first opening to the first cavity to route flux away from the second bond pad during reflow soldering.

Abstract: A semiconductor device includes a lead frame including a die paddle and a lead, a semiconductor chip, and a clip. The semiconductor chip has a first side and a second side opposite to the first side. The first side is attached to the die paddle and the second side includes a first bond pad and a second bond pad. The clip electrically couples the first bond pad to the lead. The clip contacts the first bond pad at a first edge portion of the first bond pad adjacent to the second bond pad and defines a first cavity between a central portion of the first bond pad and the clip. Solder is within the first cavity to electrically couple the clip to the first bond pad. The semiconductor device includes a first opening to the first cavity to route flux away from the second bond pad during reflow soldering.

Abstract: Various embodiments provide a clip for clip bonding of a die to a carrier (bonding clip), wherein the clip comprises a clip body comprising a first region configured to be fixed on a carrier and a second region configured to be fixed to a die, wherein at least one of the first region and the second region comprises a guiding structure configured to guide the clip when connecting the carrier and the die.

Abstract: An electronic RF power device includes a transistor chip, a device input terminal and a device output terminal. Further, the electronic RF power device includes an output impedance transformation circuit, an output contact clip bonded to the transistor chip and to the output device terminal and at least one bond wire bonded to the output impedance transformation circuit and to the transistor chip.

Abstract: An electronic RF power device includes a transistor chip, a device input terminal and a device output terminal. Further, the electronic RF power device includes an output impedance transformation circuit, an output contact clip bonded to the transistor chip and to the output device terminal and at least one bond wire bonded to the output impedance transformation circuit and to the transistor chip.