Abstract: A security element, called a security dome, intended to be glued onto an electronic board. The security element includes at least: a metal part intended to be in contact with at least one electrical circuit of the electronic board; and a protective part covering the metal part and having a first face comprising an adhesive portion intended to ensure the gluing of the security element on the electronic board by an automatic assembly method having at least one reflow step. The metal part and protective part are resistant to temperatures used during the reflow step.

Abstract: There is proposed an optical power measurement circuit and an optical power meter which use a linear amplification circuit based on multiple transimpedance operational amplification lanes and which add a bootstrap circuit and a compensator circuit. 1) The bootstrap is used to reduce the effect of the photodiode capacitance and increases the amplifier's bandwidth. 2) The compensator circuit monitors the photodiode's voltage and reproduces its transient distortions, to then subtract it from the output and thereby reduce the measurement error.

Abstract: A security element, called a security dome, intended to be glued onto an electronic board. The security element includes at least: a metal part intended to be in contact with at least one electrical circuit of the electronic board; and a protective part covering the metal part and having a first face comprising an adhesive portion intended to ensure the gluing of the security element on the electronic board by an automatic assembly method having at least one reflow step. The metal part and protective part are resistant to temperatures used during the reflow step.

Abstract: An electronic circuit, which includes: a printed circuit, at least one first electronic component and at least one second electronic component. The at least one first electronic component includes an interconnection face provided with electrical interconnections brazed on an external face of the printed circuit. The interconnection face is opposite the external face. The brazed electrical interconnections form at least one space between the interconnection face and the external face. The at least one second electronic component is brazed on the external face and is at least partly housed in the at least one space.

Abstract: A support is provided for fabrication of an electronic device. The support includes at least one component to be protected and at least one three-dimensional element of a height at least equal to a height of the electronic component. The three-dimensional element is disposed laterally opposite the at least one component to be protected. The three-dimensional element is chiefly constituted of a permanent assembling material.

Abstract: A support is provided for fabrication of an electronic device. The support includes at least one component to be protected and at least one three-dimensional element of a height at least equal to a height of the electronic component. The three-dimensional element is disposed laterally opposite the at least one component to be protected. The three-dimensional element is chiefly constituted of a permanent assembling material.

Abstract: A memory card reader is provided, which includes a printed circuit on which a memory card connector is mounted. The memory card connector has a slot intended for inserting a memory card and a set of contact points enabling data exchange between the memory card and a processor mounted on the printed circuit. The printed circuit is further equipped with an anti-intrusion device formed and positioned such that the anti-intrusion device prevents access, from the exterior of the reader, to at least one connection portion between at least one of the contact points of the set of contact points and the printed circuit.

Abstract: A memory card reader is provided, which includes a printed circuit on which a memory card connector is mounted. The memory card connector has a slot intended for inserting a memory card and a set of contact points enabling data exchange between the memory card and a processor mounted on the printed circuit. The printed circuit is further equipped with an anti-intrusion device formed and positioned such that the anti-intrusion device prevents access, from the exterior of the reader, to at least one connection portion between at least one of the contact points of the set of contact points and the printed circuit.