Patents by Inventor Xiang Chao LI

Xiang Chao LI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240096121
    Abstract: Provided are a computer program product, system, and method for training and using a vector encoder to determine vectors for sub-images of text in an image to subject to optical character recognition. A vector encoder is trained to encode images representing text into vectors in a vector space. Vectors of images representing similar text have a high degree of cohesion in the vector space. Vectors of images representing dissimilar text have a low degree of cohesion in the vector space. An input image is processed to determine sub-images of the input image that bound text represented in the input image. The sub-images are inputted to the vector encoder to output sub-image vectors. The vector encoder generates a search vector for search text. Optical character recognition is applied to at least one region of the input image including the sub-images having sub-image vectors matching the search vector.
    Type: Application
    Filed: September 15, 2022
    Publication date: March 21, 2024
    Inventors: Zhong Fang YUAN, Tong LIU, Yi Chen ZHONG, Xiang Yu YANG, Guan Chao LI
  • Patent number: 8919631
    Abstract: Disclosed is an apparatus for mounting a transducer to a bond head of a wire bonder. In particular, the bond head of the wire bonder is operative to mechanically drive the transducer when forming electrical interconnections between separate locations within a semiconductor package. Specifically, the apparatus comprises: i) a flexural structure having a connector for connecting to the transducer, the flexural structure being configured to bend; and ii) at least one actuator attached to the flexural structure, the at least one actuator being operative to bend the flexural structure to thereby cause a displacement of the transducer connected thereto via the connector.
    Type: Grant
    Filed: March 15, 2012
    Date of Patent: December 30, 2014
    Assignee: ASM Technology Singapore Pte Ltd
    Inventors: Yam Mo Wong, Ka Shing Kwan, Hing Leung Li, Xiang Chao Li
  • Publication number: 20130240605
    Abstract: Disclosed is an apparatus for mounting a transducer to a bond head of a wire bonder. In particular, the bond head of the wire bonder is operative to mechanically drive the transducer when forming electrical interconnections between separate locations within a semiconductor package. Specifically, the apparatus comprises: i) a flexural structure having a connector for connecting to the transducer, the flexural structure being configured to bend; and ii) at least one actuator attached to the flexural structure, the at least one actuator being operative to bend the flexural structure to thereby cause a displacement of the transducer connected thereto via the connector.
    Type: Application
    Filed: March 15, 2012
    Publication date: September 19, 2013
    Inventors: Yam Mo WONG, Ka Shing KWAN, Hing Leung LI, Xiang Chao LI