Patents by Inventor Xiao-Min An
Xiao-Min An has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240164059Abstract: A vapor chamber structure includes an aluminum upper plate, an aluminum lower plate, a working fluid and multiple micron-sized recesses. The aluminum upper plate has a first side and a second side. The aluminum lower plate has a third side and a fourth side. The aluminum upper and lower plates are correspondingly mated with each other to define an airtight chamber. The working fluid is filled in the airtight chamber. The micron-sized recesses are directly formed on the third side. The micron-sized recesses are upward raised and/or downward recessed from the third side in the form of multiple small puddles so as to enhance the boiling efficiency of the working fluid in the airtight chamber and promote liquid-vapor circulation performance of the vapor chamber. In addition, when used in a low-temperature environment, the vapor chamber structure prevents the working fluid in the airtight chamber from freezing.Type: ApplicationFiled: March 20, 2023Publication date: May 16, 2024Inventors: Han-Min Liu, Wen-Qi Liu, Xing-Hui Li, Xiao-Xiang Zhou
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Patent number: 11976884Abstract: A flexible two-phase conversion heat transfer device includes a main body enclosing a chamber. A working liquid is received in the chamber. A capillary structure body is disposed in the chamber. The main body has at least one bellows section. The bellows section has multiple waved stripes. The waved stripes at least have a waved stripe feature including a waved stripe height or a waved stripe width or a waved stripe pitch between each two adjacent waved stripes. By means of the different waved stripe features, the main body is bendable by an angle ranging from 0-180 degrees without interference between the waved stripes.Type: GrantFiled: February 18, 2021Date of Patent: May 7, 2024Assignee: Asia Vital Components (China) Co., Ltd.Inventors: Han-Min Liu, Xiao-Xiang Zhou, Shi-Lei Wei
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Publication number: 20240125563Abstract: A fin structure includes an inlet fin assembly and an outlet fin assembly. The inlet fin assembly includes a plurality of inlet fins arranged side by side, and a first air channel is formed between two of the plurality of inlet fins that are adjacent to each other. The outlet fin assembly includes a plurality of outlet fins arranged side by side, and a second air channel is formed between two of the plurality of outlet fins that are adjacent to each other. The inlet fin assembly is connected to the outlet fin assembly, and the plurality of first air channels are in fluid communication with the plurality of second air channels. A thermal conductivity of the inlet fin assembly is greater than a thermal conductivity of the outlet fin assembly.Type: ApplicationFiled: February 10, 2023Publication date: April 18, 2024Applicant: VAST GLORY ELECTRONICS & HARDWARE & PLASTIC(HUI ZHOU) LTD.Inventors: Xue Mei WANG, Xiao Min ZHANG, Xiong ZHANG
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Publication number: 20240118435Abstract: A post-processed GNSS solution from raw GNSS data acquired from a vehicle and optionally other sources is dynamically calculated at the epoch level without using a Kalman filter. Instead, a plurality of GNSS processing methods is applied to each epoch in either the forward or backward direction and the most accurate solution for each epoch of the forward generated solution and backward generated solution is combined. The combined post-processed GNSS solution is determined based on which of the GNSS processing methods were used to generate an epoch of the forward solution and a corresponding epoch of the backward solution.Type: ApplicationFiled: January 30, 2023Publication date: April 11, 2024Applicant: Honeywell International Inc.Inventors: Yanling Min, Xiao Cao, Brian Schipper
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Publication number: 20240110751Abstract: A thin heat pipe including a thin heat pipe container, wick structure, working fluid, and vapor flow passage section is provided. The thin heat pipe container includes a lower inner wall and upper inner wall. The wick structure is disposed on the lower inner wall and includes a first wick structure portion connected to a second wick structure portion. The vapor flow passage section is configured for vapor to flow therethrough. A thickness of the second wick structure portion is lesser than a thickness of the first wick structure portion and the second wick structure portion does not contact, contact points between the upper inner wall and lower inner wall. The wick structure defines the vapor flow passage section. The first wick structure contacts the upper inner wall and second wick structure. Working fluid is pulled from vapor condenser sections to high temperature sections via the wick structure.Type: ApplicationFiled: September 26, 2023Publication date: April 4, 2024Inventors: Xue Mei WANG, Xiao Min ZHANG, HUA-YUAN LIN
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Publication number: 20240074114Abstract: A heat dissipation device includes a thermally-conductive base and at least one heat pipe. The thermally-conductive base has a heat absorbing surface, a heat dissipation surface and at least one accommodation hole. The heat dissipation surface faces away from the heat absorbing surface, and the at least one accommodation hole extends from the heat absorbing surface to the heat dissipation surface. The at least one heat pipe is located in the at least one accommodation hole and has a first surface and a second surface which are exposed to outside. The second surface faces away from the first surface, and the first surface and the heat dissipation surface are substantially coplanar and directly connected to each other so as to form a same plane together.Type: ApplicationFiled: November 10, 2022Publication date: February 29, 2024Applicant: VAST GLORY ELECTRONICS & HARDWARE & PLASTIC(HUI ZHOU) LTD.Inventors: Xue Mei WANG, Xiao Min ZHANG, Xianyao LIU
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Patent number: 11914937Abstract: Techniques, systems, and devices are described for providing a computational frame for estimating high-dimensional stochastic behaviors. In one exemplary aspect, a method for performing numerical estimation includes receiving a set of measurements of a stochastic behavior. The set of correlated measurements follows a non-standard probability distribution and is non-linearly correlated. Also, a non-linear relationship exists between a set of system variables that describes the stochastic behavior and a corresponding set of measurements. The method includes determining, based on the set of measurements, a numerical model of the stochastic behavior. The numerical model comprises a feature space comprising non-correlated features corresponding to the stochastic behavior. The non-correlated features have a dimensionality of M and the set of measurements has a dimensionality of N, M being smaller than N.Type: GrantFiled: February 13, 2023Date of Patent: February 27, 2024Assignees: LAWRENCE LIVERMORE NATIONAL SECURITY, LLC, VIRGINIA TECH INTELLECTUAL PROPERTIES, INC.Inventors: Xiao Chen, Can Huang, Liang Min, Charanraj Thimmisetty, Charles Tong, Yijun Xu, Lamine Mili
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Publication number: 20240001271Abstract: The disclosure relates to a particulate filter for the treatment of exhaust gas from an internal combustion engine, wherein the particulate filter comprises a functional material layer, and the amount of the functional material layer in the region which is around the whole central axis of the particulate filter and accounts for 11.1 vol. % of the total volume of the particulate filter, is in the range from 13 to 40 wt. %, based on the total weight of the functional material layer, relates to the process for preparing the particulate filter and relates to a method for the treatment of exhaust gas from an internal combustion engine. The particulate filter according to the present invention has a centralized-distributed functional material layer in the radial direction, shows excellent filtration efficiency and low backpressure.Type: ApplicationFiled: December 1, 2021Publication date: January 4, 2024Applicant: BASF CORPORATIONInventors: Jun Cong Jiang, Yun Fei Qi, Florian Waltz, Stephan Siemund, Ye Shen, Attilio Siani, Thomas Schmitz, Xiao Min Yin
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Publication number: 20240005005Abstract: An electronic device and a control method thereof are provided. The electronic device includes a read-only memory (ROM) that stores a first characteristic value of a public key. The control method includes the following steps: reading the public key and a plurality of boot codes of the electronic device from an external storage device; executing the boot codes; and verifying the public key according to the first characteristic value. The public key is used to verify the boot codes, and the number of bits of the first characteristic value is smaller than the number of bits of the public key. The ROM is disposed on a first chip, and the external storage device is disposed on a second chip.Type: ApplicationFiled: June 1, 2023Publication date: January 4, 2024Inventors: Qin-Wei She, Yan-Xiong Wu, Xiao-Min Zhang
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Publication number: 20230417491Abstract: A vapor chamber includes a first cover and a second cover. The first cover has a thermal contact surface. The thermal contact surface is configured to be thermally coupled to a heat source. The second cover and the first cover are joined together to form an air tight space. The air tight space is configured to accommodate a cooling fluid. The thermal contact surface faces away from the air tight space. The second cover has a first surface, a second surface and at least one first support protrusion structure. The first surface faces away from the first cover. The second surface faces the first cover. The at least one first support protrusion structure protrudes from the second surface of the second cover and is in physical contact with the first cover.Type: ApplicationFiled: October 3, 2022Publication date: December 28, 2023Applicant: COOLER MASTER (HUIZHOU) CO., LTD.Inventors: Xue Mei WANG, Xiao Min ZHANG, Xiong ZHANG
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Publication number: 20230408205Abstract: This disclosure relates to a vapor chamber configured to accommodate a cooling fluid. The vapor chamber includes a first cover, a second cover, a first capillary structure, and a second capillary structure. The second cover and the first cover are attached to each other to form a chamber therebetween. The chamber is configured to accommodate the cooling fluid. The first capillary structure is located in the chamber and stacked on the first cover. The second capillary structure is located in the chamber and stacked on the first capillary structure. The second capillary structure is different from the first capillary structure. A projection of the second capillary structure onto the first cover is smaller than a projection of the first capillary structure onto the first cover.Type: ApplicationFiled: August 31, 2023Publication date: December 21, 2023Applicant: VAST GLORY ELECTRONICS & HARDWARE & PLASTIC(HUI ZHOU) LTD.Inventors: Lei Lei LIU, Xiao Min ZHANG, Xue Mei WANG
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Publication number: 20230384039Abstract: A heat dissipating apparatus includes a carrier layer, a basal capillary layer and a capillary post. The carrier layer has a heat exchange surface and a carrier surface. The carrier surface faces away from the heat exchange surface. The basal capillary layer has a first surface and a second surface opposite to each other. The basal capillary layer is stacked on the carrier layer so that the first surface of the basal capillary layer contacts the carrier surface of the carrier layer. The capillary post protrudes from the second surface of the basal capillary layer.Type: ApplicationFiled: October 27, 2022Publication date: November 30, 2023Applicant: COOLER MASTER (HUIZHOU) CO., LTD.Inventors: Lei Lei LIU, Xiao Min ZHANG, Ding-Guo ZHOU, Xiong ZHANG
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Publication number: 20230382992Abstract: Provided herein are antibodies, or antigen-binding portions thereof, that bind to T-cell immunoglobulin and mucin-domain containing-3 (TIM3) protein. Also provided are uses of these antibodies, or antigen-binding portions thereof, in therapeutic applications, such as treatment of cancer. Further provided are cells that produce the antibodies, or antigen-binding portions thereof, polynucleotides encoding the heavy and/or light chain regions of the antibodies, or antigen-binding portions thereof, and vectors comprising the polynucleotides encoding the heavy and/or light chain regions of the antibodies, or antigen-binding portions thereof.Type: ApplicationFiled: February 27, 2023Publication date: November 30, 2023Applicant: Bristol-Myers Squibb CompanyInventors: Xiao Min SCHEBYE, Mark J. SELBY, Michelle Minhua HAN, Christine BEE, Andy X. DENG, Anan CHUNTHARAPAI, Brigitte DEVAUX, Huiming LI, Paul O. SHEPPARD, Alan J. KORMAN, Daniel F. ARDOUREL, Ekaterina DEYANOVA, Richard HUANG, Guodong CHEN, Michelle KUHNE, Hong-An TRUONG
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Patent number: 11788795Abstract: This disclosure relates to a vapor chamber configured to accommodate a cooling fluid. The vapor chamber includes a first cover, a second cover, a first capillary structure, and a second capillary structure. The second cover and the first cover are attached to each other to form a chamber therebetween. The chamber is configured to accommodate the cooling fluid. The first capillary structure is located in the chamber and stacked on the first cover. The second capillary structure is located in the chamber and stacked on the first capillary structure. The second capillary structure is different from the first capillary structure. A projection of the second capillary structure onto the first cover is smaller than a projection of the first capillary structure onto the first cover.Type: GrantFiled: June 11, 2020Date of Patent: October 17, 2023Assignee: VAST GLORY ELECTRONICS & HARDWARE & PLASTIC(HUI ZHOU) LTD.Inventors: Lei Lei Liu, Xiao Min Zhang, Xue Mei Wang
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Publication number: 20230300590Abstract: A fail-safe on-board unit, a movable device, and a control method for a vehicle which will automatically and reliably broadcast a distress signal to a rescue center in the event of accident includes in the on-board unit a first subscriber identity module (SIM), a second SIM, a main processor, a modem, a radio frequency (RF) switch module, and an antenna module with several antennas. The main processor selects the first SIM and / or the second SIM to make a call to generate a baseband signal, and outputs the baseband signal to the modem, the modem converts the baseband signal into an RF signal, and outputs the RF signal to the RF switch module to transmit outward via one or more antennas of the antenna module. The on-board unit has a wider network coverage to ensure higher success rate of emergency calls.Type: ApplicationFiled: February 6, 2023Publication date: September 21, 2023Inventors: FENG-YUAN LI, ZHI-CHENG YU, XIAO-MIN LIANG
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Publication number: 20230288148Abstract: The disclosure provides a manufacturing method of a flat heat exchanger. The manufacturing method includes flattening a round heat pipe to a flat heat pipe, welding a first part of the flat heat pipe, and welding a second part of the flat heat pipe. After welding the second part of the flat heat pipe, the manufacturing method further includes cutting off part(s) of the first part or the second part of the flat heat pipe and trimming the flat heat pipe. Before welding the first part or the second part of the flat heat pipe, there is no pipe shrinkage process performed on the flat heat pipe.Type: ApplicationFiled: May 18, 2023Publication date: September 14, 2023Inventors: Lei Lei LIU, Xiao Min ZHANG, Ding-Guo ZHOU
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Publication number: 20230213288Abstract: A three-dimensional heat transfer device includes a first thermally conductive casing, a second thermally conductive casing, a first capillary structure, a second capillary structure and a heat pipe. The second thermally conductive casing has a through hole. The second thermally conductive casing is mounted on the first thermally conductive casing so as to form a liquid-tight chamber. The first capillary structure is disposed on the first thermally conductive casing. The second capillary structure is disposed on the first thermally conductive casing. Projections of the first capillary structure and the second capillary structure on the outer surface and an extension surface of the outer surface are located in an extent of the outer surface, and the second capillary structure is located closer to the second thermally conductive casing than the second capillary structure. The heat pipe is disposed through the through hole and in contact with the second capillary structure.Type: ApplicationFiled: September 2, 2022Publication date: July 6, 2023Applicant: VAST GLORY ELECTRONICS & HARDWARE & PLASTIC(HUI ZHOU) LTD.Inventors: Xue Mei WANG, Xiao Min ZHANG
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Publication number: 20230174647Abstract: The present application relates to antibodies specifically binding to immunoglobulin-like transcript 4 (ILT4), which is also known as LILRB2, LIR2, MIR10, and CD85d, and corresponding nucleic acids, host cells, compositions, and uses. In some embodiments, the antibodies bind specifically to human ILT4, but do not significantly bind to ILT2, ILT3, or ILT5, or to other members of the LILRA or LILRB families.Type: ApplicationFiled: June 21, 2022Publication date: June 8, 2023Applicants: Five Prime Therapeutics, Inc., Bristol-Myers Squibb CompanyInventors: Xiao Min Schebye, Diana Yuhui Chen, Andrew Rankin, Xiaodi Deng, Joseph Toth, Linda Liang, Michelle Minhua Han, Christine Bee, Hong-An Truong, Mark J. Selby, Nils Lonberg, Guodong Chen, Richard Y. Huang, Ekaterina G. Deyanova, Alan J. Korman
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Publication number: 20230175788Abstract: A vapor chamber includes a first cover, a second cover, a sealing ring and a sealing plug. The first cover has a thermal contact surface. The second cover is coupled with the first cover so as to form an interior space together, and the second cover has a vent hole. The sealing ring has a channel and at least one opening. The opening is in fluid communication with the channel, the sealing ring is clamped between the first cover and the second cover, and the vent hole is in fluid communication with the interior space via the channel and the opening. The vent hole and the channel are plugged with the sealing plug so as to seal the interior space.Type: ApplicationFiled: August 11, 2022Publication date: June 8, 2023Applicant: COOLER MASTER CO., LTD.Inventors: Lei-Lei LIU, Xuemei WANG, Xiao-Min ZHANG, Hua-Yuan LIN
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Patent number: D982567Type: GrantFiled: July 2, 2021Date of Patent: April 4, 2023Assignee: Nanning FuLian FuGui Precision Industrial Co., Ltd.Inventors: Xiao-Min Liang, Zhi-Cheng Yu