Patents by Inventor Xiao-Qi Zhou
Xiao-Qi Zhou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240164059Abstract: A vapor chamber structure includes an aluminum upper plate, an aluminum lower plate, a working fluid and multiple micron-sized recesses. The aluminum upper plate has a first side and a second side. The aluminum lower plate has a third side and a fourth side. The aluminum upper and lower plates are correspondingly mated with each other to define an airtight chamber. The working fluid is filled in the airtight chamber. The micron-sized recesses are directly formed on the third side. The micron-sized recesses are upward raised and/or downward recessed from the third side in the form of multiple small puddles so as to enhance the boiling efficiency of the working fluid in the airtight chamber and promote liquid-vapor circulation performance of the vapor chamber. In addition, when used in a low-temperature environment, the vapor chamber structure prevents the working fluid in the airtight chamber from freezing.Type: ApplicationFiled: March 20, 2023Publication date: May 16, 2024Inventors: Han-Min Liu, Wen-Qi Liu, Xing-Hui Li, Xiao-Xiang Zhou
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Patent number: 7740921Abstract: A media sheet has a substrate with an image-receiving layer disposed thereon. The image-receiving layer has a first pigment having particles with a size of about 50 to about 400 nanometers, a second pigment having plate-like particles, and a third pigment that either having a porous structure with an oil absorption of about 50 to about 300 cubic centimeters of oil per 100 grams, or a porous structure comprising substantially non-porous particles.Type: GrantFiled: July 6, 2006Date of Patent: June 22, 2010Assignee: Hewlett-Packard Development Company, L.P.Inventors: Xiao-Qi Zhou, Hai Q Tran
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Patent number: 7618701Abstract: In one aspect of the present system and method, an electrophotographic media includes a porous base media and a bi-modal pigmented composition disposed on the porous media that provides an increased resistance to blistering during pigment fusing. The bi-modal pigment may include a first pigment and a second pigment, the first pigment including particles having acicular morphology, and the second pigment including substantially spherical particles.Type: GrantFiled: August 1, 2005Date of Patent: November 17, 2009Assignee: Hewlett-Packard Development Company, L.P.Inventor: Xiao-Qi Zhou
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Patent number: 7413796Abstract: The present invention is drawn to a media sheet for color electrophotographic printing. The media sheet can comprise a base stock having a first side and a second opposing side, base coating layers coated directly on the first side and the second side, and receiving layers coated directly on the base coating layers. The base coating layers can include inorganic pigments, a binder, and a charge control agent. The receiving layers can include inorganic pigments, a binder, and a discharge control agent. In one embodiment, the binder of the receiving layers can be hollow particle pigments.Type: GrantFiled: February 17, 2004Date of Patent: August 19, 2008Assignee: Hewlett-Packard Development Company, L.P.Inventors: Xiao-Qi Zhou, Richard J McManus
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Publication number: 20080008846Abstract: A media sheet has a substrate with an image-receiving layer disposed thereon. The image-receiving layer has a first pigment having particles with a size of about 50 to about 400 nanometers, a second pigment having plate-like particles, and a third pigment that either having a porous structure with an oil absorption of about 50 to about 300 cubic centimeters of oil per 100 grams, or a porous structure comprising substantially non-porous particles.Type: ApplicationFiled: July 6, 2006Publication date: January 10, 2008Inventors: Xiao-Qi Zhou, Hai Q. Tran
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Publication number: 20070026206Abstract: In one aspect of the present system and method, an electrophotographic media includes a porous base media and a bi-modal pigmented composition disposed on the porous media that provides an increased resistance to blistering during pigment fusing. The bi-modal pigment may include a first pigment and a second pigment, the first pigment including particles having acicular morphology, and the second pigment including substantially spherical particles.Type: ApplicationFiled: August 1, 2005Publication date: February 1, 2007Inventor: Xiao-Qi Zhou
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Publication number: 20050222323Abstract: A thermal interface composition is described herein that includes: a) at least two siloxane-based compounds; b) at least one inorganic micro-filler material; and c) at least one thermally conductive filler material. Additionally, a method of forming a thermal interface material is disclosed herein that includes: a) providing at least two siloxane-based compounds; b) providing at least one inorganic micro-filler material; c) providing at least one thermally conductive filler material; and d) combining the at least two siloxane-based compounds, the at least one inorganic micro-filler material and the at least one thermally conductive filler material.Type: ApplicationFiled: April 10, 2003Publication date: October 6, 2005Inventors: Xiao-Qi Zhou, Paula Knoll
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Publication number: 20050181185Abstract: The present invention is drawn to a media sheet for color electrophotographic printing. The media sheet can comprise a base stock having a first side and a second opposing side, base coating layers coated directly on the first side and the second side, and receiving layers coated directly on the base coating layers. The base coating layers can include inorganic pigments, a binder, and a charge control agent. The receiving layers can include inorganic pigments, a binder, and a discharge control agent. In one embodiment, the binder of the receiving layers can be hollow particle pigments.Type: ApplicationFiled: February 17, 2004Publication date: August 18, 2005Inventors: Xiao-Qi Zhou, Richard McManus
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Publication number: 20050148695Abstract: Compositions having high moisture resistance and flexibility comprise an organic component and a filler. The organic component comprises a long-chain cycloaliphatic epoxy resin, a short-chain cycloaliphatic epoxy resin, a cyanate ester, and a lewis acid catalyst. Preferably the organic component further comprises a bronsted acid co-catalyst and/or a flexibilizing modifier. The compositions are useful in various semiconductor applications, including as die attach adhesives, underfills, encapsulants, via fills, prepreg binders, polymer solder masks and polymer bumps on flip chip or BGA assemblies.Type: ApplicationFiled: January 13, 2005Publication date: July 7, 2005Inventors: Xiao-Qi Zhou, Henry Wevick, Nancy Iwamoto, Shao Li, Alan Grieve
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Patent number: 6844379Abstract: Compositions having high moisture resistance and flexibility comprise an organic component and a filler. The organic component comprises a long-chain cycloaliphatic epoxy resin, a short-chain cycloaliphatic epoxy resin, a cyanate ester, and a Lewis acid catalyst. Preferably the organic component further comprises a Bronsted acid co-catalyst and/or a flexibilizing modifier. The compositions are useful in various semiconductor applications, including as die attach adhesives, underfills, encapsulants, via fills, prepreg binders, polymer solder masks and polymer bumps on flip chip or BGA assemblies.Type: GrantFiled: November 19, 2002Date of Patent: January 18, 2005Assignee: Honeywell International Inc.Inventors: Xiao-Qi Zhou, Henry Wevick, Nancy Iwamoto, Shao Wei Li, Alan Grieve
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Publication number: 20030166746Abstract: Compositions having high moisture resistance and flexibility comprise an organic component and a filler. The organic component comprises a long-chain cycloaliphatic epoxy resin, a short-chain cycloaliphatic epoxy resin, a cyanate ester, and a lewis acid catalyst. Preferably the organic component further comprises a bronsted acid co-catalyst and/or a flexibilizing modifier. The compositions are useful in various semiconductor applications, including as die attach adhesives, underfills, encapsulants, via fills, prepreg binders, polymer solder masks and polymer bumps on flip chip or BGA assemblies.Type: ApplicationFiled: November 19, 2002Publication date: September 4, 2003Inventors: Xiao-Qi Zhou, Henry Wevick, Nancy Iwamoto, Shao Wei Li, Alan Grieve
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Patent number: 6489380Abstract: Compositions having high moisture resistance and flexibility comprise an organic component and a filler. The organic component comprises a long-chain cycloaliphatic epoxy resin, a short-chain cycloaliphatic epoxy resin, a cyanate ester, and a Lewis acid catalyst. Preferably the organic component further comprises a Bronsted acid co-catalyst and/or a flexibilizing modifier. The compositions are useful in various semiconductor applications, including as die attach adhesives, underfills, encapsulants, via fills, prepreg binders, polymer solder masks and polymer bumps on flip chip or BGA assemblies.Type: GrantFiled: April 27, 2000Date of Patent: December 3, 2002Assignee: Johnson Matthey Electronics, Inc.Inventors: Xiao-Qi Zhou, Henry Wevick, Nancy E. Iwamoto, Shao Wei Li, Alan Grieve
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Patent number: 6312621Abstract: A via fill formulation including electrically and/or thermally conductive particulate filler, or non-conductive, electrically conductive polymer and a resin vehicle.Type: GrantFiled: November 12, 1999Date of Patent: November 6, 2001Assignee: Johnson Matthey Electronics, Inc.Inventors: Jesse L. Pedigo, Nancy E. Iwamoto, Alan Grieve, Xiao-Qi Zhou
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Patent number: 6242513Abstract: Compositions having high moisture resistance and flexibility comprise an organic component and a filler. The organic component comprises a long-chain cycloaliphatic epoxy resin, a short-chain cycloaliphatic epoxy resin, a cyanate ester, and a Lewis acid catalyst. Preferably the organic component further comprises a Bronsted acid co-catalyst and/or a flexibilizing modifier. The compositions are useful in various semiconductor applications, including as die attach adhesives, underfills, encapsulants, via fills, prepreg binders, polymer solder masks and polymer bumps on flip chip or BGA assemblies.Type: GrantFiled: October 12, 1999Date of Patent: June 5, 2001Assignee: Johnson Matthey Electronics, Inc.Inventors: Xiao-Qi Zhou, Henry Wevick, Nancy E. Iwamoto, Shao Wei Li, Alan Grieve
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Patent number: 6057402Abstract: Compositions having high moisture resistance and flexibility comprise an organic component and a filler. The organic component comprises a long-chain cycloaliphatic epoxy resin, a short-chain cycloaliphatic epoxy resin, a cyanate ester, and a Lewis acid catalyst. Preferably the organic component further comprises a Bronsted acid co-catalyst and/or a flexibilizing modifier. The compositions are useful in various semiconductor applications, including as die attach adhesives, underfills, encapsulants, via fills, prepreg binders, polymer solder masks and polymer bumps on flip chip or BGA assemblies.Type: GrantFiled: August 12, 1998Date of Patent: May 2, 2000Assignee: Johnson Matthey, Inc.Inventors: Xiao-Qi Zhou, Henry Wevick, Nancy E. Iwamoto, Shao Wei Li, Alan Grieve