Abstract: A soft pressure sensing apparatus is provided. In one aspect of the present pressure sensing apparatus, a polymeric member, including conductive particles therein, is located between offset angled and crossing sets of electrodes. A further aspect includes a controller configured to calculate at least one regularized least-squares algorithm, to reduce cross-talk between the resistive members. In another aspect, a pressure sensor apparatus includes a piezoresistive film encapsulated between layers of substantially perpendicular electrodes to create a resistor network circuit where the ability to reconstruct cell resistance from measured two-point resistance. A method of manufacturing a pressure sensor includes using a mechanical vinyl cutter for the electrodes and/or piezoelectric resistive members.

Abstract: A computer implemented method processes a query. A number of processor units processes the query to identify a result set in response to receiving the query from a first client. The number of processor units stores, the result set in a shared cache assigned to a group of clients, wherein result set stored in the shared cache is accessible by the group of clients. The number of processor units returns the result set to a second client in the group of clients from the shared cache in response to receiving the query from the second client in the group of clients.

Abstract: Disclosed are techniques for relational database locks based on columns. Database transactions may be targeted to specific columns of one or more records, instead of the entire row for those records, using primary keys. Column locks on specific keys are stored separately than column locks on ranges of keys, which are both checked when requesting a new column lock for either a single key or a range of keys. When a threshold number of columns for a given record, or range of records/keys, have been locked, the column locks for that record, or range of records, can be combined into a single row level lock to reduce resource costs for maintaining multiple concurrent locks.

Abstract: A semiconductor device includes a semiconductor substrate, a word line trench and a word line structure. The word line trench includes a first word line trench and a second word line trench. The word line structure includes a first word line structure part and a second word line structure part connected to each other. The first word line structure part is formed in the first word line trench, and the second word line structure part is formed in the second word line trench; and the first word line structure part includes an avoidance region, and the top surface of the avoidance region is aligned with the top surface of the second word line structure part, and the avoidance region is provided with insulating material.

Abstract: A method for manufacturing the semiconductor structure includes: a substrate is provided; isolation structures having a first depth are formed in the substrate; word line structures having a second depth are formed in the substrate, where part of the word line structures are formed in respective ones of the isolation structures, and the second depth is less than the first depth; the isolation structures are etched in a direction perpendicular to the substrate to form a first trench having a third depth in each isolation structure; and a first insulating layer covering the word line structures and the first trenches is formed on the substrate to form an air gap structure in each isolation structure.

Abstract: A manufacturing method of the semiconductor structure includes: providing a semiconductor substrate, and forming a gate region and a source-drain region on the semiconductor substrate; forming an insulating dielectric layer which covers both of the gate region and the source-drain region; patterning the insulating dielectric layer on the source-drain region to form a first contact hole exposing the source-drain region; forming a metal silicide at the bottom of the first contact hole; patterning the insulating dielectric layer on the gate region to form a second contact hole of which an orthographic projection on the semiconductor substrate is located on the gate region; and forming a filling layer in the first contact hole and the second contact hole.

Abstract: A cleaning method includes: providing a wafer, the wafer having a wafer edge; and controlling the wafer in a rotation phase to rotate the wafer, and providing a cleaning solution for the wafer edge in the rotation phase. The rotation phase includes a first rotation phase and/or a second rotation phase. A rotation speed of the wafer increases from a first speed to a second speed during the first rotation phase, and the rotation speed of the wafer decreases from the second speed to the first speed during the second rotation phase. The second speed is greater than the first speed.

Abstract: A system of the present invention includes a server that distributes files to a plurality of receivers within a wireless communication system. The server and the plurality of receivers are components of the wireless communication system network infrastructure. In one embodiment, the server is a base station manager and the receivers are base stations. In operation, the sender establishes a multicast session with the plurality of receivers by interacting with the plurality of receivers. The sender subdivides the file(s) into a plurality of data packets and multicasts the plurality of data packets to the plurality of receivers. At least some of the plurality of receivers fails to receive some of the plurality of data packets. Receivers failing to receive some or all of the plurality of data packets error report to the sender of the file. The sender then retransmits a plurality of unreceived data packets of the plurality of data packets to the error-reporting receivers.