Abstract: A system and method for clean and low-carbon in-situ disposal of waste incineration fly ash includes a waste incineration system and a fly ash disposal system. The fly ash disposal system includes a water washing system, an MVR system, and a dioxin removal system. The water washing system includes a water washing device and a press filtering device. The dioxin removal system includes a heating device, an activated carbon adsorption device, and a heat pump system. The MVR system includes a crystallizer, a heater, a vapor compressor, and other equipment. The waste incineration system is coupled with the fly ash disposal system nearby to achieve in-situ disposal of fly ash, avoiding the logistics cost and secondary pollution problems of long-distance transportation of fly ash, and greatly reducing energy and water resource consumption.

Abstract: Apparatuses, methods, and systems are disclosed for efficient cross-carrier scheduling of multiple slots. One apparatus includes a transceiver and a processor coupled with the transceiver, the processor configured to cause the apparatus to transmit a first control signal to a remote unit, the first control signal indicating a maximum number of HARQ processes, and to transmit a second control signal to the remote unit, where the second control signal is transmitted on a first carrier and where the second control signal schedules a first number of slots on a second carrier. The processor aggregates every two or more of the scheduled first number of slots to a single HARQ process in response to the first number being larger than the maximum number of HARQ processes.

Abstract: This invention in one aspect relates to a mixed-kernel heterojunction transistor, comprising a monolayer film formed of an atomically thin material, and a network of carbon nanotubes (CNTs) vertically stacked over the monolayer film to define an overlap region of the CNT network with the monolayer film, and non-overlap regions of the monolayer film and the CNT network, wherein the overlap region is a mixed-kernel van der Waals heterojunction.

Abstract: A cell handover method, a terminal device, and a network device are provided. The method includes: sending Secondary Cell Group (SCG) suspend status information to a target node. The SCG suspend status information is used for indicating that a User Equipment (UE) is in an SCG suspended state.

Abstract: A method for audio signal noise cancellation is provided. In response to current noise cancellation coefficients being required to be updated to new noise cancellation coefficients, the digital signal processor calculates the new noise cancellation coefficients and writes the new noise cancellation coefficients into an idle storage module in the at least two storage modules, and the digital signal processor sends an update request for updating the noise cancellation coefficients to the active noise cancellation module. The update request carries position information configured to indicate a position of the storage module to which the new noise cancellation coefficients is written.

Abstract: A method for audio signal noise cancellation is provided. In response to current noise cancellation coefficients being required to be updated to new noise cancellation coefficients, the digital signal processor calculates the new noise cancellation coefficients and writes the new noise cancellation coefficients into an idle storage module in the at least two storage modules, and the digital signal processor sends an update request for updating the noise cancellation coefficients to the active noise cancellation module. The update request carries position information configured to indicate a position of the storage module to which the new noise cancellation coefficients is written.

Abstract: A cleaning composition and process for cleaning post-chemical mechanical polishing (CMP) residue and contaminants from a microelectronic device having said residue and contaminants thereon. The cleaning compositions include novel corrosion inhibitors. The composition achieves highly efficacious cleaning of the post-CMP residue and contaminant material from the surface of the microelectronic device without compromising the low-k dielectric material or the copper interconnect material.

Abstract: A cleaning composition and process for cleaning post-chemical mechanical polishing (CMP) residue and contaminants from a microelectronic device having said residue and contaminants thereon. The cleaning compositions include novel corrosion inhibitors. The composition achieves highly efficacious cleaning of the post-CMP residue and contaminant material from the surface of the microelectronic device without compromising the low-k dielectric material or the copper interconnect material.

Abstract: A cleaning composition and process for cleaning post-chemical mechanical polishing (CMP) residue and contaminants from a microelectronic device having said residue and contaminants thereon. The cleaning compositions include novel corrosion inhibitors. The composition achieves highly efficacious cleaning of the post-CMP residue and contaminant material from the surface of the microelectronic device without compromising the low-k dielectric material or the copper interconnect material.